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Showing below up to 250 results in range #41 to #290.

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  1. PECVD1 Operating Instructions.pdf‏‎ (1 revision)
  2. Older Publications‏‎ (1 revision)
  3. YES Recipe Screenshots: STD-N2-O2‏‎ (1 revision)
  4. Advanced PECVD Recipes‏‎ (1 revision)
  5. Wafer coating procedure‏‎ (1 revision)
  6. LegacyTable‏‎ (1 revision)
  7. Test Data of etching SiO2 with CHF3/CF4/O2‏‎ (2 revisions)
  8. Test Page‏‎ (2 revisions)
  9. GCA 6300 training manual -old instructions‏‎ (2 revisions)
  10. PECVD1-SIN Standard Recipe (PlasmaTherm 790)‏‎ (2 revisions)
  11. Process Group - Lab Stocking/Supplies Tasks‏‎ (2 revisions)
  12. Molecular Vapor Deposition Recipes‏‎ (2 revisions)
  13. THz Physics Presentations‏‎ (2 revisions)
  14. E-Beam Lithography Recipes‏‎ (2 revisions)
  15. Video Training: Uploading to GauchoCast/Panopto (Internal)‏‎ (2 revisions)
  16. Surfscan photo‏‎ (2 revisions)
  17. Thermal Evaporator 2‏‎ (2 revisions)
  18. Michael Barreraz‏‎ (2 revisions)
  19. Plasma Clean (Gasonics 2000)‏‎ (2 revisions)
  20. ASML Stepper 3: Wafer Handler Reset Procedure‏‎ (2 revisions)
  21. SPR220-7 at 3kW various temperature without N2 gas‏‎ (2 revisions)
  22. Main Page mod‏‎ (2 revisions)
  23. Exposing a wafer piece‏‎ (2 revisions)
  24. Unaxis SiN100C 300nm-2019‏‎ (2 revisions)
  25. Surfscan6200 photos‏‎ (2 revisions)
  26. Autostep 200 Old training manual‏‎ (2 revisions)
  27. Errors‏‎ (2 revisions)
  28. SiO2 Etching Test using CF4/CHF3‏‎ (2 revisions)
  29. CDE ResMap Quick-Start instructions‏‎ (2 revisions)
  30. ASML 5500: Choose Marks for Prealignment‏‎ (2 revisions)
  31. Stepper 2 (Autostep 200) - Table of Chucks, Shims, Target Thicknesses‏‎ (2 revisions)
  32. E-Beam 5 (Plasys)‏‎ (2 revisions)
  33. ADT 7100 - Recovering an Old Recipe (2019)‏‎ (2 revisions)
  34. Stepper 2 (Autostep 200) - Chuck Selection‏‎ (2 revisions)
  35. Strip Annealer‏‎ (2 revisions)
  36. MVD - Wafer Coating - Process Traveler‏‎ (3 revisions)
  37. ASML Stepper 3 Dicing Guide Programming‏‎ (3 revisions)
  38. Vacuum Sealer‏‎ (3 revisions)
  39. ADT UV-Tape Table 1042R‏‎ (3 revisions)
  40. Ellipsometer (Woollam) - Measuring thin metals with oxide pre-measurement‏‎ (3 revisions)
  41. PECVD1-SiN standard recipe.pdf‏‎ (3 revisions)
  42. Test Data of Etching SiO2 with CHF3/CF4-Florine ICP Etcher‏‎ (3 revisions)
  43. Test Data of etching SiO2 with CHF3/CF4-Florine ICP Etcher‏‎ (3 revisions)
  44. Logitech WBS7 - Procedure for Wax Mounting with Spin-On Crystalbond‏‎ (3 revisions)
  45. Ellipsometer (Rudolph)‏‎ (3 revisions)
  46. DS-K101-304 Bake Temp. versus Develop Rate‏‎ (3 revisions)
  47. MLA Recipes‏‎ (3 revisions)
  48. Gold surface oxidation (darkening) due to O2/N2 plasma; the need for O2 only recipe.‏‎ (3 revisions)
  49. Wire Saw (Takatori)‏‎ (3 revisions)
  50. Vacuum Oven (YES)‏‎ (3 revisions)
  51. Mike Day‏‎ (3 revisions)
  52. ASML 5500: Recovering from a Typo in Reticle ID‏‎ (3 revisions)
  53. Vapor HF Etch (uETCH)‏‎ (3 revisions)
  54. Nanofab New User Onboarding‏‎ (3 revisions)
  55. Sputter 1 (Custom)‏‎ (3 revisions)
  56. Nick test‏‎ (3 revisions)
  57. Foong Fatt‏‎ (3 revisions)
  58. Video Training: Hosting with Zoom and GacuhoCast/Panopto‏‎ (3 revisions)
  59. Glossary‏‎ (3 revisions)
  60. User Accessible Commands‏‎ (3 revisions)
  61. Claudia Gutierrez‏‎ (4 revisions)
  62. Suss MA-6 Backside Alignment QuickStart‏‎ (4 revisions)
  63. Gold Plating Bench‏‎ (4 revisions)
  64. GCA 6300 Reboot Procedures‏‎ (4 revisions)
  65. Electronics Presentations‏‎ (4 revisions)
  66. Tube Furnace AlGaAs Oxidation (Lindberg)‏‎ (4 revisions)
  67. MLA150 - Large Image GDS Generation‏‎ (4 revisions)
  68. Vraj Mehalana‏‎ (4 revisions)
  69. Wafer Scanning process Traveler‏‎ (4 revisions)
  70. ASML DUV: Edge Bead Removal via Photolithography‏‎ (4 revisions)
  71. Laser Etch Monitor Simulation in Python‏‎ (4 revisions)
  72. Filmetrics F10-RT-UVX Operating Procedure‏‎ (4 revisions)
  73. Critical Point Dryer‏‎ (4 revisions)
  74. Test Data of etching SiO2 with CHF3/CF4-Florine‏‎ (4 revisions)
  75. Photolithography - Improving Adhesion Photoresist Adhesion‏‎ (4 revisions)
  76. KLA Tencor P7 - Basic profile instructions‏‎ (4 revisions)
  77. Jack Whaley‏‎ (4 revisions)
  78. Peder Lenvik‏‎ (4 revisions)
  79. Sputter 2 (SFI Endeavor)‏‎ (5 revisions)
  80. Goniometer (Rame-Hart A-100) - Operating Procedure‏‎ (5 revisions)
  81. PubList2018‏‎ (5 revisions)
  82. Thermal Evaporator 1‏‎ (5 revisions)
  83. Lift-Off with I-Line Imaging Resist + LOL2000 Underlayer‏‎ (5 revisions)
  84. Tino Sy‏‎ (5 revisions)
  85. Old Training Manual‏‎ (5 revisions)
  86. News Feed‏‎ (5 revisions)
  87. Spin Rinse Dryer (SemiTool)‏‎ (5 revisions)
  88. Old Deposition Data - 2021-12-15‏‎ (5 revisions)
  89. Mechanical Polisher (Allied)‏‎ (5 revisions)
  90. Olympus LEXT OLS4000 Confocal uScope - Quick Start‏‎ (6 revisions)
  91. S-Cubed Flexi - Operating Procedure‏‎ (6 revisions)
  92. Tube Furnace Wafer Bonding (Thermco)‏‎ (6 revisions)
  93. MLA150 - CAD Files and Templates‏‎ (6 revisions)
  94. Photonics Presentations‏‎ (6 revisions)
  95. E-BEAM‏‎ (6 revisions)
  96. Optical Film Thickness (Filmetrics)‏‎ (6 revisions)
  97. Wafer Cleaver (PELCO Flip-Scribe)‏‎ (6 revisions)
  98. Luis Zuzunaga‏‎ (6 revisions)
  99. Automated Wafer Cleaver (Loomis LSD-155LT)‏‎ (6 revisions)
