Difference between revisions of "Tool List"

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=Dry Etch=
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= Dry Etch =
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{|
 
{|
|-valign="top"
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|- valign="top"
|width=300|
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| width="300" |  
* [[RIE 1 (Custom)]]
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*[[RIE 1 (Custom)]]  
* [[RIE 2 (MRC)]]
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*[[RIE 2 (MRC)]]  
* [[RIE 3 (MRC)]]
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*[[RIE 3 (MRC)]]  
* [[RIE 5 (PlasmaTherm SLR)]]
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*[[RIE 5 (PlasmaTherm SLR)]]  
* [[Si Deep RIE (Bosch Etch)]]
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*[[Si Deep RIE (Bosch Etch)]]  
* [[Ashers (Technics PEII]]
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*[[Ashers (Technics PEII]]  
* [[Unaxis VLR ICP-Etch]]
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*[[Unaxis VLR ICP-Etch]]
|width=400|
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* [[ICP Etch 1 (Panasonic E620)]]
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| width="400" |  
* [[ICP Etch 2 (Panasonic E626)]]
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*[[ICP Etch 1 (Panasonic E620)]]  
* [[UV Ozone Reactor]]
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*[[ICP Etch 2 (Panasonic E626)]]  
* [[Plasma Clean (Gasonics 2000)]]
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*[[UV Ozone Reactor]]  
* [[XeF2 Etch (Xetch)]]
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*[[Plasma Clean (Gasonics 2000)]]  
* [[Plasma Activation Tool (EVG 810)]]
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*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]  
* [[HF Vapor Etch]]
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*[[Plasma Activation Tool (EVG 810)]]  
|-
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*[[HF Vapor Etch]]
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Revision as of 20:43, 30 June 2012

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization