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Showing below up to 100 results in range #31 to #130.

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  1. InP Etch Rate and Selectivity (InP/SiO2)‏‎ (60 revisions)
  2. E-Beam Evaporation Recipes‏‎ (60 revisions)
  3. Test Data of etching SiO2 with CHF3/CF4-ICP1‏‎ (58 revisions)
  4. Staff List‏‎ (57 revisions)
  5. OLD - PECVD2 Recipes‏‎ (56 revisions)
  6. ICP Etch 2 (Panasonic E626I)‏‎ (55 revisions)
  7. Direct-Write Lithography Recipes‏‎ (53 revisions)
  8. Editing Tutorials‏‎ (52 revisions)
  9. Contact Alignment Recipes‏‎ (51 revisions)
  10. Stepper 2 (Autostep 200) - Piece vs. Wafer Programming Differences‏‎ (51 revisions)
  11. Wet Benches‏‎ (51 revisions)
  12. Nanofab Staff Internal Pages‏‎ (49 revisions)
  13. Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)‏‎ (49 revisions)
  14. Microscopes‏‎ (48 revisions)
  15. Autostep 200 Troubleshooting and Recovery‏‎ (48 revisions)
  16. PECVD 2 (Advanced Vacuum)‏‎ (48 revisions)
  17. Lab Rules OLD 2018‏‎ (47 revisions)
  18. Maskless Aligner (Heidelberg MLA150)‏‎ (46 revisions)
  19. Dicing Saw (ADT)‏‎ (46 revisions)
  20. MLA150 - Troubleshooting‏‎ (44 revisions)
  21. Research‏‎ (44 revisions)
  22. Lab Rules‏‎ (42 revisions)
  23. Oxygen Plasma System Recipes‏‎ (42 revisions)
  24. RIE Etching Recipes‏‎ (40 revisions)
  25. COVID-19 User Policies‏‎ (40 revisions)
  26. Contact Aligner (SUSS MA-6)‏‎ (40 revisions)
  27. Atomic Layer Deposition Recipes‏‎ (40 revisions)
  28. Ion Beam Deposition (Veeco NEXUS)‏‎ (39 revisions)
  29. ASML Stepper 3 Error Recovery, Troubleshooting and Calibration‏‎ (38 revisions)
  30. Packaging Recipes‏‎ (36 revisions)
  31. Tube Furnace (Tystar 8300)‏‎ (34 revisions)
  32. Test Data of Etching SiO2 with CHF3/CF4-Fluorine ICP Etcher‏‎ (34 revisions)
  33. Old training manual‏‎ (34 revisions)
  34. Stepper 2 (AutoStep 200) Operating Procedures‏‎ (32 revisions)
  35. HF Vapor Etch‏‎ (31 revisions)
  36. RIE 3 (MRC)‏‎ (31 revisions)
  37. Atomic Layer Deposition (Oxford FlexAL)‏‎ (30 revisions)
  38. Services‏‎ (30 revisions)
  39. Other Dry Etching Recipes‏‎ (30 revisions)
  40. Vapor HF Etch‏‎ (30 revisions)
  41. ICP-Etch (Unaxis VLR)‏‎ (29 revisions)
  42. Tony Bosch‏‎ (28 revisions)
  43. PECVD1 Wafer Coating Process‏‎ (27 revisions)
  44. Aidan Hopkins‏‎ (26 revisions)
  45. Stepper 1 (GCA 6300) - Standard Operating Procedure‏‎ (26 revisions)
  46. Sputter 3 (AJA ATC 2000-F)‏‎ (26 revisions)
  47. Demis D. John‏‎ (25 revisions)
  48. Mike Silva‏‎ (25 revisions)
  49. Biljana Stamenic‏‎ (25 revisions)
  50. Usage Data and Statistics‏‎ (25 revisions)
  51. Ellipsometer (Woollam)‏‎ (25 revisions)
  52. DUMMY TOOL‏‎ (24 revisions)
  53. Suss Aligners (SUSS MJB-3)‏‎ (24 revisions)
  54. Don Freeborn‏‎ (24 revisions)
  55. Wafer Coating Process Traveler‏‎ (23 revisions)
  56. CAIBE (Oxford Ion Mill)‏‎ (23 revisions)
  57. RIE 2 (MRC)‏‎ (22 revisions)
  58. GoPro Hero8 Black (Internal)‏‎ (21 revisions)
  59. DSEIII (PlasmaTherm/Deep Silicon Etcher)‏‎ (21 revisions)
  60. Autostep 200 Mask Making Guidance‏‎ (21 revisions)
  61. Plasma Clean (YES EcoClean)‏‎ (21 revisions)
  62. Rapid Thermal Processor (AET RX6)‏‎ (20 revisions)
  63. RIE 5 (PlasmaTherm)‏‎ (20 revisions)
  64. Brian Lingg‏‎ (20 revisions)
  65. Tom Reynolds‏‎ (20 revisions)
  66. Sputter 4 (AJA ATC 2200-V)‏‎ (20 revisions)
  67. IR Thermal Microscope (QFI)‏‎ (20 revisions)
  68. Rapid Thermal Processor (SSI Solaris 150)‏‎ (20 revisions)
  69. Lift-Off with DUV Imaging + PMGI Underlayer‏‎ (19 revisions)
  70. Process Group - Process Control Data‏‎ (19 revisions)
  71. Tech Talks Seminar Series‏‎ (19 revisions)
  72. Filmetrics F40-UV Microscope-Mounted‏‎ (19 revisions)
  73. Oven 5 (Labline)‏‎ (19 revisions)
  74. Troubleshooting and Recovery‏‎ (19 revisions)
  75. Probe Station & Curve Tracer‏‎ (19 revisions)
  76. Oxford ICP Etcher (PlasmaPro 100 Cobra)‏‎ (19 revisions)
  77. UCSB NanoFab Microscope Training‏‎ (19 revisions)
  78. Automated Coat/Develop System (S-Cubed Flexi)‏‎ (19 revisions)
  79. Laser Scanning Confocal M-scope (Olympus LEXT)‏‎ (18 revisions)
  80. Thermal Processing Recipes‏‎ (18 revisions)
  81. Atomic Force Microscope (Bruker ICON)‏‎ (18 revisions)
  82. Sputter 5 (AJA ATC 2200-V)‏‎ (18 revisions)
  83. Wafer Bonder (Logitech WBS7)‏‎ (18 revisions)
  84. MLA150 - Design Guidelines‏‎ (18 revisions)
  85. Plasma Activation (EVG 810)‏‎ (17 revisions)
  86. XeF2 Etch (Xetch)‏‎ (17 revisions)
  87. Main Page‏‎ (17 revisions)
  88. PECVD1 Wafer Coating Process Traveler‏‎ (16 revisions)
  89. DUV Flood Expose‏‎ (16 revisions)
  90. E-Beam Lithography System (JEOL JBX-6300FS)‏‎ (16 revisions)
  91. Test Data of etching SiO2 with CHF3/CF4/O2 (using this recipe only for Fluorine etch of the underneath layer)‏‎ (16 revisions)
  92. ASML Stepper 3 - UCSB Test Reticles‏‎ (15 revisions)
  93. Unaxis VLR Etch - Process Control Data‏‎ (15 revisions)
  94. Laser Etch Monitoring‏‎ (15 revisions)
  95. ASML Stepper 3 Standard Operating Procedure‏‎ (15 revisions)
  96. Lee Sawyer‏‎ (14 revisions)
  97. Step Profilometer (DektakXT)‏‎ (14 revisions)
  98. InP etch result in details‏‎ (13 revisions)
  99. Field Emission SEM 2 (JEOL IT800SHL)‏‎ (13 revisions)
  100. YES-SPR220-Various-Temps‏‎ (12 revisions)

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