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Showing below up to 136 results in range #201 to #336.
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- Brian Thibeault (12 revisions)
- Process Group - Remote Fabrication Jobs (12 revisions)
- Ovens - Overview of All Lab Ovens (12 revisions)
- Molecular Vapor Deposition (12 revisions)
- Wafer Bonder (SUSS SB6-8E) (12 revisions)
- YES-SPR220-Various-Temps (12 revisions)
- Film Stress (Tencor Flexus) (12 revisions)
- InP etch result in details (13 revisions)
- Field Emission SEM 2 (JEOL IT800SHL) (13 revisions)
- Step Profilometer (DektakXT) (14 revisions)
- Lee Sawyer (14 revisions)
- ASML Stepper 3 - UCSB Test Reticles (15 revisions)
- Unaxis VLR Etch - Process Control Data (15 revisions)
- Laser Etch Monitoring (15 revisions)
- ASML Stepper 3 Standard Operating Procedure (15 revisions)
- E-Beam Lithography System (JEOL JBX-6300FS) (16 revisions)
- Test Data of etching SiO2 with CHF3/CF4/O2 (using this recipe only for Fluorine etch of the underneath layer) (16 revisions)
- PECVD1 Wafer Coating Process Traveler (16 revisions)
- DUV Flood Expose (16 revisions)
- XeF2 Etch (Xetch) (17 revisions)
- Main Page (17 revisions)
- Plasma Activation (EVG 810) (17 revisions)
- Sputter 5 (AJA ATC 2200-V) (18 revisions)
- Wafer Bonder (Logitech WBS7) (18 revisions)
- MLA150 - Design Guidelines (18 revisions)
- Laser Scanning Confocal M-scope (Olympus LEXT) (18 revisions)
- Thermal Processing Recipes (18 revisions)
- Atomic Force Microscope (Bruker ICON) (18 revisions)
- Filmetrics F40-UV Microscope-Mounted (19 revisions)
- Tech Talks Seminar Series (19 revisions)
- Troubleshooting and Recovery (19 revisions)
- Oven 5 (Labline) (19 revisions)
- Probe Station & Curve Tracer (19 revisions)
- Oxford ICP Etcher (PlasmaPro 100 Cobra) (19 revisions)
- UCSB NanoFab Microscope Training (19 revisions)
- Automated Coat/Develop System (S-Cubed Flexi) (19 revisions)
- Lift-Off with DUV Imaging + PMGI Underlayer (19 revisions)
- Process Group - Process Control Data (19 revisions)
- Tom Reynolds (20 revisions)
- Sputter 4 (AJA ATC 2200-V) (20 revisions)
- IR Thermal Microscope (QFI) (20 revisions)
- Rapid Thermal Processor (SSI Solaris 150) (20 revisions)
- RIE 5 (PlasmaTherm) (20 revisions)
- Rapid Thermal Processor (AET RX6) (20 revisions)
- Brian Lingg (20 revisions)
- GoPro Hero8 Black (Internal) (21 revisions)
- DSEIII (PlasmaTherm/Deep Silicon Etcher) (21 revisions)
- Plasma Clean (YES EcoClean) (21 revisions)
- Autostep 200 Mask Making Guidance (21 revisions)
- RIE 2 (MRC) (22 revisions)
- Wafer Coating Process Traveler (23 revisions)
- CAIBE (Oxford Ion Mill) (23 revisions)
- Don Freeborn (24 revisions)
- Suss Aligners (SUSS MJB-3) (24 revisions)
- DUMMY TOOL (24 revisions)
- Biljana Stamenic (25 revisions)
- Usage Data and Statistics (25 revisions)
- Ellipsometer (Woollam) (25 revisions)
- Demis D. John (25 revisions)
- Mike Silva (25 revisions)
- Aidan Hopkins (26 revisions)
- Sputter 3 (AJA ATC 2000-F) (26 revisions)
- Stepper 1 (GCA 6300) - Standard Operating Procedure (26 revisions)
- PECVD1 Wafer Coating Process (27 revisions)
