Difference between revisions of "Tool List"

From UCSB Nanofab Wiki
Jump to: navigation, search
(Thermal Processing)
(Packaging)
Line 98: Line 98:
   
 
=Packaging=
 
=Packaging=
* [[Flip-Chip Bonder]]
+
* [[Flip-Chip Bonder (Finetech)]]
 
* [[Vacuum Sealer]]
 
* [[Vacuum Sealer]]
* [[Dicing Saw]]
+
* [[Dicing Saw (ADT)]]
  +
* [[Wire Saw (Takatori)]]
   
 
=Inspection, Test and Characterization=
 
=Inspection, Test and Characterization=

Revision as of 11:57, 28 June 2012

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization