ADT 7100 - Initial Setup Before Cutting

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Install Your Blade and Flange

  1. Right click on the blade icon in the lower left corner of the screen and select 'Blade Change'.
  2. Open the dicing saw cover and place the interlock defeating key in the door interlock.
  3. Grab your blade/flange (with the grabbing tool or hand) and CAREFULLY place it onto the spindle. This should require very little force. If the flange doesn't easily slide onto the spindle please contact me immediately.
  4. Once you have installed your blade and flange onto the spindle you must secure it with the lock nut. To do this, line up any of the two holes on the lock nut with the two pins on the two piece torque wrench tool. Hold the back part of the wrench in place with one hand and turn the front part of the wrench clockwise with the other hand. Once the lock nut is hand tight you'll have to crank on the torque wrench until you hear a click. That should be the appropriate amount of torque to keep the flange on the spindle.
  5. From the 'Blade Selection' drop down menu, choose blade you just installed. If you are using a different flange diameter from the one selected in the software click the 'Change Flange' box and manually enter in the new flange diameter. Click 'Done' and then click 'Finish' in the lower left dialogue box.
  6. DO NOT STICK YOUR HANDS INTO THE SYSTEM! The saw will eventually start to rotate and go through its blade exposure measurement sequence.
  7. Once it says 'Blade change completed' inside the dialogue box you can check the three water sources.

Adjust the Cut Water

  1. BE EXTREMELY CAREFUL! The spindle is still rotating! Carefully pull the spindle cover lock to the left and open the spindle cover.
  2. Press the 'Water Adjust' to turn on the three different water sources. Verify that the Cut water is being forked by the blade (you should see a stream of water in front of the blade and one behind it). The Cut water should be hitting the blade/flange at approximately 7pm if the blade was a clock. If adjustments are needed, you can move the Cut water nozzle by holding the knob behind the nozzle with one hand and turning the top knob above counter clockwise. This will unlock the Cut water nozzle and give you free range of motion. Make sure you do not rotate the Cut water nozzle up into the blade! Once the Cut water looks good you can lock it in place by turning the top knob clockwise until it's tight.
  3. Verify that the flow rates of the Cut water, Clean jets, and Spray bars are 0.9 LPM, 0.8 LPM, and 0.8 LPM respectively. You can turn down the flow rates by adjusting the three small regulator knobs below the computer monitor. Just make sure to return the flow rates to their default values before ending your dicing session.
  4. Once the water situation looks good you can right click on the spindle speedometer in the top right of the screen and choose 'Operate'. This will turn the spindle off. Once the spindle has reached 0 RPM you can pull the interlock key and close the dicing saw cover.

Initialize System

  1. After your initial blade change you must go to User =>System Init. This will initialize the chuck and saw and get the system ready to accept your sample.
  2. Once, the screen stops flashing yellow you can choose one of two routes. You can either create or load a recipe or load your sample.

Create a Recipe

  1. To create a recipe, click on the book icon (Programming Workspace).
  2. In order to create a recipe in the software you must duplicate an old recipe. You can either duplicate a group/company member's recipe or open the 'RECIPES' folder on the left hand side of the software and select 'Recipe_APC'.
  3. Click 'Duplicate Recipe' and create a recipe name. Make sure you save your recipe in any other folder besides the 'RECIPES' folder. You can either find your folder by using the drop down menu or you can create a new folder name by typing into the 'Folder' box. Click 'Ok'.
  4. Five parameters you need to enter on your "homepage" are: blade (double click entry box to access drop down menu), wafer width and length (make sure orientation is correct if you're dicing a rectangular or elongated sample).
  5. Click on the 'General' tab on the top left part of the recipe window.
  6. Four parameters you need to enter are 'cut speed', 'overtravel', 'spindle speed', and 'height check rate'. For cut speed (how fast the saw travels across your sample), there are ranges developed here at UCSB which are posted on the wall to the left of the saw. As a general rule of thumb start on the slower side of the range and verify cut quality before turning up the speed. Overtravel is the distance the saw travels before each cut before it reaches your sample. This parameter prevents the saw from lowering directing onto the edge of your sample (which could potentially break the blade or crack the sample). We generally use an overtravel value of 7mm for any substrate 700um or less. Users dicing thicker samples should increase this value. Make sure you account for the curvature of the blade! Spindle speed is how fast the spindle rotates (kRPMs). Recommended spindle speeds are posted on the same sheet as the cut speeds. Height check rate is the amount of cuts the saw makes before it moves over the optical sensor to measure the exposure of the blade. The significance of this is that every time the system does an exposure measurement and your blade exposure decreases, the saw lowers to accommodate for the blade wear. If you allow for too many cuts in between measurements (i.e. this value is too high) you will notice that your cuts won't be going all the way through your sample. For harder substrates like sapphire or thick GaN you want the blade exposure to update every 1-2 cuts in order to stay up with the blade wear. For silicon you can turn this value up to 40 or more.
  7. Click 'Save'.
  8. Select 'Auto' => 'Define job'. Scroll down and find your recipe. Recipes are in alphabetical order based on groups. Click 'Apply' and then 'Ok'. Make sure your recipe shows up on the top of the software window!

