Difference between revisions of "Surface Analysis (KLA/Tencor Surfscan)"

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*[[Wafer scanning process traveler]]
*[[Wafer scanning process traveler]]

Latest revision as of 15:08, 7 April 2020

Surface Analysis (KLA/Tencor Surfscan)
Tool Type Inspection, Test and Characterization
Location Bay 5
Supervisor Biljana Stamenic
Supervisor Phone (805) 893-4002
Supervisor E-Mail biljana@ece.ucsb.edu
Description Surface Analysis
KLA/Tencor Surfscan 
Manufacturer Tencor


This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches.