Difference between revisions of "Tool List"
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(→Optical Microscopy: link to MJB-IR IR scope) |
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=====Contact Aligners (Optical Exposure)===== |
=====Contact Aligners (Optical Exposure)===== |
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− | *[[Suss Aligners (SUSS MJB-3)]] |
+ | *[[Suss Aligners (SUSS MJB-3)|Contact Aligners (SUSS MJB-3)]] |
*[[Contact Aligner (SUSS MA-6)]] |
*[[Contact Aligner (SUSS MA-6)]] |
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*[[DUV Flood Expose]] |
*[[DUV Flood Expose]] |
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*[[E-Beam Lithography System (JEOL JBX-6300FS)]] |
*[[E-Beam Lithography System (JEOL JBX-6300FS)]] |
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− | *[[ |
+ | *[[SEM 1 (JEOL IT800SHL)|E-Beam Lithography (Nabity v9)]] |
*[[Focused Ion-Beam Lithography (Raith Velion)]] |
*[[Focused Ion-Beam Lithography (Raith Velion)]] |
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*[[Maskless Aligner (Heidelberg MLA150)]] |
*[[Maskless Aligner (Heidelberg MLA150)]] |
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=====ICP-RIE===== |
=====ICP-RIE===== |
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− | *[[ICP Etch 1 (Panasonic |
+ | *[[ICP Etch 1 (Panasonic E646V)]] |
− | *[[ICP Etch 2 (Panasonic |
+ | *[[ICP Etch 2 (Panasonic E626I)]] |
*[[ICP-Etch (Unaxis VLR)]] |
*[[ICP-Etch (Unaxis VLR)]] |
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*[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]] |
*[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]] |
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=Packaging= |
=Packaging= |
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+ | ''Back-end Fabrication Tools'' |
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*[[Dicing Saw (ADT)]] |
*[[Dicing Saw (ADT)]] |
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− | *[[Wafer Cleaver (PELCO Flip-Scribe)|Wafer Cleaver (PELCO Flipscribe)]] |
+ | *[[Wafer Cleaver (PELCO Flip-Scribe)|Manual Wafer Cleaver (PELCO Flipscribe)]] |
+ | *[[Automated Wafer Cleaver (Loomis LSD-155LT)]] |
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====Other Packaging==== |
====Other Packaging==== |
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− | = |
+ | =Measurement & Characterization= |
+ | ''[https://en.wikipedia.org/wiki/Metrology Metrology], Electrical/Optical Testing and Thin-Film/Materials [https://en.wikipedia.org/wiki/Characterization_(materials_science) Characterization] tools'' |
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{| |
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|- valign="top" |
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*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
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*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]] |
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]] |
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+ | *[[Suss Aligners (SUSS MJB-3)#Backside Alignment|Near-IR Inspection Scope (MJB-IR)]] |
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=====Electron Microscopy===== |
=====Electron Microscopy===== |
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− | *[[ |
+ | *[[SEM 1 (JEOL IT800SHL)]] |
− | *[[Field Emission SEM 2 (JEOL |
+ | *[[Field Emission SEM 2 (JEOL IT800SHL)|SEM 2 (JEOL IT800SHL) w/ EDAX]] |
*[[SEM Sample Coater (Hummer)]] |
*[[SEM Sample Coater (Hummer)]] |
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*[[Resistivity Mapper (CDE RESMAP)]] |
*[[Resistivity Mapper (CDE RESMAP)]] |
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*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]] |
*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]] |
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− | *[[ |
+ | *[[IR Thermal Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]] |
======Other Properties====== |
======Other Properties====== |
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*[[Surface Analysis (KLA/Tencor Surfscan)|Particle Counts (KLA/Tencor Surfscan)]] |
*[[Surface Analysis (KLA/Tencor Surfscan)|Particle Counts (KLA/Tencor Surfscan)]] |
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*[[Photoluminescence PL Setup (Custom)]] |
*[[Photoluminescence PL Setup (Custom)]] |
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− | *[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]] |
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− | **''Surface hydrophobicity'' |
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Latest revision as of 11:52, 1 March 2024
Lithography
Photoresists and Lithography ChemicalsContact Aligners (Optical Exposure)Direct-Write Lithography
Other Patterning Systems |
Steppers (Optical Exposure)Thermal Processing for Photolithography
Lithography Support
|
Vacuum Deposition
Physical Vapor Deposition (PVD)Thermal Evaporation
Sputter Deposition |
Chemical Vapor Deposition (CVD) |
Dry Etch
Reactive Ion Etching (RIE)Plasma Etching and CleaningEtch Monitoring
|
ICP-RIE
Ion Milling and Reactive Ion Beam EtchingOther Dry Etching |
Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.
Thermal Processing
Packaging
Back-end Fabrication Tools
Die Singulation / Down-sizingOther Packaging |
Wafer/Die Bonding |
Measurement & Characterization
Metrology, Electrical/Optical Testing and Thin-Film/Materials Characterization tools
Optical Microscopy
Electron MicroscopyTopographical Metrology |
Thin-Film/Material AnalysisThickness + Optical Constants
Electrical Analysis
Other Properties |