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  • ASML DUV: Edge Bead Removal via Photolithography
    (This process can easily be transferred to I-Line photoresists, using the [[Contact Align ===Photo-EBR Process===
    1 KB (207 words) - 23:06, 4 October 2022
  • NanoFab Process Group
    .../wiki.nanotech.ucsb.edu/w/index.php?title=Staff_List#Process_Group NanoFab Process Group].'' ==Process Control Calibration Procedures==
    2 KB (297 words) - 16:46, 11 September 2023
  • Nanofab Staff Internal Pages
    ==Process Group== *[[Process Group - Remote Fabrication Jobs|'''Job Tracking''']] - pages to organize an
    2 KB (338 words) - 16:10, 9 April 2024
  • Photolithography - Improving Adhesion Photoresist Adhesion
    ==HMDS Process for PR Improving Adhesion== This process tends to improve adhesion between the substrate and subsequent photoresist
    1 KB (198 words) - 12:41, 10 February 2024
  • Homepage Draft1
    *[[:Category:Wet Processing|Wet Process]] *[[:Category:Thermal Processing|Thermal Process]]
    3 KB (370 words) - 13:59, 2 November 2023
  • Main Page
    *[[:Category:Wet Processing|Wet Process]] *[[:Category:Thermal Processing|Thermal Process]]
    3 KB (375 words) - 16:13, 12 March 2024
  • Nanofab Job Postings
    *A position in the "[[Staff List#Process Group|Process Group]]", led by [[Demis D. John]]. ...p - Process Control Data#Deposition .28Process Control Data.29|Deposition: Process Control data]].
    4 KB (607 words) - 11:48, 24 April 2024
  • Wafer Scanning process Traveler
    The wafers for process calibration are ordered from a wafer supplier that sells high grade, qualit === Scan before process calibration ===
    2 KB (339 words) - 11:31, 22 April 2020
  • Process Group - Process Control Data
    ...to) [https://en.wikipedia.org/wiki/Statistical_process_control Statistical Process Control]. ...inks found on individual tool pages, in the '''''Recipes > <<tool page>> > Process Control''''' section.
    10 KB (1,497 words) - 12:03, 24 April 2024
  • Biljana Stamenic
    ...r films in PECVD#1, Advanced PECVD#2, and Unaxis) to establish statistical process control. Biljana is holding trainings on tools: GCA 6300 Stepper#1, Autoste
    1 KB (191 words) - 16:07, 29 December 2023
  • UV Ozone Reactor
    ...clean surfaces can be achieved in less than one minute. In addition, this process does not damage any sensitive device structures of MOS gate oxide. The syst
    961 bytes (145 words) - 09:17, 29 August 2023
  • Wafer Scanning/Coating Process Traveler ( combined/less detailed)
    The wafers for process calibration are ordered from SVM (<nowiki>https://www.svmi.com/</nowiki>). === Wafer Coating Process traveler ===
    3 KB (515 words) - 13:41, 20 April 2020
  • Chemical-Mechanical Polisher (Logitech)
    ...is often unique in geometry and material combinations so that independent process development is required for most CMP applications.
    1 KB (148 words) - 11:03, 30 August 2022
  • RIE5 - Standard Operating procedure (Cortex Software)
    == Running a process on RIE #5 == # Choose the '''Process Menu''' located on bottom left corner of the screen. It's the one with the
    2 KB (377 words) - 14:09, 17 October 2018
  • Automated Coat/Develop System (S-Cubed Flexi)
    ...ns them to the cassette. The system is recipe driven with a high degree of process control and minimal backside contamination, and coats photoresists with low ...full size substrates are allowed on this system. The S3 Coater is still in process development and not open for general use.
