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Showing below up to 250 results in range #51 to #300.

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  1. User Accessible Commands‏‎ (15:24, 13 June 2019)
  2. Stepper 1 (GCA6300) How to select proper chuck‏‎ (15:13, 20 June 2019)
  3. Stepper 1 (GCA 6300) Substrate Thickness, Shim Thickness ans Target Thickness‏‎ (15:32, 20 June 2019)
  4. Stepper 1 (GCA 6300) Available chucks‏‎ (15:41, 20 June 2019)
  5. Unaxis SiN100C 300nm-2019‏‎ (08:33, 10 September 2019)
  6. DS-K101-304 Bake Temp. versus Develop Rate‏‎ (14:02, 2 October 2019)
  7. SiN 100C Table-2019‏‎ (07:39, 3 October 2019)
  8. THz Physics Presentations‏‎ (13:59, 11 October 2019)
  9. Photonics Presentations‏‎ (09:04, 24 October 2019)
  10. Electronics Presentations‏‎ (15:17, 30 October 2019)
  11. PubList2018‏‎ (16:10, 27 November 2019)
  12. Older Publications‏‎ (16:30, 4 March 2020)
  13. Publications - 2013-2014‏‎ (16:34, 4 March 2020)
  14. Stepper 1 (GCA 6300) - Standard Operating Procedure‏‎ (09:42, 19 March 2020)
  15. Programming a Job‏‎ (10:36, 20 March 2020)
  16. GCA 6300 training manual -old instructions‏‎ (08:49, 23 March 2020)
  17. GCA Old full training manual‏‎ (09:58, 23 March 2020)
  18. Tino Sy‏‎ (11:26, 23 March 2020)
  19. Bill Mitchell‏‎ (11:32, 23 March 2020)
  20. Old training manual‏‎ (13:52, 23 March 2020)
  21. Autostep 200 Old training manual‏‎ (14:36, 23 March 2020)
  22. Old Training Manual‏‎ (21:41, 23 March 2020)
  23. Ning Cao‏‎ (12:18, 24 March 2020)
  24. Brian Thibeault‏‎ (14:44, 26 March 2020)
  25. Mike Day‏‎ (15:05, 26 March 2020)
  26. Unaxis SOP 3-12-2020.docx‏‎ (10:03, 27 March 2020)
  27. Claudia Gutierrez‏‎ (10:19, 30 March 2020)
  28. Wafer Coating Process Traveler1‏‎ (13:32, 30 March 2020)
  29. PECV1 Wafer Coating Process Traveler‏‎ (16:00, 30 March 2020)
  30. PECVD1 Wafer Coating Process Traveler‏‎ (16:38, 30 March 2020)
  31. PECVD.docx‏‎ (21:23, 30 March 2020)
  32. UCSBTEST1Gain4.jpg‏‎ (09:18, 1 April 2020)
  33. Surfscan photo‏‎ (09:35, 1 April 2020)
  34. Test Data of etching SiO2 with CHF3/CF4/O2 (using this recipe only for Fluorine etch of the underneath layer)‏‎ (18:26, 6 April 2020)
  35. InP Etch Test Result in Details‏‎ (18:31, 6 April 2020)
  36. Autostep 200 User Accessible Commands‏‎ (13:08, 7 April 2020)
  37. Exposing a wafer piece‏‎ (20:33, 7 April 2020)
  38. AUTOSTEP 200-PIECES instruction 6-20-19.pptx‏‎ (20:34, 7 April 2020)
  39. AUTOSTEP 200-PIECES 1st litho BL and BR orientation.pptx‏‎ (10:03, 8 April 2020)
  40. Errors‏‎ (09:14, 15 April 2020)
  41. Glossary‏‎ (09:25, 15 April 2020)
  42. Fluorescence Microscope (Olympus MX51)‏‎ (11:09, 15 April 2020)
  43. Wafer Scanning/Coating Process Traveler ( combined/less detailed)‏‎ (13:41, 20 April 2020)
  44. STD SiO2 recipe‏‎ (11:00, 21 April 2020)
  45. Wafer Scanning process Traveler‏‎ (11:31, 22 April 2020)
  46. Wafer Coating Process Traveler‏‎ (16:54, 22 April 2020)
  47. Operating Instructions‏‎ (09:43, 27 May 2020)
  48. Intellemetrics Laser Etch Monitor Procedure for Plasma-Therm Etchers‏‎ (11:11, 8 June 2020)
  49. Main Page mod‏‎ (14:56, 17 June 2020)
  50. Demis D. John‏‎ (10:22, 18 June 2020)
  51. Wafer coating procedure‏‎ (11:42, 2 July 2020)
  52. MVD - Wafer Coating - Process Traveler‏‎ (13:38, 26 July 2020)
  53. Tom Reynolds‏‎ (08:29, 7 August 2020)
  54. IR Aligner (SUSS MJB-3 IR)‏‎ (11:56, 7 August 2020)
  55. Logitech WBS7 - Procedure for Wax Mounting with Spin-On Crystalbond‏‎ (08:12, 11 August 2020)
  56. Unaxis wafer coating procedure‏‎ (21:29, 12 August 2020)
  57. Goniometer (Rame-Hart A-100) - Operating Procedure‏‎ (16:07, 30 September 2020)
  58. Stocked Chemical List‏‎ (13:15, 28 November 2020)
  59. Video Training: Hosting with Zoom and GacuhoCast/Panopto‏‎ (13:08, 10 December 2020)
  60. PECVD1 Wafer Coating Process‏‎ (13:16, 10 December 2020)
  61. GoPro Hero8 Black (Internal)‏‎ (23:15, 12 January 2021)
  62. ASML Stepper 3 Dicing Guide Programming‏‎ (11:07, 30 January 2021)
  63. Process Group - Lab Stocking/Supplies Tasks‏‎ (11:08, 30 January 2021)
  64. Test Data of Etching SiO2 with CHF3/CF4-Florine ICP Etcher‏‎ (18:30, 2 February 2021)
  65. Test Data of etching SiO2 with CHF3/CF4-Florine‏‎ (18:33, 2 February 2021)
  66. Test Data of etching SiO2 with CHF3/CF4-Florine ICP Etcher‏‎ (18:37, 2 February 2021)
  67. ASML Stepper 3 - Substrates smaller than 100mm/4-inch‏‎ (10:12, 23 February 2021)
  68. Tech Talks Seminar Series‏‎ (07:30, 12 March 2021)
  69. Focused Ion-Beam Lithography (Raith Velion)‏‎ (09:56, 15 March 2021)
  70. Laser Etch Monitor Simulation in Python‏‎ (12:54, 21 April 2021)
  71. GCA 6300 USer Accessible Commands‏‎ (10:01, 5 May 2021)
  72. GCA 6300 Reboot Procedures‏‎ (09:44, 7 May 2021)
  73. Troubleshooting and Recovery‏‎ (09:47, 7 May 2021)
  74. Vacuum Oven (YES)‏‎ (12:12, 3 June 2021)
  75. RIE Etching Recipes‏‎ (10:02, 14 June 2021)
  76. ADT 7100 - Initial Setup Before Cutting‏‎ (09:50, 2 July 2021)
  77. Nick test‏‎ (22:15, 23 August 2021)
  78. Chemical List - OLD 2018-09-05‏‎ (12:50, 4 September 2021)
  79. YES-150C-Various-Resists‏‎ (12:51, 4 September 2021)
  80. InP etch result in details‏‎ (12:51, 4 September 2021)
  81. KLA Tencor P7 - Saving Profile Data‏‎ (12:52, 4 September 2021)
  82. Filmetrics F10-RT-UVX Operating Procedure‏‎ (12:52, 4 September 2021)
  83. Editing Tutorials‏‎ (12:52, 4 September 2021)
  84. Bill Millerski‏‎ (08:28, 28 October 2021)
  85. Don Freeborn‏‎ (09:48, 28 October 2021)
  86. Tony Bosch‏‎ (09:53, 28 October 2021)
  87. Lee Sawyer‏‎ (09:59, 28 October 2021)
  88. InP Etch Rate and Selectivity (InP/SiO2)‏‎ (18:00, 8 November 2021)
  89. SiO2 Etching Test using CF4/CHF3‏‎ (13:43, 9 November 2021)
  90. Process Group - Billing Instructions‏‎ (21:43, 22 November 2021)
  91. MA6 Backside Alignment - Allowed Mark Locations‏‎ (12:16, 8 December 2021)
  92. Old Deposition Data - NastaziaM 2021-11-22‏‎ (09:31, 14 December 2021)
  93. Deposition Data - temporary 2021-12-15‏‎ (00:07, 16 December 2021)
  94. Old Deposition Data - 2021-12-15‏‎ (00:18, 16 December 2021)
  95. Video Training - Introduction (Internal)‏‎ (08:43, 7 January 2022)
  96. Video Training: Uploading to GauchoCast/Panopto (Internal)‏‎ (08:48, 7 January 2022)
  97. Autostep 200 Troubleshooting and Recovery‏‎ (16:55, 31 January 2022)
  98. OLD - PECVD2 Recipes‏‎ (12:28, 3 March 2022)
  99. ASML Stepper 3 - Job Creator‏‎ (21:08, 7 April 2022)
  100. Lift-Off with DUV Imaging + PMGI Underlayer‏‎ (16:32, 27 April 2022)
  101. Optical Film Thickness (Filmetrics)‏‎ (07:27, 13 May 2022)
  102. Optical Film Thickness (Nanometric)‏‎ (07:30, 13 May 2022)
  103. MLA Recipes‏‎ (21:24, 26 May 2022)
  104. Brian Lingg‏‎ (16:59, 18 June 2022)
  105. Hummer SEM Sample Coater - Techniques to reduce charging in SEMs‏‎ (06:41, 22 June 2022)
  106. Vacuum Deposition Recipes‏‎ (15:44, 7 July 2022)
  107. MLA150 - Large Image GDS Generation‏‎ (16:45, 29 July 2022)
  108. E-Beam Lithography System (JEOL JBX-6300FS)‏‎ (23:28, 14 August 2022)
  109. Luis Zuzunaga‏‎ (10:34, 18 August 2022)
  110. Dan Read‏‎ (08:44, 20 August 2022)
  111. Ovens - Overview of All Lab Ovens‏‎ (09:41, 24 August 2022)
  112. ASML Stepper 3: Wafer Handler Reset Procedure‏‎ (16:28, 24 August 2022)
  113. Equipment Group - Video Training Procedures‏‎ (09:55, 25 August 2022)
  114. Laser Scanning Confocal M-scope (Olympus LEXT)‏‎ (09:30, 30 August 2022)
  115. IR Thermal Microscope (QFI)‏‎ (09:37, 30 August 2022)
  116. Oven 5 (Labline)‏‎ (10:21, 30 August 2022)
  117. Thermal Evap 1‏‎ (10:28, 30 August 2022)
  118. Thermal Evap 2 (Solder)‏‎ (10:29, 30 August 2022)
  119. PECVD 1 (PlasmaTherm 790)‏‎ (10:30, 30 August 2022)
  120. PECVD 2 (Advanced Vacuum)‏‎ (10:30, 30 August 2022)
  121. Molecular Vapor Deposition‏‎ (10:34, 30 August 2022)
  122. Sputter 3 (AJA ATC 2000-F)‏‎ (10:36, 30 August 2022)
  123. Sputter 4 (AJA ATC 2200-V)‏‎ (10:37, 30 August 2022)
  124. RIE 3 (MRC)‏‎ (10:42, 30 August 2022)
  125. Vapor HF Etch‏‎ (10:53, 30 August 2022)
  126. Spin Rinse Dryer (SemiTool)‏‎ (11:02, 30 August 2022)
  127. Chemical-Mechanical Polisher (Logitech)‏‎ (11:03, 30 August 2022)
  128. Tube Furnace AlGaAs Oxidation (Lindberg)‏‎ (11:13, 30 August 2022)
