Plasma Activation (EVG 810)

Plasma Activation (EVG 810) Location Bay 7 Tool Type Dry Etch Manufacturer EVG Group Description Plasma Surface Activation Primary Supervisor Lee Sawyer (805) 893-2123 lee_sawyer@ucsb.edu Secondary Supervisor Aidan Hopkins Recipes Dry Etch RecipesN/A SignupMonkey: Sign up for this tool

About

This a capacitively coupled Oxygen plasma activation system used exclusively for the surface activation of clean surfaces prior to wafer bonding. This technique allows bonding temperatures to be lowered and is used as a companion tool to the Karl-Suss SB6 wafer bond tool.

Detailed Specifications

• Gases used: O₂ and N₂
• Sample size: pieces to 6” wafer
• Recipes characterized for substrate thicknesses between 250um and 750um. Thicknesses outside of this range need to have parameters optimized to minimize reflective power.

Documentation

• Plasma Activation Standard Operating Procedure
• How to copy recipes

Recipes

Please see the Oxygen Plasma Recipe page for standard EVG recipes.