    2 KB (340 words) - 14:41, 8 November 2022
  • Demis D. John
    |position = Process Scientist Manager ...uestion about your fabrication process, or are designing a new fabrication process
    3 KB (434 words) - 10:22, 18 June 2020
  • Tube Furnace (Tystar 8300)
    Each process tube can accomodate up to one hundred 8” wafers per cycle. We have boats ==Process Information==
    4 KB (580 words) - 11:15, 7 March 2024
  • Molecular Vapor Deposition
    *[[MVD - Wafer Coating - Process Traveler|Wafer Coating - Process Traveler]]
    1 KB (182 words) - 10:34, 30 August 2022
  • Nick test
    ...re-defined thicknesses. Custom programs for dielectric stacks or different process parameters can be written and saved. *[[PECVD1 Wafer Coating Process|Wafer Coating Process Traveler]]
    3 KB (387 words) - 22:15, 23 August 2021
  • ICP-PECVD (Unaxis VLR)
    *[[Unaxis wafer coating procedure]] - ''process flow for achieving high-quality coatings.'' == Process Control Data ==
    3 KB (454 words) - 10:35, 23 May 2023
  • Staff List
    ==Process Group== ...es, recipe development, and some direct tool training and maintenance. The Process Group helps to ensure that equipment is providing the expected processing c
    5 KB (664 words) - 09:42, 11 March 2024
  • PECVD Recipes
    ...7sHNAVvo/edit#gid=1270764394 PECVD 1 Process Control Plots] - Plots of all process control data=== ...G1KvtXqqTRDBI7sHNAVvo/edit#gid=0 SiO<sub>2</sub><nowiki> [PECVD 1] Current Process Control Data</nowiki>]
    14 KB (2,130 words) - 10:28, 20 December 2023
  • PECVD 2 (Advanced Vacuum)
    *[[Wafer Coating Process Traveler]] *For particle counting method, see the [[Wafer scanning process traveler|Surfscan Scanning Procedure]]
    2 KB (284 words) - 10:30, 30 August 2022
  • Foong Fatt
    |position = Process Scientist
    260 bytes (32 words) - 11:24, 1 February 2023
  • Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick
    *Enter the process settings: **[setup] -> [Process Control]
    3 KB (531 words) - 10:52, 26 April 2023
  • Lift-Off with DUV Imaging + PMGI Underlayer
    This process is intended for Deep-UV Exposure on the ASML DUV Stepper. PMGI is used as ===Process Limits===
    4 KB (608 words) - 16:32, 27 April 2022
  • PECVD 1 (PlasmaTherm 790)
    ...re-defined thicknesses. Custom programs for dielectric stacks or different process parameters can be written and saved. *[[PECVD1 Wafer Coating Process|Wafer Coating Process Traveler]]
    3 KB (388 words) - 10:30, 30 August 2022
  • Vapor HF Etch (uETCH)
    ...is a microscope attached to this tool, with which you can monitor the etch process of your sample. You can change the number of etch cycles during a run, whic
    1 KB (257 words) - 16:41, 30 January 2014
  • Stepper 1 (GCA 6300)
    ...ocesses. AZnLOF5510 for 1.0um and AZnLOF 2020 for 1.5-3 um negative resist process. Shipley LOL-2000 is also used as an underlayer for high resolution lift-of *Lens: Olympus 2142: NA = 0.42; Depth of field = 1.2 um for 0.7 um process
    5 KB (693 words) - 17:43, 12 February 2024
  • Plasma Clean (YES EcoClean)
    ...~120°C to 200°C by controlling the sample height via the lift pins during process, while being exposed to ICP-cracked oxygen to remove organic materials. ...  Heat is used to increase reaction rate.  Treat this as a purely chemical process, accelerated by heat (Arrhenius plot - rate goes up exponentially with temp
    3 KB (497 words) - 12:31, 22 November 2023
  • Rapid Thermal Processor (SSI Solaris 150)
    ...ermal Anneal” (RTA) system for R&D and pre-production. The Solaris 150 can process up to 152.4mm substrates at a temperature range from RT- 1200 degrees. The The Solaris uses a unique PID process controller that ensures accurate temperature stability and uniformity. The
    2 KB (248 words) - 08:36, 8 December 2023
  • XeF2 Etch (Xetch)
    The XeF<sub>2</sub> etch process is a purely chemical one and usually results in a rough etched surface. The ...is a microscope attached to this tool, with which you can monitor the etch process of your sample. You can change the number of etch cycles during a run, whic
    2 KB (323 words) - 15:03, 30 October 2023
  • Rapid Thermal Processor (AET RX6)
    ...ntrol software has been added to the system by Sedona Visual Controls. All process parameters are monitored and stored. Typical anneals are done for: ohmic co *Windows-based process monitoring and control software by Sedona Visual Controls
    2 KB (290 words) - 08:58, 15 June 2023
  • Surface Analysis (KLA/Tencor Surfscan)
    *[[Wafer scanning process traveler|Wafer Particle Count - Process Traveler]]
    3 KB (357 words) - 18:02, 2 February 2024
  • Ning Cao
    Processing all kinds of semiconductor devices. with deep process experience: lithography, dry etch, film depositions, etc.
