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Showing below up to 250 results in range #71 to #320.
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- Surfscan photo (2 revisions)
- Thermal Evaporator 2 (2 revisions)
- Plasma Clean (Gasonics 2000) (2 revisions)
- ASML Stepper 3: Wafer Handler Reset Procedure (2 revisions)
- Michael Barreraz (2 revisions)
- Vacuum Oven (YES) (3 revisions)
- Vapor HF Etch (uETCH) (3 revisions)
- Nanofab New User Onboarding (3 revisions)
- Mike Day (3 revisions)
- ASML 5500: Recovering from a Typo in Reticle ID (3 revisions)
- Sputter 1 (Custom) (3 revisions)
- Video Training: Hosting with Zoom and GacuhoCast/Panopto (3 revisions)
- Nick test (3 revisions)
- Foong Fatt (3 revisions)
- Glossary (3 revisions)
- User Accessible Commands (3 revisions)
- MVD - Wafer Coating - Process Traveler (3 revisions)
- ASML Stepper 3 Dicing Guide Programming (3 revisions)
- Vacuum Sealer (3 revisions)
- Ellipsometer (Woollam) - Measuring thin metals with oxide pre-measurement (3 revisions)
- ADT UV-Tape Table 1042R (3 revisions)
- PECVD1-SiN standard recipe.pdf (3 revisions)
- Test Data of Etching SiO2 with CHF3/CF4-Florine ICP Etcher (3 revisions)
- Logitech WBS7 - Procedure for Wax Mounting with Spin-On Crystalbond (3 revisions)
- Ellipsometer (Rudolph) (3 revisions)
- Test Data of etching SiO2 with CHF3/CF4-Florine ICP Etcher (3 revisions)
- DS-K101-304 Bake Temp. versus Develop Rate (3 revisions)
- MLA Recipes (3 revisions)
- Gold surface oxidation (darkening) due to O2/N2 plasma; the need for O2 only recipe. (3 revisions)
- Wire Saw (Takatori) (3 revisions)
- Critical Point Dryer (4 revisions)
- Photolithography - Improving Adhesion Photoresist Adhesion (4 revisions)
- KLA Tencor P7 - Basic profile instructions (4 revisions)
- Test Data of etching SiO2 with CHF3/CF4-Florine (4 revisions)
- Jack Whaley (4 revisions)
- Peder Lenvik (4 revisions)
- Claudia Gutierrez (4 revisions)
- Suss MA-6 Backside Alignment QuickStart (4 revisions)
- Gold Plating Bench (4 revisions)
- Tube Furnace AlGaAs Oxidation (Lindberg) (4 revisions)
- GCA 6300 Reboot Procedures (4 revisions)
- Electronics Presentations (4 revisions)
- MLA150 - Large Image GDS Generation (4 revisions)
- Wafer Scanning process Traveler (4 revisions)
- Vraj Mehalana (4 revisions)
- ASML DUV: Edge Bead Removal via Photolithography (4 revisions)
- Laser Etch Monitor Simulation in Python (4 revisions)
- Filmetrics F10-RT-UVX Operating Procedure (4 revisions)
- Tino Sy (5 revisions)
- Old Training Manual (5 revisions)
- News Feed (5 revisions)
- Spin Rinse Dryer (SemiTool) (5 revisions)
- Old Deposition Data - 2021-12-15 (5 revisions)
- Mechanical Polisher (Allied) (5 revisions)
- Sputter 2 (SFI Endeavor) (5 revisions)
- Goniometer (Rame-Hart A-100) - Operating Procedure (5 revisions)
- PubList2018 (5 revisions)
- Thermal Evaporator 1 (5 revisions)
- Lift-Off with I-Line Imaging Resist + LOL2000 Underlayer (5 revisions)
- Wafer Cleaver (PELCO Flip-Scribe) (6 revisions)
- Automated Wafer Cleaver (Loomis LSD-155LT) (6 revisions)
- Luis Zuzunaga (6 revisions)
- Digital Microscope (Olympus DSX1000) (6 revisions)
- S-Cubed Flexi - Operating Procedure (6 revisions)
- Olympus LEXT OLS4000 Confocal uScope - Quick Start (6 revisions)
- Tube Furnace Wafer Bonding (Thermco) (6 revisions)
- MLA150 - CAD Files and Templates (6 revisions)
- Photonics Presentations (6 revisions)
- Optical Film Thickness (Filmetrics) (6 revisions)
- E-BEAM (6 revisions)
- High Temp Oven (Blue M) (7 revisions)
- ADT 7100 - Initial Setup Before Cutting (7 revisions)
- RIE 1 (Custom) (7 revisions)
- Flip-Chip Bonder (Finetech) (7 revisions)
- Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX) (7 revisions)
- Dan Read (7 revisions)
- Programming a Job (7 revisions)
- PECV1 Wafer Coating Process Traveler (7 revisions)
- Stocked Chemical List (7 revisions)
- Ovens 1, 2 & 3 (Labline) (7 revisions)
- NanoFab Process Group (7 revisions)