  129. Vacuum Sealer‏‎ (11:21, 30 August 2022)
  130. Flip-Chip Bonder (Finetech)‏‎ (11:22, 30 August 2022)
  131. Digital Microscope (Olympus DSX1000)‏‎ (11:49, 30 August 2022)
  132. Atomic Force Microscope (Bruker ICON)‏‎ (11:57, 30 August 2022)
  133. Film Stress (Tencor Flexus)‏‎ (11:58, 30 August 2022)
  134. Deep UV Optical Microscope (Olympus)‏‎ (07:24, 31 August 2022)
  135. Lift-Off with I-Line Imaging Resist + LOL2000 Underlayer‏‎ (14:58, 31 August 2022)
  136. Michael Barreraz‏‎ (10:03, 7 September 2022)
  137. High Temp Oven (Blue M)‏‎ (10:33, 8 September 2022)
  138. E-Beam 3 (Temescal)‏‎ (12:11, 8 September 2022)
  139. CC-PRIME OnBoarding 2022-08‏‎ (09:58, 9 September 2022)
  140. Optical Film Thickness & Wafer-Mapping (Filmetrics F50)‏‎ (10:03, 13 September 2022)
  141. Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)‏‎ (10:04, 13 September 2022)
  142. Oven 4 (Thermo-Fisher HeraTherm)‏‎ (16:25, 13 September 2022)
  143. Ovens 1, 2 & 3 (Labline)‏‎ (17:09, 13 September 2022)
  144. Sputter 5 (AJA ATC 2200-V)‏‎ (15:50, 16 September 2022)
  145. SEM Sample Coater (Hummer)‏‎ (15:10, 21 September 2022)
  146. Filmetrics F40-UV Microscope-Mounted‏‎ (14:28, 29 September 2022)
  147. ICP-Etch (Unaxis VLR)‏‎ (16:31, 29 September 2022)
  148. Chemical List‏‎ (13:26, 4 October 2022)
  149. ASML DUV: Edge Bead Removal via Photolithography‏‎ (23:06, 4 October 2022)
  150. DUMMY TOOL‏‎ (01:11, 19 October 2022)
  151. E-Beam Evaporation Recipes‏‎ (11:59, 25 October 2022)
  152. KLA Tencor P7 - Basic profile instructions‏‎ (15:20, 2 November 2022)
  153. S-Cubed Flexi - Operating Procedure‏‎ (14:39, 8 November 2022)
  154. Automated Coat/Develop System (S-Cubed Flexi)‏‎ (14:41, 8 November 2022)
  155. Ashers (Technics PEII)‏‎ (13:06, 11 November 2022)
  156. Unaxis VLR Etch - Process Control Data‏‎ (18:41, 21 November 2022)
  157. RIE 5 (PlasmaTherm)‏‎ (10:54, 28 November 2022)
  158. Contact Alignment Recipes‏‎ (12:20, 1 December 2022)
  159. Process Group - Remote Fabrication Jobs‏‎ (16:52, 6 December 2022)
  160. Other Dry Etching Recipes‏‎ (08:17, 9 December 2022)
  161. Wafer Cleaver (PELCO Flip-Scribe)‏‎ (07:57, 13 December 2022)
  162. Test Data of Etching SiO2 with CHF3/CF4-Fluorine ICP Etcher‏‎ (15:03, 9 January 2023)
  163. Test Data of etching SiO2 with CHF3/CF4‏‎ (13:15, 11 January 2023)
  164. Test Data of etching SiO2 with CHF3/CF4-ICP1‏‎ (09:54, 12 January 2023)
  165. Oxford ICP Etcher - Process Control Data‏‎ (15:38, 12 January 2023)
  166. Foong Fatt‏‎ (11:24, 1 February 2023)
  167. Probe Station & Curve Tracer‏‎ (13:23, 10 February 2023)
  168. COVID-19 User Policies‏‎ (16:56, 13 February 2023)
  169. Research‏‎ (17:49, 16 February 2023)