    899 bytes (108 words) - 12:18, 24 March 2020
  • Wafer Coating Process Traveler1
    ...u could leave and come back when all runs are finished. You should monitor process at the very beginning to make sure there are no any issues with the run. ...u could leave and come back when all runs are finished. You should monitor process at the very beginning to make sure there are no any issues with the run.
    4 KB (711 words) - 13:32, 30 March 2020
  • Focused Ion-Beam Lithography (Raith Velion)
    • SEM imaging for in-situ process control, inspection and sample preparation. * Process control for rapid prototyping
    2 KB (285 words) - 09:56, 15 March 2021
  • Dry Etching Recipes
    ...>[[Process Group - Process Control Data#Etching .28Process Control Data.29|Process Control Data]]</u>=== ...nked page]] for [https://en.wikipedia.org/wiki/Statistical_process_control process control data] (dep rate/stress etc. over time), for a selection of often-us
    14 KB (1,875 words) - 15:31, 7 February 2024
  • Stepper 2 (AutoStep 200)
    *Lens: Olympus 2145: NA = 0.45; Depth of field = 1.2 um for 0.6 um process ==Process Information==
    6 KB (893 words) - 17:44, 12 February 2024
  • Tom Reynolds
    ...nior Development Engineer to finish the new facilities and install all the process equipment into the current Engineering Science Building Nanofab. ...nues to offer assistance in the operations of the lab while working on new process equipment selection and installs. He is working on several lab projects at
    2 KB (333 words) - 08:29, 7 August 2020
  • Vacuum Deposition Recipes
    ...cess Group - Process Control Data#Deposition .28Process Control Data.29|<u>Process Control Data</u>]]=== ...ocess Control Data#Deposition .28Process Control Data.29|linked page]] for process control data (calibration data over time, such as dep. rate, refractive ind
    24 KB (3,097 words) - 15:44, 7 July 2022
  • Deposition Data - temporary 2021-12-15
    ...G1KvtXqqTRDBI7sHNAVvo/edit#gid=0 SiO<sub>2</sub><nowiki> [PECVD 1] Current Process Control Data</nowiki>] ...vo/edit#gid=98787450 Si<sub>3</sub>N<sub>4</sub><nowiki> [PECVD 1] Current Process Control Data</nowiki>]
    17 KB (2,624 words) - 00:07, 16 December 2021
  • MVD - Wafer Coating - Process Traveler
    Use vapor coating in a clean-dry environment process as follows:
    775 bytes (111 words) - 13:38, 26 July 2020
  • S-Cubed Flexi - Operating Procedure
    *Make sure system is not running a process - Lot view shows no wafers or batches running. #After 5min bake, need +/-2°C before running process.
    2 KB (396 words) - 14:39, 8 November 2022
  • Unaxis wafer coating procedure
    * You should monitor process at the very beginning to make sure there are no any issues with the run. * You should monitor process at the very beginning to make sure there are no any issues with the run.
    5 KB (801 words) - 21:29, 12 August 2020
  • Oxford ICP Etcher (PlasmaPro 100 Cobra)
    *Windows-based Cortex software control of process and wafer handling *[[ICP Etching Recipes#Process Control Data .28Oxford ICP Etcher.29|Process Control Data]] - Calibration etch data for verifying tool performance over
    4 KB (532 words) - 23:33, 4 May 2023
  • IR Thermal Microscope (QFI)
    ...n semiconductor circuits. Such hot spot sites often mark the location of a process fault or damaged location of a circuit, such as a short circuit. ...iconductor circuits. Such recombination sites often mark the location of a process fault or damaged location of a circuit. The NIR cameral operates at 400nm -
    3 KB (376 words) - 09:37, 30 August 2022
  • ASML Stepper 3 Standard Operating Procedure
    ...pecially important for high-resolution layers. Make sure your entire litho process remains constant (spins, bakes, develop times etc.) between the FEA and you ...s range. This allows your process to work even if the focus or some other process varies.
    9 KB (1,431 words) - 13:59, 23 April 2023
  • ASML 5500: Choose Marks for Prealignment
    # Go to '''''Layer Layout > Process Data'''''
    1 KB (186 words) - 14:17, 17 July 2018
  • Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)
    ...stem is fully computer controlled in all aspects of the pumping cycles and process control, and can be programmed by the user. *Windows-based computer control of process and wafer handling
    4 KB (603 words) - 13:09, 22 November 2023

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