Pages without language links
Jump to navigation
Jump to search
The following pages do not link to other language versions.
Showing below up to 100 results in range #201 to #300.
View (previous 100 | next 100) (20 | 50 | 100 | 250 | 500)
- PECVD 2 (Advanced Vacuum)
- PECVD Recipes
- Packaging Recipes
- Peder Lenvik
- Photolithography - Improving Adhesion Photoresist Adhesion
- Photolithography - Manual Edge-Bead Removal Techniques
- Photoluminescence PL Setup (Custom)
- Photomask Ordering Procedure for UCSB Users
- Photonics Presentations
- Plasma Activation (EVG 810)
- Plasma Clean (Gasonics 2000)
- Plasma Clean (YES EcoClean)
- Probe Station: I-V Curves with Keithley 2400 and Python Script
- Probe Station & Curve Tracer
- ProcessGroup: Shipping Samples on Dicing Tape+Frame
- Process Group - Billing Instructions
- Process Group - Lab Stocking/Supplies Tasks
- Process Group - Process Control Data
- Process Group - Remote Fabrication Jobs
- Programming a Job
- PubList2018
- Publications - 2013-2014
- RIE5 - Standard Operating procedure (Cortex Software)
- RIE 1 (Custom)
- RIE 2 (MRC)
- RIE 3 (MRC)
- RIE 5 (PlasmaTherm)
- RIE Etching Recipes
- Rapid Thermal Processor (AET RX6)
- Rapid Thermal Processor (SSI Solaris 150)
- Research
- Resistivity Mapper (CDE RESMAP)
- S-Cubed Flexi - Operating Procedure
- SEM 1 (JEOL IT800SHL)
- SEM Sample Coater (Hummer)
- SPR220-7 at 3kW various temperature without N2 gas
- STD SiO2 recipe
- Services
- SiN 100C Table-2019
- SiO2 Etching Test using CF4/CHF3
- Spin Rinse Dryer (SemiTool)
- Sputter 1 (Custom)
- Sputter 2 (SFI Endeavor)
- Sputter 3 (AJA ATC 2000-F)
- Sputter 4 (AJA ATC 2200-V)
- Sputter 5
- Sputter 5 (AJA ATC 2200-V)
- Sputtering Recipes
- Staff List
- Step Profilometer (DektakXT)
- Step Profilometer (KLA Tencor P-7)
- Stepper 1 (GCA6300) How to select proper chuck
- Stepper 1 (GCA 6300)
- Stepper 1 (GCA 6300) - Standard Operating Procedure
- Stepper 1 (GCA 6300) Available chucks
- Stepper 1 (GCA 6300) Substrate Thickness, Shim Thickness ans Target Thickness
- Stepper 2 (AutoStep 200)
- Stepper 2 (AutoStep 200) - Operating Procedure - Piece Parts
- Stepper 2 (AutoStep 200) Operating Procedures
- Stepper 2 (Autostep 200) - Chuck Selection
- Stepper 2 (Autostep 200) - Piece vs. Wafer Programming Differences
- Stepper 2 (Autostep 200) - Table of Chucks, Shims, Target Thicknesses
- Stepper 3 (ASML DUV)
- Stepper Recipes
- Stocked Chemical List
- Strip Annealer
- Surface Analysis (KLA/Tencor Surfscan)
- Surfscan6200 photos
- Surfscan Errors and Workarounds
- Surfscan photo
- Suss Aligners (SUSS MJB-3)
- Suss MA-6 Backside Alignment QuickStart
- TEST PAGE
- THz Physics Presentations
- Tech Talks Seminar Series
- Test Data of Etching SiO2 with CHF3/CF4-Florine ICP Etcher
- Test Data of Etching SiO2 with CHF3/CF4-Fluorine ICP Etcher
- Test Data of etching SiO2 with CHF3/CF4
- Test Data of etching SiO2 with CHF3/CF4-Florine
- Test Data of etching SiO2 with CHF3/CF4-Florine ICP Etcher
- Test Data of etching SiO2 with CHF3/CF4-ICP1
- Test Data of etching SiO2 with CHF3/CF4/O2
- Test Data of etching SiO2 with CHF3/CF4/O2 (using this recipe only for Fluorine etch of the underneath layer)
- Test Page
- Thermal Evap 1
- Thermal Evap 2 (Solder)
- Thermal Evaporation Recipes
- Thermal Evaporator 1
- Thermal Evaporator 2
- Thermal Processing Recipes
- Tino Sy
- Tom Reynolds
- Tony Bosch
- Tool List
- Troubleshooting and Recovery
- Tube Furnace (Tystar 8300)
- Tube Furnace AlGaAs Oxidation (Lindberg)
- Tube Furnace Wafer Bonding (Thermco)
- UCSBTEST1Gain4.jpg
- UCSB NanoFab Microscope Training