  100. Digital Microscope (Olympus DSX1000)‏‎ (6 revisions)
  101. PECV1 Wafer Coating Process Traveler‏‎ (7 revisions)
  102. Stocked Chemical List‏‎ (7 revisions)
  103. Ovens 1, 2 & 3 (Labline)‏‎ (7 revisions)
  104. NanoFab Process Group‏‎ (7 revisions)
  105. Autostep 200 User Accessible Commands‏‎ (7 revisions)
  106. Wafer Scanning/Coating Process Traveler ( combined/less detailed)‏‎ (7 revisions)
  107. Optical Film Thickness & Wafer-Mapping (Filmetrics F50)‏‎ (7 revisions)
  108. Probe Station: I-V Curves with Keithley 2400 and Python Script‏‎ (7 revisions)
  109. PECVD1-(PlasmaTherm 790)‏‎ (7 revisions)
  110. GCA Old full training manual‏‎ (7 revisions)
  111. Bill Millerski‏‎ (7 revisions)
  112. Deposition Data - temporary 2021-12-15‏‎ (7 revisions)
  113. High Temp Oven (Blue M)‏‎ (7 revisions)
  114. ADT 7100 - Initial Setup Before Cutting‏‎ (7 revisions)
  115. RIE 1 (Custom)‏‎ (7 revisions)
  116. Dan Read‏‎ (7 revisions)
  117. Programming a Job‏‎ (7 revisions)
  118. Flip-Chip Bonder (Finetech)‏‎ (7 revisions)
  119. Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)‏‎ (7 revisions)
  120. Resistivity Mapper (CDE RESMAP)‏‎ (8 revisions)
  121. Filmetrics F40-UV Quick Start‏‎ (8 revisions)
  122. FIJI - Microscope Measurement Tools‏‎ (8 revisions)
  123. SEM Sample Coater (Hummer)‏‎ (8 revisions)
  124. ASML 5500: Recovering from an Error‏‎ (8 revisions)
  125. Focused Ion-Beam Lithography (Raith Velion)‏‎ (8 revisions)
  126. Nano-Imprint (Nanonex NX2000)‏‎ (9 revisions)
  127. SEM 1 (JEOL IT800SHL)‏‎ (9 revisions)
  128. Process Group - Billing Instructions‏‎ (9 revisions)
  129. Old Deposition Data - NastaziaM 2021-11-22‏‎ (9 revisions)
  130. Fluorescence Microscope (Olympus MX51)‏‎ (9 revisions)
  131. Photoluminescence PL Setup (Custom)‏‎ (9 revisions)
  132. GCA 6300 Mask Making Guidance‏‎ (9 revisions)
  133. Oven 4 (Thermo-Fisher HeraTherm)‏‎ (9 revisions)
  134. Optical Film Thickness (Nanometric)‏‎ (9 revisions)
  135. Holographic Lith/PL Setup (Custom)‏‎ (9 revisions)
  136. Bill Mitchell‏‎ (9 revisions)
  137. YES-150C-Various-Resists‏‎ (9 revisions)
  138. KLA Tencor P7 - Saving Profile Data‏‎ (9 revisions)
  139. Ashers (Technics PEII)‏‎ (9 revisions)
  140. Photolithography - Manual Edge-Bead Removal Techniques‏‎ (10 revisions)
  141. Unaxis wafer coating procedure‏‎ (10 revisions)
  142. Measurements and Imaging with Amscope Camera - Quickstart Usage Guide‏‎ (10 revisions)
  143. InP Etch Test Result in Details‏‎ (10 revisions)
  144. Wafer Coating Process Traveler1‏‎ (10 revisions)
  145. Intellemetrics Laser Etch Monitor Procedure for Panasonic ICP Etchers‏‎ (10 revisions)
  146. GCA 6300 USer Accessible Commands‏‎ (10 revisions)
  147. Ning Cao‏‎ (10 revisions)
  148. CC-PRIME OnBoarding 2022-08‏‎ (10 revisions)
  149. Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick‏‎ (10 revisions)
  150. IBD: Calibrating Optical Thickness‏‎ (10 revisions)
  151. Adam Abrahamsen‏‎ (10 revisions)
  152. UV Ozone Reactor‏‎ (11 revisions)
  153. Deep UV Optical Microscope (Olympus)‏‎ (11 revisions)
  154. Homepage Draft1‏‎ (11 revisions)
  155. KLayout Design Tips‏‎ (11 revisions)
  156. IR Aligner (SUSS MJB-3 IR)‏‎ (11 revisions)
  157. Step Profilometer (KLA Tencor P-7)‏‎ (11 revisions)
  158. Chemical-Mechanical Polisher (Logitech)‏‎ (12 revisions)
  159. Chemical List‏‎ (12 revisions)
  160. Nanofab Job Postings‏‎ (12 revisions)
  161. Brian Thibeault‏‎ (12 revisions)
  162. Process Group - Remote Fabrication Jobs‏‎ (12 revisions)
  163. Ovens - Overview of All Lab Ovens‏‎ (12 revisions)
  164. Molecular Vapor Deposition‏‎ (12 revisions)
  165. Wafer Bonder (SUSS SB6-8E)‏‎ (12 revisions)
  166. YES-SPR220-Various-Temps‏‎ (12 revisions)
  167. Film Stress (Tencor Flexus)‏‎ (12 revisions)
  168. InP etch result in details‏‎ (13 revisions)
  169. Field Emission SEM 2 (JEOL IT800SHL)‏‎ (13 revisions)
  170. Step Profilometer (DektakXT)‏‎ (14 revisions)
  171. Lee Sawyer‏‎ (14 revisions)
  172. Unaxis VLR Etch - Process Control Data‏‎ (15 revisions)
  173. ASML Stepper 3 - UCSB Test Reticles‏‎ (15 revisions)
  174. Laser Etch Monitoring‏‎ (15 revisions)
  175. ASML Stepper 3 Standard Operating Procedure‏‎ (15 revisions)
  176. PECVD1 Wafer Coating Process Traveler‏‎ (16 revisions)
  177. DUV Flood Expose‏‎ (16 revisions)
  178. E-Beam Lithography System (JEOL JBX-6300FS)‏‎ (16 revisions)
  179. Test Data of etching SiO2 with CHF3/CF4/O2 (using this recipe only for Fluorine etch of the underneath layer)‏‎ (16 revisions)
  180. Plasma Activation (EVG 810)‏‎ (17 revisions)
  181. XeF2 Etch (Xetch)‏‎ (17 revisions)
  182. Main Page‏‎ (17 revisions)
  183. Thermal Processing Recipes‏‎ (18 revisions)
  184. Atomic Force Microscope (Bruker ICON)‏‎ (18 revisions)
  185. Sputter 5 (AJA ATC 2200-V)‏‎ (18 revisions)
  186. Wafer Bonder (Logitech WBS7)‏‎ (18 revisions)
  187. MLA150 - Design Guidelines‏‎ (18 revisions)
  188. Laser Scanning Confocal M-scope (Olympus LEXT)‏‎ (18 revisions)
  189. Process Group - Process Control Data‏‎ (19 revisions)
  190. Filmetrics F40-UV Microscope-Mounted‏‎ (19 revisions)
  191. Tech Talks Seminar Series‏‎ (19 revisions)
  192. Troubleshooting and Recovery‏‎ (19 revisions)
  193. Oven 5 (Labline)‏‎ (19 revisions)
  194. Probe Station & Curve Tracer‏‎ (19 revisions)
  195. Oxford ICP Etcher (PlasmaPro 100 Cobra)‏‎ (19 revisions)
  196. UCSB NanoFab Microscope Training‏‎ (19 revisions)
