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Showing below up to 100 results in range #1 to #100.
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- (hist) Publications - 2013-2014 [102,378 bytes]
- (hist) Lab Rules [80,380 bytes]
- (hist) PubList2018 [78,929 bytes]
- (hist) Old Deposition Data - NastaziaM 2021-11-22 [36,993 bytes]
- (hist) GCA 6300 training manual -old instructions [35,770 bytes]
- (hist) Lab Rules backup [35,139 bytes]
- (hist) Wafer scanning process traveler [34,065 bytes]
- (hist) Old Deposition Data - 2021-12-15 [31,421 bytes]
- (hist) ICP Etching Recipes [28,398 bytes]
- (hist) Frequently Asked Questions [25,692 bytes]
- (hist) Vacuum Deposition Recipes [24,066 bytes]
- (hist) Lithography Recipes [23,636 bytes]
- (hist) Chemical List - OLD 2018-09-05 [19,940 bytes]
- (hist) Editing Tutorials [18,259 bytes]
- (hist) Deposition Data - temporary 2021-12-15 [17,583 bytes]
- (hist) Stepper Recipes [17,366 bytes]
- (hist) Calculators + Utilities [16,377 bytes]
- (hist) Sputtering Recipes [16,213 bytes]
- (hist) MLA150 - Troubleshooting [15,471 bytes]
- (hist) Stepper 1 (GCA 6300) - Standard Operating Procedure [14,869 bytes]
- (hist) PECVD Recipes [14,124 bytes]
- (hist) Dry Etching Recipes [14,072 bytes]
- (hist) Wet Benches [13,520 bytes]
- (hist) Programming a Job [12,807 bytes]
- (hist) Glossary [12,789 bytes]
- (hist) MLA150 - Design Guidelines [12,637 bytes]
- (hist) ADT 7100 - Initial Setup Before Cutting [11,605 bytes]
- (hist) UCSB NanoFab Microscope Training [10,875 bytes]
- (hist) GCA 6300 Mask Making Guidance [10,484 bytes]
- (hist) ASML Stepper 3 - UCSB Test Reticles [10,171 bytes]
- (hist) Stepper 3 (ASML DUV) [9,987 bytes]
- (hist) Filmetrics F50 - Operating Procedure [9,961 bytes]
- (hist) Wet Etching Recipes [9,931 bytes]
- (hist) Services [9,841 bytes]
- (hist) Microscopes [9,822 bytes]
- (hist) Process Group - Process Control Data [9,815 bytes]
- (hist) Packaging Recipes [9,760 bytes]
- (hist) Stocked Chemical List [9,733 bytes]
- (hist) ASML 5500 Mask Making Guidelines [9,519 bytes]
- (hist) GoPro Hero8 Black (Internal) [9,508 bytes]
- (hist) Contact Alignment Recipes [9,006 bytes]
- (hist) ASML Stepper 3 Standard Operating Procedure [8,896 bytes]
- (hist) ASML Stepper 3 Error Recovery, Troubleshooting and Calibration [8,656 bytes]
- (hist) Oxford ICP Etcher - Process Control Data [8,520 bytes]
- (hist) Laser Etch Monitoring [8,426 bytes]
- (hist) E-Beam Evaporation Recipes [8,005 bytes]
- (hist) Atomic Layer Deposition Recipes [7,503 bytes]
- (hist) Tool List [7,420 bytes]
- (hist) KLayout Design Tips [7,390 bytes]
- (hist) Test Data of etching SiO2 with CHF3/CF4 [7,016 bytes]
- (hist) Autostep 200 Mask Making Guidance [6,986 bytes]
- (hist) Test Data of etching SiO2 with CHF3/CF4-ICP1 [6,982 bytes]
