Difference between revisions of "Tool List"
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(→Packaging: added sub-categories, Linked to new LatticeAx tool) |
(→Die Singulation / Down-sizing: changed name to Flipscribe from LatticeAx. LatticeAx is a different product) |
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− | ==== Die Singulation / Down-sizing ==== | + | ====Die Singulation / Down-sizing==== |
*[[Dicing Saw (ADT)]] | *[[Dicing Saw (ADT)]] | ||
− | *[[Wafer Cleaver (PELCO LatticeAx)]] | + | *[[Wafer Cleaver (PELCO LatticeAx)|Wafer Cleaver (PELCO Flipscribe)]] |
− | ==== Other Packaging ==== | + | ====Other Packaging==== |
*[[Vacuum Sealer]] | *[[Vacuum Sealer]] | ||
| | | | ||
− | ==== Wafer/Die Bonding ==== | + | ====Wafer/Die Bonding==== |
− | * [[Flip-Chip Bonder (Finetech)]] | + | *[[Flip-Chip Bonder (Finetech)]] |
*[[Wafer Bonder (SUSS SB6-8E)]] | *[[Wafer Bonder (SUSS SB6-8E)]] |
Revision as of 12:11, 1 March 2022
Lithography
Photoresists and Lithography ChemicalsContact Aligners (Optical Exposure)Direct-Write Lithography
Other Patterning Systems |
Steppers (Optical Exposure)Thermal Processing for Photolithography
Lithography Support
|
Vacuum Deposition
Physical Vapor Deposition (PVD)
Sputter Deposition |
Chemical Vapor Deposition (CVD) |
Dry Etch
Reactive Ion Etching (RIE)Plasma Etching and Cleaning
Etch Monitoring
|
ICP-RIE
Ion Milling and Reactive Ion Beam EtchingOther Dry Etching |
Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.
Thermal Processing
Packaging
Die Singulation / Down-sizingOther Packaging |
Wafer/Die Bonding |
Inspection, Test and Characterization
Optical Microscopy
Electron MicroscopyTopographical Metrology |
Thin-Film/Material AnalysisThickness + Optical Constants
Electrical AnalysisOther Properties |