  197. Automated Coat/Develop System (S-Cubed Flexi)‏‎ (19 revisions)
  198. Lift-Off with DUV Imaging + PMGI Underlayer‏‎ (19 revisions)
  199. Brian Lingg‏‎ (20 revisions)
  200. Tom Reynolds‏‎ (20 revisions)
  201. Sputter 4 (AJA ATC 2200-V)‏‎ (20 revisions)
  202. IR Thermal Microscope (QFI)‏‎ (20 revisions)
  203. Rapid Thermal Processor (SSI Solaris 150)‏‎ (20 revisions)
  204. RIE 5 (PlasmaTherm)‏‎ (20 revisions)
  205. Rapid Thermal Processor (AET RX6)‏‎ (20 revisions)
  206. DSEIII (PlasmaTherm/Deep Silicon Etcher)‏‎ (21 revisions)
  207. Plasma Clean (YES EcoClean)‏‎ (21 revisions)
  208. Autostep 200 Mask Making Guidance‏‎ (21 revisions)
  209. GoPro Hero8 Black (Internal)‏‎ (21 revisions)
  210. RIE 2 (MRC)‏‎ (22 revisions)
  211. Wafer Coating Process Traveler‏‎ (23 revisions)
  212. CAIBE (Oxford Ion Mill)‏‎ (23 revisions)
  213. Suss Aligners (SUSS MJB-3)‏‎ (24 revisions)
  214. DUMMY TOOL‏‎ (24 revisions)
  215. Don Freeborn‏‎ (24 revisions)
  216. Mike Silva‏‎ (25 revisions)
  217. Biljana Stamenic‏‎ (25 revisions)
  218. Usage Data and Statistics‏‎ (25 revisions)
  219. Ellipsometer (Woollam)‏‎ (25 revisions)
  220. Demis D. John‏‎ (25 revisions)
  221. Sputter 3 (AJA ATC 2000-F)‏‎ (26 revisions)
  222. Stepper 1 (GCA 6300) - Standard Operating Procedure‏‎ (26 revisions)
  223. Aidan Hopkins‏‎ (26 revisions)
  224. PECVD1 Wafer Coating Process‏‎ (27 revisions)
  225. Tony Bosch‏‎ (28 revisions)
  226. ICP-Etch (Unaxis VLR)‏‎ (29 revisions)
  227. Services‏‎ (30 revisions)
  228. Other Dry Etching Recipes‏‎ (30 revisions)
  229. Vapor HF Etch‏‎ (30 revisions)
  230. Atomic Layer Deposition (Oxford FlexAL)‏‎ (30 revisions)
  231. HF Vapor Etch‏‎ (31 revisions)
  232. RIE 3 (MRC)‏‎ (31 revisions)
  233. Stepper 2 (AutoStep 200) Operating Procedures‏‎ (32 revisions)
  234. Tube Furnace (Tystar 8300)‏‎ (34 revisions)
  235. Test Data of Etching SiO2 with CHF3/CF4-Fluorine ICP Etcher‏‎ (34 revisions)
  236. Old training manual‏‎ (34 revisions)
  237. Packaging Recipes‏‎ (36 revisions)
  238. ASML Stepper 3 Error Recovery, Troubleshooting and Calibration‏‎ (38 revisions)
  239. Ion Beam Deposition (Veeco NEXUS)‏‎ (39 revisions)
  240. COVID-19 User Policies‏‎ (40 revisions)
  241. Contact Aligner (SUSS MA-6)‏‎ (40 revisions)
  242. Atomic Layer Deposition Recipes‏‎ (40 revisions)
  243. RIE Etching Recipes‏‎ (40 revisions)
  244. Oxygen Plasma System Recipes‏‎ (41 revisions)
  245. Lab Rules‏‎ (42 revisions)
  246. MLA150 - Troubleshooting‏‎ (44 revisions)
  247. Research‏‎ (44 revisions)
  248. Dicing Saw (ADT)‏‎ (46 revisions)
  249. Maskless Aligner (Heidelberg MLA150)‏‎ (46 revisions)
  250. Lab Rules OLD 2018‏‎ (47 revisions)

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