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Showing below up to 100 results in range #151 to #250.
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- Optical Film Thickness (Filmetrics) (07:27, 13 May 2022)
- Optical Film Thickness (Nanometric) (07:30, 13 May 2022)
- Brian Lingg (16:59, 18 June 2022)
- Hummer SEM Sample Coater - Techniques to reduce charging in SEMs (06:41, 22 June 2022)
- Vacuum Deposition Recipes (15:44, 7 July 2022)
- MLA150 - Large Image GDS Generation (16:45, 29 July 2022)
- E-Beam Lithography System (JEOL JBX-6300FS) (23:28, 14 August 2022)
- Luis Zuzunaga (10:34, 18 August 2022)
- Dan Read (08:44, 20 August 2022)
- Ovens - Overview of All Lab Ovens (09:41, 24 August 2022)
- ASML Stepper 3: Wafer Handler Reset Procedure (16:28, 24 August 2022)
- Equipment Group - Video Training Procedures (09:55, 25 August 2022)
- Laser Scanning Confocal M-scope (Olympus LEXT) (09:30, 30 August 2022)
- IR Thermal Microscope (QFI) (09:37, 30 August 2022)
- Oven 5 (Labline) (10:21, 30 August 2022)
- Thermal Evap 1 (10:28, 30 August 2022)
- Thermal Evap 2 (Solder) (10:29, 30 August 2022)
- PECVD 1 (PlasmaTherm 790) (10:30, 30 August 2022)
- PECVD 2 (Advanced Vacuum) (10:30, 30 August 2022)
- Molecular Vapor Deposition (10:34, 30 August 2022)
- Sputter 3 (AJA ATC 2000-F) (10:36, 30 August 2022)
- Sputter 4 (AJA ATC 2200-V) (10:37, 30 August 2022)
- RIE 3 (MRC) (10:42, 30 August 2022)
- Vapor HF Etch (10:53, 30 August 2022)
- Spin Rinse Dryer (SemiTool) (11:02, 30 August 2022)
- Chemical-Mechanical Polisher (Logitech) (11:03, 30 August 2022)
- Tube Furnace AlGaAs Oxidation (Lindberg) (11:13, 30 August 2022)
- Vacuum Sealer (11:21, 30 August 2022)
- Flip-Chip Bonder (Finetech) (11:22, 30 August 2022)
- Digital Microscope (Olympus DSX1000) (11:49, 30 August 2022)
- Atomic Force Microscope (Bruker ICON) (11:57, 30 August 2022)
- Film Stress (Tencor Flexus) (11:58, 30 August 2022)
- Deep UV Optical Microscope (Olympus) (07:24, 31 August 2022)
- Lift-Off with I-Line Imaging Resist + LOL2000 Underlayer (14:58, 31 August 2022)
- Michael Barreraz (10:03, 7 September 2022)
- High Temp Oven (Blue M) (10:33, 8 September 2022)
- E-Beam 3 (Temescal) (12:11, 8 September 2022)
- CC-PRIME OnBoarding 2022-08 (09:58, 9 September 2022)
- Optical Film Thickness & Wafer-Mapping (Filmetrics F50) (10:03, 13 September 2022)
- Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX) (10:04, 13 September 2022)
- Oven 4 (Thermo-Fisher HeraTherm) (16:25, 13 September 2022)
- Ovens 1, 2 & 3 (Labline) (17:09, 13 September 2022)
- Sputter 5 (AJA ATC 2200-V) (15:50, 16 September 2022)
- SEM Sample Coater (Hummer) (15:10, 21 September 2022)
- Filmetrics F40-UV Microscope-Mounted (14:28, 29 September 2022)
- ICP-Etch (Unaxis VLR) (16:31, 29 September 2022)
- Chemical List (13:26, 4 October 2022)
- ASML DUV: Edge Bead Removal via Photolithography (23:06, 4 October 2022)
- DUMMY TOOL (01:11, 19 October 2022)
- E-Beam Evaporation Recipes (11:59, 25 October 2022)
- KLA Tencor P7 - Basic profile instructions (15:20, 2 November 2022)
- S-Cubed Flexi - Operating Procedure (14:39, 8 November 2022)
- Automated Coat/Develop System (S-Cubed Flexi) (14:41, 8 November 2022)
- Ashers (Technics PEII) (13:06, 11 November 2022)
- Unaxis VLR Etch - Process Control Data (18:41, 21 November 2022)
- RIE 5 (PlasmaTherm) (10:54, 28 November 2022)
- Contact Alignment Recipes (12:20, 1 December 2022)
- Process Group - Remote Fabrication Jobs (16:52, 6 December 2022)
- Other Dry Etching Recipes (08:17, 9 December 2022)
- Wafer Cleaver (PELCO Flip-Scribe) (07:57, 13 December 2022)
- Test Data of Etching SiO2 with CHF3/CF4-Fluorine ICP Etcher (15:03, 9 January 2023)
- Test Data of etching SiO2 with CHF3/CF4 (13:15, 11 January 2023)
- Test Data of etching SiO2 with CHF3/CF4-ICP1 (09:54, 12 January 2023)
- Oxford ICP Etcher - Process Control Data (15:38, 12 January 2023)
- Foong Fatt (11:24, 1 February 2023)
- Probe Station & Curve Tracer (13:23, 10 February 2023)
- COVID-19 User Policies (16:56, 13 February 2023)
- Research (17:49, 16 February 2023)
- Probe Station: I-V Curves with Keithley 2400 and Python Script (15:01, 21 February 2023)
- Atomic Layer Deposition (Oxford FlexAL) (14:56, 8 March 2023)
- Oxford Etcher - Sample Size Effect on Etch Rate (16:05, 20 March 2023)
- E-Beam 5 (Plasys) (10:13, 21 March 2023)
- E-Beam Lithography Recipes (15:33, 4 April 2023)
- E-Beam 4 (CHA) (12:04, 11 April 2023)
- Lab Rules (10:16, 12 April 2023)
- Mike Silva (08:31, 14 April 2023)
- Peder Lenvik (09:05, 14 April 2023)
- ASML Stepper 3 Standard Operating Procedure (13:59, 23 April 2023)
- Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick (10:52, 26 April 2023)
- Ellipsometer (Woollam) - Measuring thin dielectrics with Native Oxide pre-measurement (12:44, 26 April 2023)
- Oxford ICP Etcher (PlasmaPro 100 Cobra) (23:33, 4 May 2023)
- Step Profilometer (DektakXT) (21:51, 10 May 2023)
- Mechanical Polisher (Allied) (09:06, 15 May 2023)
- ICP-PECVD (Unaxis VLR) (10:35, 23 May 2023)
- YES-SPR220-Various-Temps (09:53, 5 June 2023)
- SPR220-7 at 3kW various temperature without N2 gas (10:01, 5 June 2023)
- Gold surface oxidation (darkening) due to O2/N2 plasma; the need for O2 only recipe. (16:22, 9 June 2023)
- Comparison of ash rate for different gas mixtures, especially between O2 only vs O2/N2 mixture. (16:33, 9 June 2023)
- Rapid Thermal Processor (AET RX6) (08:58, 15 June 2023)
- Atomic Layer Deposition Recipes (10:27, 15 June 2023)
- RIE 2 (MRC) (07:55, 21 July 2023)
- Wafer Cleaver Recipes (LSD-155LT) (15:12, 15 August 2023)
- Vraj Mehalana (09:23, 23 August 2023)
- E-Beam 2 (Custom) (11:31, 25 August 2023)
- UV Ozone Reactor (09:17, 29 August 2023)
- Nanofab-IT - Add Device to Network (11:52, 30 August 2023)
- NanoFab Process Group (16:46, 11 September 2023)
- Stepper 2 (Autostep 200) - Chuck Selection (13:17, 13 September 2023)
- Stepper 2 (Autostep 200) - Table of Chucks, Shims, Target Thicknesses (13:39, 13 September 2023)
- ASML Stepper 3 Error Recovery, Troubleshooting and Calibration (10:36, 15 September 2023)