Difference between revisions of "Tool List"

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=Packaging=
 
=Packaging=
* [[Flip-Chip Bonder]]
+
* [[Flip-Chip Bonder (Finetech)]]
 
* [[Vacuum Sealer]]
 
* [[Vacuum Sealer]]
* [[Dicing Saw]]
+
* [[Dicing Saw (ADT)]]
 +
* [[Wire Saw (Takatori)]]
  
 
=Inspection, Test and Characterization=
 
=Inspection, Test and Characterization=

Revision as of 12:57, 28 June 2012

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization