Plasma Clean (Gasonics 2000)
The Aura 2000 system is a microwave downstream asher used for the removal of resist and other organic materials. Samples are loaded onto 8” carrier wafers into the system. Samples can be heated from 100C to above 350C by heat lamps, while being exposed to microwave-cracked oxygen to remove organic materials. The microwave excitation of the oxygen is done downstream from the chamber and the reactive oxygen flows through a showerhead to expose the sample, thus completely eliminating ion bombardment. Resist etch rates of several microns per minute can be achieved and is also effective on fluorine and chlorine plasma exposed resist.