  170. Lithography Recipes‏‎ (21:43, 16 February 2023)
  171. Probe Station: I-V Curves with Keithley 2400 and Python Script‏‎ (15:01, 21 February 2023)
  172. Atomic Layer Deposition (Oxford FlexAL)‏‎ (14:56, 8 March 2023)
  173. Oxford Etcher - Sample Size Effect on Etch Rate‏‎ (16:05, 20 March 2023)
  174. E-Beam 5 (Plasys)‏‎ (10:13, 21 March 2023)
  175. E-Beam Lithography Recipes‏‎ (15:33, 4 April 2023)
  176. E-Beam 4 (CHA)‏‎ (12:04, 11 April 2023)
  177. Lab Rules‏‎ (10:16, 12 April 2023)
  178. Mike Silva‏‎ (08:31, 14 April 2023)
  179. Peder Lenvik‏‎ (09:05, 14 April 2023)
  180. ASML Stepper 3 Standard Operating Procedure‏‎ (13:59, 23 April 2023)
  181. Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick‏‎ (10:52, 26 April 2023)
  182. Ellipsometer (Woollam) - Measuring thin dielectrics with Native Oxide pre-measurement‏‎ (12:44, 26 April 2023)
  183. Oxford ICP Etcher (PlasmaPro 100 Cobra)‏‎ (23:33, 4 May 2023)
  184. Step Profilometer (DektakXT)‏‎ (21:51, 10 May 2023)
  185. Mechanical Polisher (Allied)‏‎ (09:06, 15 May 2023)
  186. ICP-PECVD (Unaxis VLR)‏‎ (10:35, 23 May 2023)
  187. YES-SPR220-Various-Temps‏‎ (09:53, 5 June 2023)
  188. SPR220-7 at 3kW various temperature without N2 gas‏‎ (10:01, 5 June 2023)
  189. Gold surface oxidation (darkening) due to O2/N2 plasma; the need for O2 only recipe.‏‎ (16:22, 9 June 2023)
  190. Comparison of ash rate for different gas mixtures, especially between O2 only vs O2/N2 mixture.‏‎ (16:33, 9 June 2023)
  191. Rapid Thermal Processor (AET RX6)‏‎ (08:58, 15 June 2023)
  192. Atomic Layer Deposition Recipes‏‎ (10:27, 15 June 2023)
  193. RIE 2 (MRC)‏‎ (07:55, 21 July 2023)
  194. Wafer Cleaver Recipes (LSD-155LT)‏‎ (15:12, 15 August 2023)
  195. Vraj Mehalana‏‎ (09:23, 23 August 2023)
  196. E-Beam 2 (Custom)‏‎ (11:31, 25 August 2023)
  197. UV Ozone Reactor‏‎ (09:17, 29 August 2023)
  198. Nanofab-IT - Add Device to Network‏‎ (11:52, 30 August 2023)
  199. NanoFab Process Group‏‎ (16:46, 11 September 2023)
  200. Stepper 2 (Autostep 200) - Chuck Selection‏‎ (13:17, 13 September 2023)
  201. Stepper 2 (Autostep 200) - Table of Chucks, Shims, Target Thicknesses‏‎ (13:39, 13 September 2023)
  202. ASML Stepper 3 Error Recovery, Troubleshooting and Calibration‏‎ (10:36, 15 September 2023)
  203. ASML 5500: Recovering from an Error‏‎ (10:41, 15 September 2023)
  204. Wafer Bonder (SUSS SB6-8E)‏‎ (10:53, 20 September 2023)
  205. Sputtering Recipes‏‎ (21:36, 21 September 2023)
  206. Photomask Ordering Procedure for UCSB Users‏‎ (14:05, 22 September 2023)
  207. Contact Aligner (SUSS MA-6)‏‎ (14:08, 22 September 2023)
  208. GCA 6300 Mask Making Guidance‏‎ (14:11, 22 September 2023)
  209. Automated Wafer Cleaver (Loomis LSD-155LT)‏‎ (08:16, 26 September 2023)
