Difference between revisions of "Tool List"
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(Created page with "__NOTOC__ =Lithography= * Suss Aligners * IR Aligner * DUV Flood Expose * Ovens * Stepper 1 * Stepper 2 * Stepper 3 * E-Beam Lithography System =…") |
(added S-Cubed Flexi to Wet processing tools as well) |
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__NOTOC__ |
__NOTOC__ |
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=Lithography= |
=Lithography= |
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+ | |||
− | * [[Suss Aligners]] |
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+ | {| |
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− | * [[IR Aligner]] |
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+ | |- valign="top" |
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− | * [[DUV Flood Expose]] |
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+ | | width="300" | |
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− | * [[Ovens]] |
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+ | =====Photoresists and Lithography Chemicals===== |
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− | * [[Stepper 1]] |
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+ | |||
− | * [[Stepper 2]] |
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+ | *See the [https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page]. |
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− | * [[Stepper 3]] |
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+ | *[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]] |
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− | * [[E-Beam Lithography System]] |
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+ | |||
+ | =====Contact Aligners (Optical Exposure)===== |
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+ | |||
+ | *[[Suss Aligners (SUSS MJB-3)]] |
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+ | *[[IR Aligner (SUSS MJB-3 IR)]] |
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+ | *[[Contact Aligner (SUSS MA-6)]] |
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+ | *[[DUV Flood Expose]] |
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+ | |||
+ | =====Other Patterning Systems===== |
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+ | |||
+ | *[[E-Beam Lithography System (JEOL JBX-6300FS)]] |
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+ | *[[Nano-Imprint (Nanonex NX2000)]] |
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+ | *[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]] |
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+ | | width="400" | |
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+ | =====Steppers (Optical Exposure)===== |
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+ | |||
+ | *[[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]] |
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+ | *[[Stepper 2 (AutoStep 200)|Stepper 2 (AutoStep 200, i-line)]] |
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+ | *[[Stepper 3 (ASML DUV)|Stepper 3 (ASML DUV, Deep-UV)]] |
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+ | |||
+ | =====Thermal Processing for Photolithography===== |
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+ | |||
+ | *[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all lab ovens]] |
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+ | *[[Ovens 1, 2 & 3 (Labline)]] |
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+ | *[[Oven 4 (Fisher)]] |
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+ | *[[Oven 5 (Labline)]] |
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+ | *[[High Temp Oven (Blue M)]] |
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+ | *[[Vacuum Oven (YES)]] |
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+ | *The [https://www.nanotech.ucsb.edu/wiki/index.php/Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes. |
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+ | |- |
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+ | |} |
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=Vacuum Deposition= |
=Vacuum Deposition= |
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+ | |||
− | * [[E-Beam Evaporator 1]] |
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+ | {| |
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− | * [[E-Beam Evaporator 2]] |
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+ | |- valign="top" |
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− | * [[E-Beam Evaporator 3]] |
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+ | | width="300" | |
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− | * [[E-Beam Evaporator 4]] |
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+ | =====Physical Vapor Deposition (PVD)===== |
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− | * [[Sputter Tool 1]] |
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+ | |||
− | * [[Sputter Tool 2]] |
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− | * |
+ | *[[E-Beam 1 (Sharon)]] |
− | * |
+ | *[[E-Beam 2 (Custom)]] |
− | * |
+ | *[[E-Beam 3 (Temescal)]] |
− | * |
+ | *[[E-Beam 4 (CHA)]] |
− | * |
+ | *[[Thermal Evap 1]] |
− | * |
+ | *[[Thermal Evap 2 (Solder)]] |
+ | |||
− | * [[IBD]] |
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− | + | =====Sputter Deposition===== |
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+ | |||
− | * [[Atomic Layer Deposision]] |
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+ | *[[Sputter 3 (AJA ATC 2000-F)]] |
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+ | *[[Sputter 4 (AJA ATC 2200-V)]] |
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+ | *[[Sputter 5 (AJA ATC 2200-V)]] |
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+ | *[[Ion Beam Deposition (Veeco NEXUS)]] |
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+ | |||
+ | | width="400" | |
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+ | =====Chemical Vapor Deposition (CVD)===== |
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+ | |||
+ | *[[PECVD 1 (PlasmaTherm 790)]] |
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+ | *[[PECVD 2 (Advanced Vacuum)]] |
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+ | *[[ICP-PECVD (Unaxis VLR)]] |
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+ | *[[Molecular Vapor Deposition]] |
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+ | *[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]] |
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+ | |||
+ | |} |
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=Dry Etch= |
=Dry Etch= |
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+ | |||
− | * [[RIE 1]] |
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+ | {| |
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− | * [[RIE 2]] |
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+ | |- valign="top" |
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− | * [[RIE 3]] |
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+ | | width="300" | |
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− | * [[RIE 5]] |
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+ | =====Reactive Ion Etching (RIE)===== |
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− | * [[Si Deep RIE]] |
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+ | |||
− | * [[Ashers]] |
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− | * |
+ | *[[RIE 2 (MRC)]] |
− | * |
+ | *[[RIE 3 (MRC)]] |
− | * |
+ | *[[RIE 5 (PlasmaTherm)]] |
− | * |
+ | *[[Ashers (Technics PEII)]] |
− | * |
+ | *[[Plasma Clean (Gasonics 2000)]] |
+ | *[[Plasma Clean (YES EcoClean)]] |
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− | * [[XeF2 Etch]] |
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− | * |
+ | *[[Plasma Activation (EVG 810)]] |
+ | *[[CAIBE (Oxford Ion Mill)]] |
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+ | |||
+ | =====Etch Monitoring===== |
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+ | |||
+ | *[[Laser Etch Monitoring]] (Endpoint Detection) |
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+ | *Optical Emission Spectra |
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+ | *Residual Gas Analyzer (RGA) |
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+ | | width="400" | |
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+ | =====ICP-RIE===== |
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+ | |||
+ | *[[ICP Etch 1 (Panasonic E626I)]] |
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+ | *[[ICP Etch 2 (Panasonic E640)]] |
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+ | *[[ICP-Etch (Unaxis VLR)]] |
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+ | *[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]] |
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+ | *[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]] |
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+ | |||
+ | =====Other Dry Etching===== |
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+ | |||
+ | *[[UV Ozone Reactor]] |
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+ | *[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]] |
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+ | *[[Vapor HF Etch]] |
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+ | |||
+ | |} |
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=Wet Processing= |
=Wet Processing= |
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+ | See the [[Chemical List|Chemical List page]] for stocked chemicals such as Developers, Etchants, Solvents etc. |
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− | * [[Wet Benches]] |
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+ | {| |
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− | * [[Gold Plating Bench]] |
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+ | |- valign="top" |
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− | * [[Critical Point Dryer]] |
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+ | | width="300" | |
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− | * [[Spin Rinse Dryer]] |
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+ | *[[Wet Benches]] |
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+ | **[[Solvent Cleaning Benches]] |
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+ | **[[Spin Coat Benches]] |
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+ | **[[Develop Benches]] |
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+ | **[[Toxic Corrosive Benches]] |
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+ | **[[HF/TMAH Processing Benches]] |
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+ | **[[Plating Bench]] |
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+ | | width="400" | |
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+ | *[[Gold Plating Bench]] |
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+ | *[[Critical Point Dryer]] |
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+ | *[[Spin Rinse Dryer (SemiTool)]] |
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+ | *[[Chemical-Mechanical Polisher (Logitech)]] |
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+ | *[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]] |
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+ | |- |
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+ | |} |
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=Thermal Processing= |
=Thermal Processing= |
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+ | {| |
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− | * [[Wet Benches]] |
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+ | |- valign="top" |
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− | * [[Gold Plating Bench]] |
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+ | | width="400" | |
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− | * [[Critical Point Dryer]] |
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+ | *[[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]] |
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− | * [[Spin Rinse Dryer]] |
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+ | *[[Rapid Thermal Processor (SSI Solaris 150)]] |
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+ | *[[Tube Furnace (Tystar 8300)]] |
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+ | *[[Tube Furnace Wafer Bonding (Thermco)]] |
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+ | *[[Tube Furnace AlGaAs Oxidation (Lindberg)]] |
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+ | *[[Wafer Bonder (SUSS SB6-8E)]] |
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+ | *[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]] |
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+ | | width="400" | |
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+ | *[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all Lab Ovens]] |
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+ | **[[Ovens 1, 2 & 3 (Labline)]] |
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+ | **[[Oven 4 (Thermo-Fisher HeraTherm)]] |
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+ | **[[Oven 5 (Labline)]] |
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+ | **[[Vacuum Oven (YES)]] |
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+ | **[[High Temp Oven (Blue M)]] |
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+ | |- |
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+ | |} |
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=Packaging= |
=Packaging= |
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+ | |||
− | * [[Flip-Chip Bonder]] |
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− | * |
+ | *[[Dicing Saw (ADT)]] |
+ | *[[Flip-Chip Bonder (Finetech)]] |
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− | * [[Dicing Saw]] |
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+ | *[[Vacuum Sealer]] |
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+ | *[[Wire Saw (Takatori)]] |
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=Inspection, Test and Characterization= |
=Inspection, Test and Characterization= |
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+ | {| |
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− | * [[Field Emission SEM 1]] |
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+ | |- valign="top" |
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− | * [[Field Emission SEM 2]] |
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+ | | width="300" | |
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− | * [[Step Profile]] |
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+ | =====Optical/Electron Microscopy===== |
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− | * [[Step Profilometer]] |
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+ | |||
− | * [[Ellipsometer]] |
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− | * |
+ | *[[Microscopes|Optical Microscopes]] |
+ | *[[Fluorescence Microscope (Olympus MX51)]] |
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− | * [[Probe Station & Curve Tracer]] |
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− | * |
+ | *[[Deep UV Optical Microscope (Olympus)]] |
− | * |
+ | *[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
+ | *[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]] |
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− | * [[Tencor Flexus Film Stress]] |
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− | * |
+ | *[[Field Emission SEM 1 (FEI Sirion)]] |
− | * |
+ | *[[Field Emission SEM 2 (JEOL 7600F)]] |
+ | *[[SEM Sample Coater (Hummer)]] |
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− | * [[Surface Analysis]] |
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+ | |||
− | * [[Photo-emission & IR Microscope]] |
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+ | =====Topographical Metrology===== |
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− | * [[Ellipsometer (Woollam)]] |
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+ | |||
− | * [[Goniometer]] |
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+ | *[[Step Profilometer (KLA Tencor P-7)]] |
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− | * [[4-Point Probe Resistivity Mapper]] |
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+ | *[[Step Profilometer (Dektak 6M)]] |
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+ | *[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]] |
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+ | *[[Surface Analysis (KLA/Tencor Surfscan)]] |
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+ | **''Sub-micron Particle Counter'' |
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+ | *[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
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+ | *[[Optical Profilometer - White-Light/Phase-Shift Interference (Filmetrics Profilm3D)]] |
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+ | | width="400" | |
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+ | =====Thin-Film Analysis/Measurement===== |
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+ | |||
+ | *[[Ellipsometer (Woollam)]] |
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+ | *[[Film Stress (Tencor Flexus)]] |
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+ | *[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]] |
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+ | *[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]] |
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+ | *[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]] |
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+ | *[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]] |
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+ | *[[Optical Film Thickness (Nanometric)]] |
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+ | *[[Resistivity Mapper (CDE RESMAP)]] |
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+ | |||
+ | =====Other Tools===== |
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+ | |||
+ | *[[Probe Station & Curve Tracer]] |
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+ | *[[Goniometer]] |
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+ | *[[Photoluminescence PL Setup (Custom)]] |
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+ | |- |
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+ | |} |
Revision as of 16:05, 8 October 2019
Lithography
Photoresists and Lithography ChemicalsContact Aligners (Optical Exposure)Other Patterning Systems |
Steppers (Optical Exposure)Thermal Processing for Photolithography
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Vacuum Deposition
Physical Vapor Deposition (PVD)
Sputter Deposition |
Chemical Vapor Deposition (CVD) |
Dry Etch
Reactive Ion Etching (RIE)
Etch Monitoring
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ICP-RIE
Other Dry Etching |
Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.