Difference between revisions of "Tool List"

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(→‎Vacuum Deposition: Added SEM Hummer coater, adn Thermal Evap heading)
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====Physical Vapor Deposition (PVD)====
 
====Physical Vapor Deposition (PVD)====
  
===== Thermal Evaporation =====
+
=====Thermal Evaporation=====
  
 
*[[E-Beam 1 (Sharon)]]
 
*[[E-Beam 1 (Sharon)]]
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*[[Sputter 5 (AJA ATC 2200-V)]]
 
*[[Sputter 5 (AJA ATC 2200-V)]]
 
*[[Ion Beam Deposition (Veeco NEXUS)]]
 
*[[Ion Beam Deposition (Veeco NEXUS)]]
* [[SEM Sample Coater (Hummer)]]
+
*[[SEM Sample Coater (Hummer)]]
  
 
| width="400" |
 
| width="400" |
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=====Plasma Etching and Cleaning=====
 
=====Plasma Etching and Cleaning=====
  
*[[Plasma Clean (Gasonics 2000)]]
 
 
*[[Plasma Clean (YES EcoClean)]]
 
*[[Plasma Clean (YES EcoClean)]]
 
*[[Plasma Activation (EVG 810)]]
 
*[[Plasma Activation (EVG 810)]]

Revision as of 07:54, 16 August 2022

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)

Thermal Evaporation
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Die Singulation / Down-sizing

Other Packaging

Wafer/Die Bonding

Inspection, Test and Characterization

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Electrical Analysis
Other Properties