  210. Photoluminescence PL Setup (Custom)‏‎ (20:45, 26 September 2023)
  211. Holographic Lith/PL Setup (Custom)‏‎ (20:48, 26 September 2023)
  212. News Feed‏‎ (12:10, 4 October 2023)
  213. Nanofab New User Onboarding‏‎ (14:52, 12 October 2023)
  214. Photolithography - Manual Edge-Bead Removal Techniques‏‎ (13:53, 13 October 2023)
  215. UCSB NanoFab Microscope Training‏‎ (12:41, 16 October 2023)
  216. Measurements and Imaging with Amscope Camera - Quickstart Usage Guide‏‎ (16:57, 16 October 2023)
  217. Dicing Saw (ADT)‏‎ (15:11, 17 October 2023)
  218. Plasma Activation (EVG 810)‏‎ (11:06, 30 October 2023)
  219. Wafer Bonder (Logitech WBS7)‏‎ (14:50, 30 October 2023)
  220. Tube Furnace Wafer Bonding (Thermco)‏‎ (14:55, 30 October 2023)
  221. XeF2 Etch (Xetch)‏‎ (15:03, 30 October 2023)
  222. Resistivity Mapper (CDE RESMAP)‏‎ (15:07, 30 October 2023)
  223. Microscopes‏‎ (17:02, 1 November 2023)
  224. Aidan Hopkins‏‎ (17:15, 1 November 2023)
  225. Homepage Draft1‏‎ (13:59, 2 November 2023)
  226. Frequently Asked Questions‏‎ (08:59, 21 November 2023)
  227. Plasma Clean (YES EcoClean)‏‎ (12:31, 22 November 2023)
  228. Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)‏‎ (13:09, 22 November 2023)
  229. Usage Data and Statistics‏‎ (17:53, 25 November 2023)
  230. YES Recipe Screenshots: STD-N2-O2‏‎ (12:08, 30 November 2023)
  231. YES Recipe Screenshots: STD-O2‏‎ (12:12, 30 November 2023)
  232. Laser Etch Monitoring‏‎ (15:09, 6 December 2023)
  233. Rapid Thermal Processor (SSI Solaris 150)‏‎ (08:36, 8 December 2023)
  234. PECVD Recipes‏‎ (10:28, 20 December 2023)
  235. CAIBE (Oxford Ion Mill)‏‎ (09:47, 21 December 2023)
  236. Biljana Stamenic‏‎ (16:07, 29 December 2023)
  237. Surfscan Errors and Workarounds‏‎ (11:36, 4 January 2024)
  238. Autostep 200 Mask Making Guidance‏‎ (14:44, 4 January 2024)
  239. DUV Flood Expose‏‎ (15:40, 4 January 2024)
  240. Wafer scanning process traveler‏‎ (17:05, 4 January 2024)
  241. Stepper 2 (AutoStep 200) Operating Procedures‏‎ (16:24, 8 January 2024)
  242. Services‏‎ (21:55, 9 January 2024)
  243. Ion Beam Deposition (Veeco NEXUS)‏‎ (11:04, 11 January 2024)
  244. Stepper 2 (Autostep 200) - Piece vs. Wafer Programming Differences‏‎ (14:38, 11 January 2024)
  245. Maskless Aligner (Heidelberg MLA150)‏‎ (10:34, 26 January 2024)
  246. Thermal Processing Recipes‏‎ (16:24, 30 January 2024)
  247. Surface Analysis (KLA/Tencor Surfscan)‏‎ (18:02, 2 February 2024)
  248. MLA150 - Design Guidelines‏‎ (15:41, 4 February 2024)
  249. ICP Etch 1 (Panasonic E646V)‏‎ (15:18, 7 February 2024)
  250. ICP Etch 2 (Panasonic E626I)‏‎ (15:19, 7 February 2024)

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