- Tony Bosch (28 revisions)
- ICP-Etch (Unaxis VLR) (29 revisions)
- Other Dry Etching Recipes (30 revisions)
- Vapor HF Etch (30 revisions)
- Atomic Layer Deposition (Oxford FlexAL) (30 revisions)
- Services (30 revisions)
- RIE 3 (MRC) (31 revisions)
- HF Vapor Etch (31 revisions)
- Stepper 2 (AutoStep 200) Operating Procedures (32 revisions)
- Test Data of Etching SiO2 with CHF3/CF4-Fluorine ICP Etcher (34 revisions)
- Old training manual (34 revisions)
- Tube Furnace (Tystar 8300) (34 revisions)
- Packaging Recipes (36 revisions)
- ASML Stepper 3 Error Recovery, Troubleshooting and Calibration (38 revisions)
- Ion Beam Deposition (Veeco NEXUS) (39 revisions)
- Contact Aligner (SUSS MA-6) (40 revisions)
- Atomic Layer Deposition Recipes (40 revisions)
- RIE Etching Recipes (40 revisions)
- COVID-19 User Policies (40 revisions)
- Oxygen Plasma System Recipes (41 revisions)
- Lab Rules (42 revisions)
- Research (44 revisions)
- MLA150 - Troubleshooting (44 revisions)
- Dicing Saw (ADT) (46 revisions)
- Maskless Aligner (Heidelberg MLA150) (46 revisions)
- Lab Rules OLD 2018 (47 revisions)
- Autostep 200 Troubleshooting and Recovery (48 revisions)
- PECVD 2 (Advanced Vacuum) (48 revisions)
- Microscopes (48 revisions)
- Nanofab Staff Internal Pages (49 revisions)
- Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP) (49 revisions)
- Stepper 2 (Autostep 200) - Piece vs. Wafer Programming Differences (51 revisions)
- Contact Alignment Recipes (51 revisions)
- Wet Benches (51 revisions)
- Editing Tutorials (52 revisions)
- Direct-Write Lithography Recipes (52 revisions)
- ICP Etch 2 (Panasonic E626I) (55 revisions)
- OLD - PECVD2 Recipes (56 revisions)
- Staff List (57 revisions)
- Test Data of etching SiO2 with CHF3/CF4-ICP1 (58 revisions)
- InP Etch Rate and Selectivity (InP/SiO2) (60 revisions)
- E-Beam Evaporation Recipes (60 revisions)
- Thermal Evaporation Recipes (62 revisions)
- ICP-PECVD (Unaxis VLR) (62 revisions)
- ICP Etch 1 (Panasonic E646V) (63 revisions)
- E-Beam 4 (CHA) (63 revisions)
- PECVD 1 (PlasmaTherm 790) (64 revisions)
- Oxford ICP Etcher - Process Control Data (65 revisions)
- Thermal Evap 2 (Solder) (66 revisions)
- Chemical List - OLD 2018-09-05 (68 revisions)
- E-Beam 3 (Temescal) (68 revisions)
- E-Beam 2 (Custom) (74 revisions)
- Wet Etching Recipes (75 revisions)
- Thermal Evap 1 (76 revisions)
- E-Beam 1 (Sharon) (79 revisions)
- Stepper Recipes (83 revisions)
- Test Data of etching SiO2 with CHF3/CF4 (84 revisions)
- Surface Analysis (KLA/Tencor Surfscan) (89 revisions)
- Stepper 2 (AutoStep 200) (89 revisions)
- Calculators + Utilities (93 revisions)
- Stepper 3 (ASML DUV) (103 revisions)
- PECVD1 Recipes (105 revisions)
- Frequently Asked Questions (107 revisions)
- Stepper 1 (GCA 6300) (111 revisions)
- Wafer scanning process traveler (127 revisions)
- Tool List (185 revisions)
- Dry Etching Recipes (195 revisions)
- Vacuum Deposition Recipes (222 revisions)
- Lithography Recipes (233 revisions)
- ICP Etching Recipes (354 revisions)
- Sputtering Recipes (405 revisions)
- PECVD Recipes (836 revisions)