Lithography Recipes

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Revision as of 22:11, 27 September 2020 by John d (talk | contribs) (→‎Photolithography Recipes: deleted SPR 950-0.8 row)
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General Information

This page contains information and links to recipes/datasheets spin-coated materials used in the facility.

Table of Contents
Photolithography Processes
  • UV Optical Lithography
    • Photo Lithography Recipe section
      • Has links to starting recipes (spin, bake, exposure, develop etc.) for Contact Aligners, Steppers and Maskless Aligner.
      • Substrate, surface materials, pattern size can often affect process parameters. Users may need to run Focus/Exposure Arrays/Matrix (FEA's/FEM's) with these processes to achieve high-resolution.
    • Stocked Lithography Chemical + Datasheets
      • Lists all stocked photolith. chemicals, PRs, strippers, developers, and links to the chemical's application notes/datasheet, which detail the spin curves and nominal processes.
  • Lift-Off Recipes
    • Verified Recipes for lift-off using various photolith. tools
    • General educational description of this technique and it's limitations/considerations.
  • E-beam Lithography
  • Holography
    • For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.
    • Recipes for silicon substrates are provided, and have been translated to other substrates by users.
  • Nanoimprinting Resists

Photolithography Chemicals/Materials

  • Underlayers
    • These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.
    • Datasheets are provided.
  • Anti-Reflection Coatings:
    • The Photoresist Recipes section contains recipes using these materials.
    • Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.
    • Datasheets are provided for reference on use of the materials.
  • Contrast Enhancement Materials (CEM)
    • The Photoresist Recipes section contains recipes using these materials.
    • Used for resolution enhancement. Not for use in contact aligners, typically used on I-Line Steppers.
    • Datasheets provided with usage info.
  • Adhesion Promoters
    • These are used to improve wetting of photoresists to your substrate.
    • Datasheets are provided on use of these materials.

Photolithography Recipes

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.

Photolithography Recipes
Contact Aligner Recipes Stepper Recipes Other
Positive Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
AZ4110 R R A A
AZ4210 R R A A
AZ4330RS R R A A
AZ4620 A
OCG 825-35CS A A A A
SPR 955 CM-0.9 A R R R
SPR 955 CM-1.8 A A R R
SPR 220-3.0 R R R R
SPR 220-7.0 R R R R
UV6-0.8 R
UV210-0.3 R
UV26-2.5 A
Negative Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
AZ5214-EIR R R R R
AZnLOF 2020 R R R R
AZnLOF 2035 A A A A
AZnLOF 2070 A A A A
AZnLOF 5510 A A R R
UVN30-0.8 R
SU-8 2005,2010,2015 A R A A
SU-8 2075 A A A A A
NR9-1000,3000,6000PY R R A R
Anti-Reflection Coatings SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
DS-K101-304 R
SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3

Lift-Off Recipes

E-Beam Lithography Recipes (JEOL JBX-6300FS)

  • Under Development.

FIB Lithography Recipes (Raith Velion)

To Be Added

Automated Coat/Develop System Recipes (S-Cubed Flexi)

Recipes pre-loaded on the S-Cubed Flexi automated coat/bake/develop system. Only staff may write new recipes, contact the tool supervisor for more info.

To Be Added

Nanoimprinting Recipes

Holography Recipes

Low-K Spin-On Dielectric Recipes

Chemicals Stocked + Datasheets

The following is a list of the lithography chemicals we stock in the lab, with links to the datasheets for each. The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.

Positive Photoresists

i-line and broadband


Negative Photoresists

i-line and broadband


E-beam resists
Contrast Enhancement Materials
Anti-Reflection Coatings
Adhesion Promoters
Spin-On Dielectrics

Low-K Spin-On Dielectrics such as Benzocyclobutane and Spin-on Glass

Photoresist Removers