Difference between revisions of "Tool List"

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(Lithography: added POLOS spinners)
(Wet Processing: link to Mechanical_Polisher_(Allied))
 
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=====Photoresists and Lithography Chemicals=====
 
=====Photoresists and Lithography Chemicals=====
   
*See the [https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
+
*See the [https://wiki.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
 
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
 
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
   
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*[[DUV Flood Expose]]
 
*[[DUV Flood Expose]]
   
=====Other Patterning Systems=====
+
=====Direct-Write Lithography=====
   
 
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
 
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
  +
*[[Field Emission SEM 1 (FEI Sirion)|E-Beam Lithography (FEI Sirion Nabity v9)]]
*[[Nano-Imprint (Nanonex NX2000)]]
 
  +
*[[Focused Ion-Beam Lithography (Raith Velion)]]
  +
*[[Maskless Aligner (Heidelberg MLA150)]]
  +
  +
===== Other Patterning Systems =====
 
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
 
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
 
| width="400" |
 
| width="400" |
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*[[Vacuum Oven (YES)]]
 
*[[Vacuum Oven (YES)]]
   
===== Lithography Support =====
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=====Lithography Support=====
   
*The [https://www.nanotech.ucsb.edu/wiki/index.php/Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
+
*The [https://wiki.nanotech.ucsb.edu/wiki/index.php/Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
*POLOS spinners on Develop and Solvent benches
+
*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches
 
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]]
 
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]]
 
|-
 
|-
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*[[RIE 3 (MRC)]]
 
*[[RIE 3 (MRC)]]
 
*[[RIE 5 (PlasmaTherm)]]
 
*[[RIE 5 (PlasmaTherm)]]
  +
*[[Ashers (Technics PEII)]]
 
  +
=====Plasma Etching and Cleaning=====
  +
 
*[[Plasma Clean (Gasonics 2000)]]
 
*[[Plasma Clean (Gasonics 2000)]]
 
*[[Plasma Clean (YES EcoClean)]]
 
*[[Plasma Clean (YES EcoClean)]]
 
*[[Plasma Activation (EVG 810)]]
 
*[[Plasma Activation (EVG 810)]]
*[[CAIBE (Oxford Ion Mill)]]
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*[[Ashers (Technics PEII)]]
   
 
=====Etch Monitoring=====
 
=====Etch Monitoring=====
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*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
 
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
 
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
 
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
  +
  +
=====Ion Milling and Reactive Ion Beam Etching=====
  +
  +
*[[CAIBE (Oxford Ion Mill)]]
   
 
=====Other Dry Etching=====
 
=====Other Dry Etching=====
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*[[Spin Rinse Dryer (SemiTool)]]
 
*[[Spin Rinse Dryer (SemiTool)]]
 
*[[Chemical-Mechanical Polisher (Logitech)]]
 
*[[Chemical-Mechanical Polisher (Logitech)]]
  +
*[[Mechanical Polisher (Allied)]]
 
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
 
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
 
*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
 
*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
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**[[Vacuum Oven (YES)]]
 
**[[Vacuum Oven (YES)]]
 
**[[High Temp Oven (Blue M)]]
 
**[[High Temp Oven (Blue M)]]
  +
|
 
|-
 
|-
 
|}
 
|}
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|- valign="top"
 
|- valign="top"
 
| width="300" |
 
| width="300" |
=====Optical/Electron Microscopy=====
+
=====Optical Microscopy=====
   
 
*[[Microscopes|Optical Microscopes]]
 
*[[Microscopes|Optical Microscopes]]
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*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
 
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
  +
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
  +
  +
===== Electron Microscopy =====
 
*[[Field Emission SEM 1 (FEI Sirion)]]
 
*[[Field Emission SEM 1 (FEI Sirion)]]
 
*[[Field Emission SEM 2 (JEOL 7600F)]]
 
*[[Field Emission SEM 2 (JEOL 7600F)]]
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**''Sub-micron Particle Counter''
 
**''Sub-micron Particle Counter''
 
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
*[[Optical Profilometer - White-Light/Phase-Shift Interference (Filmetrics Profilm3D)]]
 
 
| width="400" |
 
| width="400" |
=====Thin-Film Analysis/Measurement=====
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=====Thin-Film/Material Analysis=====
   
  +
====== Thickness + Optical Constants ======
 
*[[Ellipsometer (Woollam)]]
 
*[[Ellipsometer (Woollam)]]
*[[Film Stress (Tencor Flexus)]]
 
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
 
 
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
 
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
  +
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
  +
*[[Optical Film Thickness (Nanometric)]]
 
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
 
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
 
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
 
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
  +
*[[Optical Film Thickness (Nanometric)]]
 
  +
====== Other Properties ======
  +
*[[Film Stress (Tencor Flexus)]]
  +
*[[Photoluminescence PL Setup (Custom)]]
  +
  +
====== Electrical Analysis ======
 
*[[Resistivity Mapper (CDE RESMAP)]]
 
*[[Resistivity Mapper (CDE RESMAP)]]
  +
*[[Probe Station & Curve Tracer]]
   
 
=====Other Tools=====
 
=====Other Tools=====
   
  +
*[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]]
*[[Probe Station & Curve Tracer]]
 
  +
**''Surface hydrophobicity''
*[[Goniometer]]
 
  +
|-
*[[Photoluminescence PL Setup (Custom)]]
 
  +
|
  +
|
 
|-
 
|-
 
|}
 
|}

Latest revision as of 11:38, 11 May 2021

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Inspection, Test and Characterization

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Other Properties
Electrical Analysis
Other Tools