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Showing below up to 100 results in range #31 to #130.
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- UCSBTEST1Gain4.jpg (1 revision)
- MA6 Backside Alignment - Allowed Mark Locations (1 revision)
- UV Ozone Quick Start (1 revision)
- AUTOSTEP 200-PIECES instruction 6-20-19.pptx (1 revision)
- Oxford Etcher - Sample Size Effect on Etch Rate (1 revision)
- Publications - 2013-2014 (1 revision)
- Unaxis SOP 3-12-2020.docx (1 revision)
- Unaxis Test Recipe Page (1 revision)
- Stepper 1 (GCA6300) How to select proper chuck (1 revision)
- ASML Stepper 3 - Job Creator (1 revision)
- PECVD1-SiN-standard recipe.pdf (1 revision)
- Filmetrics F50 - Operating Procedure (1 revision)
- SiN 100C Table-2019 (1 revision)
- Nanofab-IT - Add Device to Network (1 revision)
- RIE5 - Standard Operating procedure (Cortex Software) (1 revision)
- ProcessGroup: Shipping Samples on Dicing Tape+Frame (1 revision)
- SPR220-7 at 3kW various temperature without N2 gas (2 revisions)
- Main Page mod (2 revisions)
- Exposing a wafer piece (2 revisions)
- Autostep 200 Old training manual (2 revisions)
- Unaxis SiN100C 300nm-2019 (2 revisions)
- Surfscan6200 photos (2 revisions)
- SiO2 Etching Test using CF4/CHF3 (2 revisions)
- CDE ResMap Quick-Start instructions (2 revisions)
- Errors (2 revisions)
- ASML 5500: Choose Marks for Prealignment (2 revisions)
- E-Beam 5 (Plasys) (2 revisions)
- Stepper 2 (Autostep 200) - Table of Chucks, Shims, Target Thicknesses (2 revisions)
- ADT 7100 - Recovering an Old Recipe (2019) (2 revisions)
- Stepper 2 (Autostep 200) - Chuck Selection (2 revisions)
- Strip Annealer (2 revisions)
- Test Data of etching SiO2 with CHF3/CF4/O2 (2 revisions)
- GCA 6300 training manual -old instructions (2 revisions)
- Test Page (2 revisions)
- PECVD1-SIN Standard Recipe (PlasmaTherm 790) (2 revisions)
- THz Physics Presentations (2 revisions)
- Process Group - Lab Stocking/Supplies Tasks (2 revisions)
- Molecular Vapor Deposition Recipes (2 revisions)
- E-Beam Lithography Recipes (2 revisions)
- Video Training: Uploading to GauchoCast/Panopto (Internal) (2 revisions)
- Thermal Evaporator 2 (2 revisions)
- Surfscan photo (2 revisions)
- Michael Barreraz (2 revisions)
- Plasma Clean (Gasonics 2000) (2 revisions)
- ASML Stepper 3: Wafer Handler Reset Procedure (2 revisions)
- Vacuum Oven (YES) (3 revisions)
- Mike Day (3 revisions)
- ASML 5500: Recovering from a Typo in Reticle ID (3 revisions)
- Vapor HF Etch (uETCH) (3 revisions)
- Nanofab New User Onboarding (3 revisions)
- Sputter 1 (Custom) (3 revisions)
- Foong Fatt (3 revisions)
- Glossary (3 revisions)
- Video Training: Hosting with Zoom and GacuhoCast/Panopto (3 revisions)
- Nick test (3 revisions)
- User Accessible Commands (3 revisions)
- MVD - Wafer Coating - Process Traveler (3 revisions)
- Vacuum Sealer (3 revisions)
- ASML Stepper 3 Dicing Guide Programming (3 revisions)
- Ellipsometer (Woollam) - Measuring thin metals with oxide pre-measurement (3 revisions)
- ADT UV-Tape Table 1042R (3 revisions)
- Test Data of Etching SiO2 with CHF3/CF4-Florine ICP Etcher (3 revisions)
- PECVD1-SiN standard recipe.pdf (3 revisions)
- Test Data of etching SiO2 with CHF3/CF4-Florine ICP Etcher (3 revisions)
- Logitech WBS7 - Procedure for Wax Mounting with Spin-On Crystalbond (3 revisions)
- Ellipsometer (Rudolph) (3 revisions)
- DS-K101-304 Bake Temp. versus Develop Rate (3 revisions)
- Gold surface oxidation (darkening) due to O2/N2 plasma; the need for O2 only recipe. (3 revisions)
- MLA Recipes (3 revisions)
- Wire Saw (Takatori) (3 revisions)
- Critical Point Dryer (4 revisions)
- Test Data of etching SiO2 with CHF3/CF4-Florine (4 revisions)
- Photolithography - Improving Adhesion Photoresist Adhesion (4 revisions)
- KLA Tencor P7 - Basic profile instructions (4 revisions)
- Jack Whaley (4 revisions)
- Peder Lenvik (4 revisions)
- Claudia Gutierrez (4 revisions)
- Suss MA-6 Backside Alignment QuickStart (4 revisions)
- Gold Plating Bench (4 revisions)
- Electronics Presentations (4 revisions)
- Tube Furnace AlGaAs Oxidation (Lindberg) (4 revisions)
- GCA 6300 Reboot Procedures (4 revisions)
- MLA150 - Large Image GDS Generation (4 revisions)
- Vraj Mehalana (4 revisions)
- Wafer Scanning process Traveler (4 revisions)
- ASML DUV: Edge Bead Removal via Photolithography (4 revisions)
- Laser Etch Monitor Simulation in Python (4 revisions)
- Filmetrics F10-RT-UVX Operating Procedure (4 revisions)
- Tino Sy (5 revisions)
- Old Training Manual (5 revisions)
- News Feed (5 revisions)
- Spin Rinse Dryer (SemiTool) (5 revisions)
- Old Deposition Data - 2021-12-15 (5 revisions)
- Mechanical Polisher (Allied) (5 revisions)
- Sputter 2 (SFI Endeavor) (5 revisions)
- PubList2018 (5 revisions)
- Goniometer (Rame-Hart A-100) - Operating Procedure (5 revisions)
- Thermal Evaporator 1 (5 revisions)
- Lift-Off with I-Line Imaging Resist + LOL2000 Underlayer (5 revisions)
- Wafer Cleaver (PELCO Flip-Scribe) (6 revisions)