Difference between revisions of "Dicing Saw (ADT)"
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− | {{ |
+ | {{tool2|{{PAGENAME}} |
|picture=ADT.jpg |
|picture=ADT.jpg |
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|type = Packaging |
|type = Packaging |
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− | |super= |
+ | |super= Lee Sawyer |
+ | |super2= Aidan Hopkins |
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|location=Dicing Room: ESB 1147 |
|location=Dicing Room: ESB 1147 |
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|description = ADT Dicing Saw |
|description = ADT Dicing Saw |
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|toolid=49 |
|toolid=49 |
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}} |
}} |
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− | == |
+ | ==About== |
− | The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the [https://wiki.nanotech.ucsb.edu/ |
+ | The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock. |
An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing. |
An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing. |
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Contact the tool supervisor for blades and dicing frames for your group. |
Contact the tool supervisor for blades and dicing frames for your group. |
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− | == |
+ | ==Detailed Specifications== |
+ | *Maximum Wafer Size: 8" |
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+ | *Parts mounted to UV-release tape for cutting |
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− | * [[ADT 7100 - Initial Setup Before Cutting|Setting up the Saw before Cutting]] |
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+ | *Automated cut maps at multiple angles (0° and 90° typical) |
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− | * [[ADT 7100 - Standard Dicing Procedure - Programmed Cut Map|Standard Dicing Procedure - Programmed Cut Map]] |
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+ | *~few micron alignment to on-wafer features. |
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− | * [[ADT 7100 - Standard Dicing Procedure - Single Cuts|Standard Dicing Procedure - Single Cuts]] |
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+ | *Thermocarbon Resnoid dicing blades provided by staff |
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+ | *[https://wiki.nanotech.ucsb.edu/w/images/8/80/ADT_SOP_Rev_F.pdf ADT Dicing Saw Standard Operating Procedure] |
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+ | *[https://wiki.nanotech.ucsb.edu/w/images/0/01/Tape_Station_SOP_Rev_A.pdf Tape Station Standard Operating Procedure] |
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+ | *Recipes > Packaging > '''[[Packaging Recipes#Dicing Saw Recipes .28ADT 7100.29|Dicing Saw Recipes (ADT 7100)]]''' |
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− | * Recipes > Packaging > [https://wiki.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes?venotify=created#Dicing_Saw_Recipes_.28ADT_7100.29 '''Dicing Saw Recipes (ADT 7100)'''] |
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Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting. |
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting. |
Revision as of 11:16, 30 August 2022
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About
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the Dicing Saw Recipes page for the blades we currently stock.
An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.
Contact the tool supervisor for blades and dicing frames for your group.
Detailed Specifications
- Maximum Wafer Size: 8"
- Parts mounted to UV-release tape for cutting
- Automated cut maps at multiple angles (0° and 90° typical)
- ~few micron alignment to on-wafer features.
- Thermocarbon Resnoid dicing blades provided by staff
Operating Procedures
- ADT Dicing Saw Standard Operating Procedure
- Tape Station Standard Operating Procedure
- Recovering an Old Recipe
Recipes
- Recipes > Packaging > Dicing Saw Recipes (ADT 7100)
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.