- (hist) Olympus LEXT OLS4000 Confocal uScope - Quick Start [6,953 bytes]
- (hist) Direct-Write Lithography Recipes [6,838 bytes]
- (hist) LegacyTable [6,771 bytes]
- (hist) Maskless Aligner (Heidelberg MLA150) [6,377 bytes]
- (hist) Stepper 2 (AutoStep 200) [6,188 bytes]
- (hist) Stepper 1 (GCA 6300) Substrate Thickness, Shim Thickness ans Target Thickness [5,924 bytes]
- (hist) Oxygen Plasma System Recipes [5,776 bytes]
- (hist) Intellemetrics Laser Etch Monitor Procedure for Panasonic ICP Etchers [5,654 bytes]
- (hist) Stepper 2 (AutoStep 200) Operating Procedures [5,571 bytes]
- (hist) Unaxis VLR Etch - Process Control Data [5,539 bytes]
- (hist) Lift-Off with I-Line Imaging Resist + LOL2000 Underlayer [5,503 bytes]
- (hist) Thermal Evaporation Recipes [5,427 bytes]
- (hist) Test Data of Etching SiO2 with CHF3/CF4-Fluorine ICP Etcher [5,423 bytes]
- (hist) E-Beam Lithography System (JEOL JBX-6300FS) [5,203 bytes]
- (hist) COVID-19 User Policies [5,185 bytes]
- (hist) Thermal Processing Recipes [5,154 bytes]
- (hist) Unaxis wafer coating procedure [5,124 bytes]
- (hist) DSEIII (PlasmaTherm/Deep Silicon Etcher) [4,972 bytes]
- (hist) IBD: Calibrating Optical Thickness [4,958 bytes]
- (hist) Staff List [4,894 bytes]
- (hist) Stepper 2 (Autostep 200) - Table of Chucks, Shims, Target Thicknesses [4,764 bytes]
- (hist) FIJI - Microscope Measurement Tools [4,694 bytes]
- (hist) Stepper 1 (GCA 6300) [4,669 bytes]
- (hist) ICP Etch 1 (Panasonic E646V) [4,523 bytes]
- (hist) Wafer Coating Process Traveler1 [4,442 bytes]
- (hist) Nanofab Job Postings [4,340 bytes]
- (hist) Filmetrics F10-RT-UVX Operating Procedure [4,307 bytes]
- (hist) Troubleshooting and Recovery [4,291 bytes]
- (hist) Filmetrics F40-UV Microscope-Mounted [4,218 bytes]
- (hist) Contact Aligner (SUSS MA-6) [4,183 bytes]
- (hist) Measurements and Imaging with Amscope Camera - Quickstart Usage Guide [4,067 bytes]
- (hist) Process Group - Billing Instructions [4,061 bytes]
- (hist) Suss Aligners (SUSS MJB-3) [4,059 bytes]
- (hist) Tube Furnace (Tystar 8300) [4,032 bytes]
- (hist) Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP) [3,952 bytes]
- (hist) Lift-Off with DUV Imaging + PMGI Underlayer [3,932 bytes]
- (hist) CC-PRIME OnBoarding 2022-08 [3,879 bytes]
- (hist) Filmetrics F40-UV Quick Start [3,839 bytes]
- (hist) CAIBE (Oxford Ion Mill) [3,758 bytes]
- (hist) Ion Beam Deposition (Veeco NEXUS) [3,730 bytes]
- (hist) Oxford ICP Etcher (PlasmaPro 100 Cobra) [3,696 bytes]
- (hist) Probe Station & Curve Tracer [3,673 bytes]
- (hist) InP Etch Rate and Selectivity (InP/SiO2) [3,591 bytes]
- (hist) MLA Recipes [3,571 bytes]
- (hist) Sputter 4 (AJA ATC 2200-V) [3,457 bytes]
- (hist) Wafer Scanning/Coating Process Traveler ( combined/less detailed) [3,369 bytes]
- (hist) GCA 6300 Reboot Procedures [3,344 bytes]
- (hist) SEM 1 (JEOL IT800SHL) [3,332 bytes]