Difference between revisions of "Sputtering Recipes"

From UCSB Nanofab Wiki
Jump to navigation Jump to search
Line 7: Line 7:
 
*[[media:19-AlN-Sputtering-Film-Sputter-2.pdf|AlN<sub>x</sub> Deposition Recipe]]
 
*[[media:19-AlN-Sputtering-Film-Sputter-2.pdf|AlN<sub>x</sub> Deposition Recipe]]
 
== Au Deposition (Sputter 2) ==
 
== Au Deposition (Sputter 2) ==
*[[media:|Au Deposition Recipe]]
+
*[[media:21-Au-Sputter-film-recipes-Sputter-2.pdf|Au Deposition Recipe]]
   
 
=[[Sputter 3 (AJA ATC 2000-F)]]=
 
=[[Sputter 3 (AJA ATC 2000-F)]]=

Revision as of 10:38, 10 October 2013

Back to Vacuum Deposition Recipes.

Sputter 1 (Custom)

Sputter 2 (SFI Endeavor)

Al Deposition (Sputter 2)

AlNx Deposition (Sputter 2)

Au Deposition (Sputter 2)

Sputter 3 (AJA ATC 2000-F)

Sputter 4 (AJA ATC 2200-V)

Sputter 5 (Lesker AXXIS)

Ion Beam Deposition (Veeco NEXUS)

IBD Calibrations Spreadsheet - Records of historical film depositions (rates, indices), Uniformity etc.

All users are required to enter their calibration deps (simple test deps only)


SiO2 deposition (IBD)

  • Refractive Index: ≈1.485
  • Rate: ≈6.1nm/min (users must calibrate this prior to critical deps)
  • Stress ≈ -320MPa (compressive)

Si3N4 deposition (IBD)

  • Refractive Index ≈ 2.01
  • Rate ≈ 4.5nm/min (users must calibrate this prior to critical deps)
  • Stress ≈ -1756MPa (compressive)

Ta2O5 deposition (IBD)

  • Refractive Index ≈ 2.10
  • Rate ≈7.8nm/min (users must calibrate this prior to critical deps)
  • Stress ≈ -140MPa (compressive)

TiO2 deposition (IBD)