- Autostep 200 User Accessible Commands (7 revisions)
- Optical Film Thickness & Wafer-Mapping (Filmetrics F50) (7 revisions)
- Probe Station: I-V Curves with Keithley 2400 and Python Script (7 revisions)
- Wafer Scanning/Coating Process Traveler ( combined/less detailed) (7 revisions)
- PECVD1-(PlasmaTherm 790) (7 revisions)
- Bill Millerski (7 revisions)
- GCA Old full training manual (7 revisions)
- Deposition Data - temporary 2021-12-15 (7 revisions)
- Filmetrics F40-UV Quick Start (8 revisions)
- FIJI - Microscope Measurement Tools (8 revisions)
- SEM Sample Coater (Hummer) (8 revisions)
- ASML 5500: Recovering from an Error (8 revisions)
- Focused Ion-Beam Lithography (Raith Velion) (8 revisions)
- Resistivity Mapper (CDE RESMAP) (8 revisions)
- Photoluminescence PL Setup (Custom) (9 revisions)
- Oven 4 (Thermo-Fisher HeraTherm) (9 revisions)
- Optical Film Thickness (Nanometric) (9 revisions)
- GCA 6300 Mask Making Guidance (9 revisions)
- Holographic Lith/PL Setup (Custom) (9 revisions)
- Bill Mitchell (9 revisions)
- YES-150C-Various-Resists (9 revisions)
- KLA Tencor P7 - Saving Profile Data (9 revisions)
- Ashers (Technics PEII) (9 revisions)
- Nano-Imprint (Nanonex NX2000) (9 revisions)
- Old Deposition Data - NastaziaM 2021-11-22 (9 revisions)
- Fluorescence Microscope (Olympus MX51) (9 revisions)
- SEM 1 (JEOL IT800SHL) (9 revisions)
- Process Group - Billing Instructions (9 revisions)
- Wafer Coating Process Traveler1 (10 revisions)
- Intellemetrics Laser Etch Monitor Procedure for Panasonic ICP Etchers (10 revisions)
- Ning Cao (10 revisions)
- GCA 6300 USer Accessible Commands (10 revisions)
- CC-PRIME OnBoarding 2022-08 (10 revisions)
- Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick (10 revisions)
- IBD: Calibrating Optical Thickness (10 revisions)
- Adam Abrahamsen (10 revisions)
- Photolithography - Manual Edge-Bead Removal Techniques (10 revisions)
- Unaxis wafer coating procedure (10 revisions)
- Measurements and Imaging with Amscope Camera - Quickstart Usage Guide (10 revisions)
- InP Etch Test Result in Details (10 revisions)
- IR Aligner (SUSS MJB-3 IR) (11 revisions)
- Step Profilometer (KLA Tencor P-7) (11 revisions)
- UV Ozone Reactor (11 revisions)
- Deep UV Optical Microscope (Olympus) (11 revisions)
- Homepage Draft1 (11 revisions)
- KLayout Design Tips (11 revisions)
- Nanofab Job Postings (12 revisions)
- Brian Thibeault (12 revisions)
- Process Group - Remote Fabrication Jobs (12 revisions)
- Ovens - Overview of All Lab Ovens (12 revisions)
- Molecular Vapor Deposition (12 revisions)
- Wafer Bonder (SUSS SB6-8E) (12 revisions)
- YES-SPR220-Various-Temps (12 revisions)
- Film Stress (Tencor Flexus) (12 revisions)
- Chemical-Mechanical Polisher (Logitech) (12 revisions)
- Chemical List (12 revisions)
- InP etch result in details (13 revisions)
- Field Emission SEM 2 (JEOL IT800SHL) (13 revisions)
- Step Profilometer (DektakXT) (14 revisions)
- Lee Sawyer (14 revisions)
- Unaxis VLR Etch - Process Control Data (15 revisions)
- ASML Stepper 3 - UCSB Test Reticles (15 revisions)
- Laser Etch Monitoring (15 revisions)
- ASML Stepper 3 Standard Operating Procedure (15 revisions)
- Test Data of etching SiO2 with CHF3/CF4/O2 (using this recipe only for Fluorine etch of the underneath layer) (16 revisions)
- PECVD1 Wafer Coating Process Traveler (16 revisions)
- DUV Flood Expose (16 revisions)
- E-Beam Lithography System (JEOL JBX-6300FS) (16 revisions)
- Main Page (17 revisions)
- Plasma Activation (EVG 810) (17 revisions)
- XeF2 Etch (Xetch) (17 revisions)
- MLA150 - Design Guidelines (18 revisions)
- Laser Scanning Confocal M-scope (Olympus LEXT) (18 revisions)
- Thermal Processing Recipes (18 revisions)
- Atomic Force Microscope (Bruker ICON) (18 revisions)
- Sputter 5 (AJA ATC 2200-V) (18 revisions)
- Wafer Bonder (Logitech WBS7) (18 revisions)
- Probe Station & Curve Tracer (19 revisions)
- Oxford ICP Etcher (PlasmaPro 100 Cobra) (19 revisions)