Load Your Sample and Align

  1. Click the 'Load Wafer' button (yellow arrow).
  2. Ensure that there are no large particles/debris on the chuck. It is recommended to use the DI and compressed air spray gun to clean off the chuck. If you hold down both the water and air buttons simultaneously the gun will act like a pressure washer.
  3. Load your tape frame and sample face up (tacky side up!) and slide the two notches of the tape frame underneath the two pin heads at the back of the chuck. There is a magnet in front of the chuck that will help hold the frame in place.
  4. Click 'Finish'. Watch your hands! The chuck will move underneath the camera.
  5. Click 'Manual Alignment' and follow the directions in the dialogue box on the left. There are three different magnifications (L, M, H). It is recommended to click on low (L) so you have a larger field of view.
  6. Use the 4 movement arrows to move to and select a right alignment point (double click on a feature to automatically move the green crosshair). Once you have selected your right alignment point click 'Next'. The camera will automatically move to the left side of your sample and prompt you to select a left alignment point. Make sure you select a feature in the same row as the one you selected for your right alignment mark otherwise you could cross align rows. Click 'Next' and your sample will be aligned to your two selected points. Click 'Finish' to complete alignment, click 'Next' to make adjustments to alignment marks.
  7. After finishing alignment you will be prompted to 'Define Cut Position'. This is the spot where the saw will first enter your sample. Your top most cut. Note: if you are dicing a full wafer or non rectangular piece make sure you define this cut position in X at the right most part of your sample. When you define this point every cut will start at this position in the X dimension. If you define this position at the edge of your sample where the diameter is smaller you will cause the saw to come down on your sample in areas where the diameter is larger.
  8. Click 'Finish' and a cut map of all your cuts will appear on the sample representation in the software (top left corner of the screen). Ensure that all the cuts are in the appropriate spots. To do this, move back over to the middle of your wafer or sample. Change the movement speed from 'Fast mode' to 'Index' by clicking on the 'F' in the middle of the four movement arrows until you see 'I'. Once you're in 'Index mode' every time you click the up or down of the movement arrows the camera will jump from cut to cut across your sample. Verify every cut position looks right. To make changes to the cut map, you will have to go back to the programming workspace and edit (and save) your recipe. Once you're done with the edit you must reload the recipe and click 'Manual Alignment' again. The camera should move to the original cut position. Click 'Finish' and the new cut map will appear.

Manual Y-Offset

Before dicing your wafer it is recommended you do "manual y-offset". This is especially true if you look at the log book and the previous user brought in their own blade (a non 2.187 blade). This means that the cut street could be off by a couple millimeters in the y dimension from where you set it.

To perform a manual y-offset, click the right eyeball icon (to the right of manual alignment). The software will prompt you to move to a "single cut position and click next". It is recommended you do this in two steps. For your first cut, move the camera somewhere above or below your sample (into the tape). This will prevent any damage to devices if the previous user created a large offset. Click 'Next' and the will prompt you to turn on the spindle (if it isn't on already). Once you click 'Ok' the saw will do one more exposure update and make a cut where you initially moved the camera to. Once the saw is done with the cut the camera will move back over it. If you do not see a cut on the screen you'll have to move the camera up or down to find it. Once you do see the cut, place the green crosshairs right in the middle of the cut street. You can click and drag the blue box for reference and also to measure the cut width. Once the green crosshairs are centered on the cut click 'Finish'. Your coarse manual y-offset will be completed.

At this point your alignment can still be off by 5-10um because the tape will pull apart when cut which makes it hard to find the exact middle. If you want even better alignment click 'Manual y-offset' again and move somewhere on your sample without any important features or devices. Click 'Next' and the saw will make another cut. Now that it is cutting into something more rigid you'll be able to align the green crosshairs more accurately.

Cut Wafer

After completing your manual y-offset you are ready to cut. At this point you can do any final verifications on your wafer but as soon as you click the 'Wafer Full Cut' button (red wafer icon near the top right of the screen) the saw will start cutting.

Final verification tip: Clicking the 'Wafer Full Cut' button during a cut will cause the saw to finish the current cut and then bring the camera back over it once it's completed. This is a good way of doing one last verification that the saw is cutting in the right position. This is not necessary and you should be fine as long as you previously verified your cuts after defining the cut position and you completed your manual y-offset alignment.