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- ...to) [https://en.wikipedia.org/wiki/Statistical_process_control Statistical Process Control]. ...inks found on individual tool pages, in the '''''Recipes > <<tool page>> > Process Control''''' section.10 KB (1,497 words) - 12:03, 24 April 2024
- .../wiki.nanotech.ucsb.edu/w/index.php?title=Staff_List#Process_Group NanoFab Process Group].'' ==Process Control Calibration Procedures==2 KB (297 words) - 16:46, 11 September 2023
- The wafers for process calibration are ordered from a wafer supplier that sells high grade, qualit === Scan before process calibration ===2 KB (339 words) - 11:31, 22 April 2020
- 4 KB (596 words) - 21:43, 22 November 2021
- ...u could leave and come back when all runs are finished. You should monitor process at the very beginning to make sure there are no any issues with the run. ...u could leave and come back when all runs are finished. You should monitor process at the very beginning to make sure there are no any issues with the run.4 KB (711 words) - 13:32, 30 March 2020
- 3 KB (416 words) - 16:54, 22 April 2020
- ...SiO2 deposition at 250C in PECVD#1. Instructions bellow explain how to run process (seasoning, deposition, cleaning).2 KB (270 words) - 13:16, 10 December 2020
- The wafers for process calibration are ordered from a wafer supplier that sells high grade, qualit ...re ''before'' the process step, and subtract that value from the ''after'' process value. If your ''before'' measurement shows high (eg. >200 particles), do33 KB (5,424 words) - 17:05, 4 January 2024
- Use vapor coating in a clean-dry environment process as follows:775 bytes (111 words) - 13:38, 26 July 2020
- **[https://trello.com/b/pUtJ3nlC/process-fab-jobs?filter=member:demisdjohn Demis' Fab Services] **[https://trello.com/b/pUtJ3nlC/process-fab-jobs?filter=member:biljanastamenic Biljana's Fab Services]1 KB (173 words) - 16:52, 6 December 2022
- 21 bytes (3 words) - 16:00, 30 March 2020
- 2 KB (325 words) - 16:38, 30 March 2020
- 3 KB (440 words) - 11:08, 30 January 2021
- ==Process Control Data - InP Ridge Etch (Oxford ICP Etcher)==8 KB (1,214 words) - 15:38, 12 January 2023
- 5 KB (717 words) - 18:41, 21 November 2022
- The wafers for process calibration are ordered from SVM (<nowiki>https://www.svmi.com/</nowiki>). === Wafer Coating Process traveler ===3 KB (515 words) - 13:41, 20 April 2020
Page text matches
- (This process can easily be transferred to I-Line photoresists, using the [[Contact Align ===Photo-EBR Process===1 KB (207 words) - 23:06, 4 October 2022
- .../wiki.nanotech.ucsb.edu/w/index.php?title=Staff_List#Process_Group NanoFab Process Group].'' ==Process Control Calibration Procedures==2 KB (297 words) - 16:46, 11 September 2023
- ==Process Group== *[[Process Group - Remote Fabrication Jobs|'''Job Tracking''']] - pages to organize an2 KB (338 words) - 16:10, 9 April 2024
- ==HMDS Process for PR Improving Adhesion== This process tends to improve adhesion between the substrate and subsequent photoresist1 KB (198 words) - 12:41, 10 February 2024
- *[[:Category:Wet Processing|Wet Process]] *[[:Category:Thermal Processing|Thermal Process]]3 KB (370 words) - 13:59, 2 November 2023
- *[[:Category:Wet Processing|Wet Process]] *[[:Category:Thermal Processing|Thermal Process]]3 KB (375 words) - 16:13, 12 March 2024
- *A position in the "[[Staff List#Process Group|Process Group]]", led by [[Demis D. John]]. ...p - Process Control Data#Deposition .28Process Control Data.29|Deposition: Process Control data]].4 KB (607 words) - 11:48, 24 April 2024
- The wafers for process calibration are ordered from a wafer supplier that sells high grade, qualit === Scan before process calibration ===2 KB (339 words) - 11:31, 22 April 2020
- ...to) [https://en.wikipedia.org/wiki/Statistical_process_control Statistical Process Control]. ...inks found on individual tool pages, in the '''''Recipes > <<tool page>> > Process Control''''' section.10 KB (1,497 words) - 12:03, 24 April 2024
- ...r films in PECVD#1, Advanced PECVD#2, and Unaxis) to establish statistical process control. Biljana is holding trainings on tools: GCA 6300 Stepper#1, Autoste1 KB (191 words) - 16:07, 29 December 2023
- ...clean surfaces can be achieved in less than one minute. In addition, this process does not damage any sensitive device structures of MOS gate oxide. The syst961 bytes (145 words) - 09:17, 29 August 2023
- The wafers for process calibration are ordered from SVM (<nowiki>https://www.svmi.com/</nowiki>). === Wafer Coating Process traveler ===3 KB (515 words) - 13:41, 20 April 2020
- ...is often unique in geometry and material combinations so that independent process development is required for most CMP applications.1 KB (148 words) - 11:03, 30 August 2022
- == Running a process on RIE #5 == # Choose the '''Process Menu''' located on bottom left corner of the screen. It's the one with the2 KB (377 words) - 14:09, 17 October 2018
- ...ns them to the cassette. The system is recipe driven with a high degree of process control and minimal backside contamination, and coats photoresists with low ...full size substrates are allowed on this system. The S3 Coater is still in process development and not open for general use.2 KB (340 words) - 14:41, 8 November 2022
- |position = Process Scientist Manager ...uestion about your fabrication process, or are designing a new fabrication process3 KB (434 words) - 10:22, 18 June 2020
- Each process tube can accomodate up to one hundred 8” wafers per cycle. We have boats ==Process Information==4 KB (580 words) - 11:15, 7 March 2024
- *[[MVD - Wafer Coating - Process Traveler|Wafer Coating - Process Traveler]]1 KB (182 words) - 10:34, 30 August 2022
- ...re-defined thicknesses. Custom programs for dielectric stacks or different process parameters can be written and saved. *[[PECVD1 Wafer Coating Process|Wafer Coating Process Traveler]]3 KB (387 words) - 22:15, 23 August 2021
- *[[Unaxis wafer coating procedure]] - ''process flow for achieving high-quality coatings.'' == Process Control Data ==3 KB (454 words) - 10:35, 23 May 2023