- Automated Coat/Develop System (S-Cubed Flexi) (19 revisions)
- UCSB NanoFab Microscope Training (19 revisions)
- Lift-Off with DUV Imaging + PMGI Underlayer (19 revisions)
- Process Group - Process Control Data (19 revisions)
- Tech Talks Seminar Series (19 revisions)
- Filmetrics F40-UV Microscope-Mounted (19 revisions)
- Troubleshooting and Recovery (19 revisions)
- Oven 5 (Labline) (19 revisions)
- IR Thermal Microscope (QFI) (20 revisions)
- Rapid Thermal Processor (SSI Solaris 150) (20 revisions)
- Rapid Thermal Processor (AET RX6) (20 revisions)
- RIE 5 (PlasmaTherm) (20 revisions)
- Brian Lingg (20 revisions)
- Tom Reynolds (20 revisions)
- Sputter 4 (AJA ATC 2200-V) (20 revisions)
- GoPro Hero8 Black (Internal) (21 revisions)
- DSEIII (PlasmaTherm/Deep Silicon Etcher) (21 revisions)
- Plasma Clean (YES EcoClean) (21 revisions)
- Autostep 200 Mask Making Guidance (21 revisions)
- RIE 2 (MRC) (22 revisions)
- Wafer Coating Process Traveler (23 revisions)
- CAIBE (Oxford Ion Mill) (23 revisions)
- DUMMY TOOL (24 revisions)
- Suss Aligners (SUSS MJB-3) (24 revisions)
- Don Freeborn (24 revisions)
- Demis D. John (25 revisions)
- Mike Silva (25 revisions)
- Biljana Stamenic (25 revisions)
- Usage Data and Statistics (25 revisions)
- Ellipsometer (Woollam) (25 revisions)
- Aidan Hopkins (26 revisions)
- Sputter 3 (AJA ATC 2000-F) (26 revisions)
- Stepper 1 (GCA 6300) - Standard Operating Procedure (26 revisions)
- PECVD1 Wafer Coating Process (27 revisions)
- Tony Bosch (28 revisions)
- ICP-Etch (Unaxis VLR) (29 revisions)
- Vapor HF Etch (30 revisions)
- Atomic Layer Deposition (Oxford FlexAL) (30 revisions)
- Services (30 revisions)
- Other Dry Etching Recipes (30 revisions)
- RIE 3 (MRC) (31 revisions)
- HF Vapor Etch (31 revisions)
- Stepper 2 (AutoStep 200) Operating Procedures (32 revisions)
- Tube Furnace (Tystar 8300) (34 revisions)
- Test Data of Etching SiO2 with CHF3/CF4-Fluorine ICP Etcher (34 revisions)
- Old training manual (34 revisions)
- Packaging Recipes (36 revisions)
- ASML Stepper 3 Error Recovery, Troubleshooting and Calibration (38 revisions)
- Ion Beam Deposition (Veeco NEXUS) (39 revisions)
- RIE Etching Recipes (40 revisions)
- COVID-19 User Policies (40 revisions)
- Contact Aligner (SUSS MA-6) (40 revisions)
- Atomic Layer Deposition Recipes (40 revisions)
- Oxygen Plasma System Recipes (41 revisions)
- Lab Rules (42 revisions)
- MLA150 - Troubleshooting (44 revisions)
- Research (44 revisions)
- Dicing Saw (ADT) (46 revisions)
- Maskless Aligner (Heidelberg MLA150) (46 revisions)
- Lab Rules OLD 2018 (47 revisions)
- Microscopes (48 revisions)
- Autostep 200 Troubleshooting and Recovery (48 revisions)
- PECVD 2 (Advanced Vacuum) (48 revisions)
- Nanofab Staff Internal Pages (49 revisions)
- Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP) (49 revisions)
- Stepper 2 (Autostep 200) - Piece vs. Wafer Programming Differences (51 revisions)
- Contact Alignment Recipes (51 revisions)
- Wet Benches (51 revisions)
- Editing Tutorials (52 revisions)
- Direct-Write Lithography Recipes (52 revisions)
- ASML 5500 Mask Making Guidelines (53 revisions)
- ICP Etch 2 (Panasonic E626I) (55 revisions)
- OLD - PECVD2 Recipes (56 revisions)
- Staff List (57 revisions)
- Test Data of etching SiO2 with CHF3/CF4-ICP1 (58 revisions)
- E-Beam Evaporation Recipes (60 revisions)
- InP Etch Rate and Selectivity (InP/SiO2) (60 revisions)
- ICP-PECVD (Unaxis VLR) (62 revisions)
- Thermal Evaporation Recipes (62 revisions)
- ICP Etch 1 (Panasonic E646V) (63 revisions)
- E-Beam 4 (CHA) (63 revisions)
- PECVD 1 (PlasmaTherm 790) (64 revisions)
- Oxford ICP Etcher - Process Control Data (65 revisions)
- Thermal Evap 2 (Solder) (66 revisions)
- E-Beam 3 (Temescal) (68 revisions)
- Chemical List - OLD 2018-09-05 (68 revisions)
- E-Beam 2 (Custom) (74 revisions)
- E-Beam 1 (Sharon) (75 revisions)
- Wet Etching Recipes (75 revisions)
- Thermal Evap 1 (76 revisions)