Difference between revisions of "Tool List"
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(→Inspection, Test and Characterization: rearranged, moved "other properties" to end, renamed "Surfscan" to "particle counts") |
(→Vacuum Deposition: Added SEM Hummer coater, adn Thermal Evap heading) |
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− | + | ====Physical Vapor Deposition (PVD)==== |
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+ | |||
+ | ===== Thermal Evaporation ===== |
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*[[E-Beam 1 (Sharon)]] |
*[[E-Beam 1 (Sharon)]] |
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*[[Sputter 5 (AJA ATC 2200-V)]] |
*[[Sputter 5 (AJA ATC 2200-V)]] |
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*[[Ion Beam Deposition (Veeco NEXUS)]] |
*[[Ion Beam Deposition (Veeco NEXUS)]] |
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+ | * [[SEM Sample Coater (Hummer)]] |
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| width="400" | |
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*[[CAIBE (Oxford Ion Mill)]] |
*[[CAIBE (Oxford Ion Mill)]] |
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+ | *[[Focused Ion-Beam Lithography (Raith Velion)]] |
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=====Other Dry Etching===== |
=====Other Dry Etching===== |
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**[[Vacuum Oven (YES)]] |
**[[Vacuum Oven (YES)]] |
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**[[High Temp Oven (Blue M)]] |
**[[High Temp Oven (Blue M)]] |
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=Packaging= |
=Packaging= |
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+ | {| |
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+ | ====Die Singulation / Down-sizing==== |
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*[[Dicing Saw (ADT)]] |
*[[Dicing Saw (ADT)]] |
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+ | *[[Wafer Cleaver (PELCO Flip-Scribe)|Wafer Cleaver (PELCO Flipscribe)]] |
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+ | |||
+ | ====Other Packaging==== |
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+ | |||
*[[Vacuum Sealer]] |
*[[Vacuum Sealer]] |
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+ | ====Wafer/Die Bonding==== |
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+ | |||
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+ | |||
+ | *[[Wafer Bonder (SUSS SB6-8E)]] |
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+ | *[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]] |
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=Inspection, Test and Characterization= |
=Inspection, Test and Characterization= |
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*[[Ellipsometer (Woollam)]] |
*[[Ellipsometer (Woollam)]] |
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− | *[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]] |
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*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]] |
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]] |
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− | *[[Optical Film Thickness (Nanometric)]] |
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*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]] |
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]] |
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*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]] |
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]] |
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*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]] |
*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]] |
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− | ====== |
+ | ======Other Properties====== |
*[[Film Stress (Tencor Flexus)]] |
*[[Film Stress (Tencor Flexus)]] |
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*[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]] |
*[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]] |
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**''Surface hydrophobicity'' |
**''Surface hydrophobicity'' |
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Revision as of 06:46, 22 June 2022
Lithography
Photoresists and Lithography ChemicalsContact Aligners (Optical Exposure)Direct-Write Lithography
Other Patterning Systems |
Steppers (Optical Exposure)Thermal Processing for Photolithography
Lithography Support
|
Vacuum Deposition
Physical Vapor Deposition (PVD)Thermal Evaporation
Sputter Deposition |
Chemical Vapor Deposition (CVD) |
Dry Etch
Reactive Ion Etching (RIE)Plasma Etching and Cleaning
Etch Monitoring
|
ICP-RIE
Ion Milling and Reactive Ion Beam EtchingOther Dry Etching |
Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.
Thermal Processing
Packaging
Die Singulation / Down-sizingOther Packaging |
Wafer/Die Bonding |
Inspection, Test and Characterization
Optical Microscopy
Electron MicroscopyTopographical Metrology |
Thin-Film/Material AnalysisThickness + Optical Constants
Electrical AnalysisOther Properties |