Difference between revisions of "Tool List"

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(Lithography)
(Packaging)
Line 97: Line 97:
   
 
=Packaging=
 
=Packaging=
  +
* [[Dicing Saw (ADT)]]
 
* [[Flip-Chip Bonder (Finetech)]]
 
* [[Flip-Chip Bonder (Finetech)]]
 
* [[Vacuum Sealer]]
 
* [[Vacuum Sealer]]
* [[Dicing Saw (ADT)]]
 
* [[Wire Saw (Takatori)]]
 
 
* [[Wafer Bonder (SUSS SB6-8E)]]
 
* [[Wafer Bonder (SUSS SB6-8E)]]
  +
* [[Wire Saw (Takatori)]]
   
 
=Inspection, Test and Characterization=
 
=Inspection, Test and Characterization=

Revision as of 10:55, 11 July 2012

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization