Difference between revisions of "Tool List"

From UCSB Nanofab Wiki
Jump to navigation Jump to search
(Text replacement - "/wiki/index.php" to "/w/index.php")
 
(16 intermediate revisions by 4 users not shown)
Line 7: Line 7:
 
=====Photoresists and Lithography Chemicals=====
 
=====Photoresists and Lithography Chemicals=====
  
*See the [https://wiki.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
+
*See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
 
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
 
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
  
Line 16: Line 16:
 
*[[Contact Aligner (SUSS MA-6)]]
 
*[[Contact Aligner (SUSS MA-6)]]
 
*[[DUV Flood Expose]]
 
*[[DUV Flood Expose]]
 +
 +
=====Direct-Write Lithography=====
 +
 +
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
 +
*[[Field Emission SEM 1 (FEI Sirion)|E-Beam Lithography (FEI Sirion Nabity v9)]]
 +
*[[Focused Ion-Beam Lithography (Raith Velion)]]
 +
*[[Maskless Aligner (Heidelberg MLA150)]]
  
 
=====Other Patterning Systems=====
 
=====Other Patterning Systems=====
  
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
 
*[[Nano-Imprint (Nanonex NX2000)]]
 
 
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
 
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
 
| width="400" |
 
| width="400" |
Line 40: Line 45:
 
=====Lithography Support=====
 
=====Lithography Support=====
  
*The [https://wiki.nanotech.ucsb.edu/wiki/index.php/Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
+
*The [https://wiki.nanotech.ucsb.edu/w/index.php?title=Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches
+
*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches
 
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]]
 
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]]
 
|-
 
|-
Line 107: Line 112:
 
*[[ICP Etch 2 (Panasonic E640)]]
 
*[[ICP Etch 2 (Panasonic E640)]]
 
*[[ICP-Etch (Unaxis VLR)]]
 
*[[ICP-Etch (Unaxis VLR)]]
 +
*[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]]
 
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
 
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
 
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
 
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
Line 139: Line 145:
 
*[[Spin Rinse Dryer (SemiTool)]]
 
*[[Spin Rinse Dryer (SemiTool)]]
 
*[[Chemical-Mechanical Polisher (Logitech)]]
 
*[[Chemical-Mechanical Polisher (Logitech)]]
 +
*[[Mechanical Polisher (Allied)]]
 
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
 
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
+
*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
 
|-
 
|-
 
|}
 
|}
Line 184: Line 191:
 
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
 
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
 +
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
 +
 +
=====Electron Microscopy=====
  
===== Electron Microscopy =====
 
 
*[[Field Emission SEM 1 (FEI Sirion)]]
 
*[[Field Emission SEM 1 (FEI Sirion)]]
 
*[[Field Emission SEM 2 (JEOL 7600F)]]
 
*[[Field Emission SEM 2 (JEOL 7600F)]]
Line 201: Line 210:
 
=====Thin-Film/Material Analysis=====
 
=====Thin-Film/Material Analysis=====
  
====== Thickness + Optical Constants ======
+
======Thickness + Optical Constants======
 +
 
 
*[[Ellipsometer (Woollam)]]
 
*[[Ellipsometer (Woollam)]]
 
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
 
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
Line 209: Line 219:
 
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
 
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
  
====== Other Properties ======
+
======Other Properties======
 +
 
 
*[[Film Stress (Tencor Flexus)]]
 
*[[Film Stress (Tencor Flexus)]]
 
*[[Photoluminescence PL Setup (Custom)]]
 
*[[Photoluminescence PL Setup (Custom)]]
  
====== Electrical Analysis ======
+
======Electrical Analysis======
 +
 
 
*[[Resistivity Mapper (CDE RESMAP)]]
 
*[[Resistivity Mapper (CDE RESMAP)]]
 
*[[Probe Station & Curve Tracer]]
 
*[[Probe Station & Curve Tracer]]
Line 219: Line 231:
 
=====Other Tools=====
 
=====Other Tools=====
  
*[[Goniometer]]
+
*[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]]
 
**''Surface hydrophobicity''
 
**''Surface hydrophobicity''
 +
|-
 +
|
 +
|
 
|-
 
|-
 
|}
 
|}

Latest revision as of 12:50, 4 September 2021

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Inspection, Test and Characterization

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Other Properties
Electrical Analysis
Other Tools