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• Molecular Vapor Deposition
  |type = Vacuum Deposition |description = Molecular Vapor Deposition System
  1 KB (182 words) - 10:34, 30 August 2022
• PECVD1 Wafer Coating Process
  ...50C in PECVD#1. Instructions bellow explain how to run process (seasoning, deposition, cleaning). === Standard Si3N4 (Silicon-Nitride) Deposition ===
  2 KB (270 words) - 13:16, 10 December 2020
• PECVD1 Wafer Coating Process Traveler
  ===PECVD1 deposition - 300nm SiN film @250°C=== ...easoning, deposition, and cleaning). You can '''ONLY''' change the time in recipes.
  2 KB (325 words) - 16:38, 30 March 2020
• Wafer Coating Process Traveler
  ...C. Instructions bellow explain how to run each of the recipes ( seasoning, deposition, cleaning) === Standard Oxide Deposition ===
  3 KB (416 words) - 16:54, 22 April 2020
• PECVD 2 (Advanced Vacuum)
  |type = Vacuum Deposition *'''Size''': The sample electrode has a 270mm diameter useable area, allowing for multiple 4” wafer depositions in a single run.
  2 KB (284 words) - 10:30, 30 August 2022
• Wafer Coating Process Traveler1
  === '''Unaxis deposition - 300nm SiO2 LDR film @250°C''' === * for seasoning (regular Si wafer ~500nm thick)
  4 KB (711 words) - 13:32, 30 March 2020
• E-Beam 2 (Custom)
  |type = Vacuum Deposition ...p to ~ 5" diameter can be placed into this system for evaporation. Typical deposition rates are several Angstroms/second.
  2 KB (297 words) - 11:31, 25 August 2023
• Unaxis wafer coating procedure
  * Maximum 0.5µm of deposition prior to chamber cleaning, in order to maintain low particle counts. ...Unaxis Recipes''' page]] for thin-film properties of each of the following recipes.
  5 KB (801 words) - 21:29, 12 August 2020
• Wafer Scanning/Coating Process Traveler ( combined/less detailed)
  The wafers for process calibration are ordered from SVM (<nowiki>https://www.svmi.com/</no === Scan Before Deposition ===
  3 KB (515 words) - 13:41, 20 April 2020
• Nick test
  |type = Vacuum Deposition |description = PECVD Plasma Therm 790 For Oxides And Nitrides
  3 KB (387 words) - 22:15, 23 August 2021
• PECVD 1 (PlasmaTherm 790)
  |type = Vacuum Deposition |description = PECVD Plasma Therm 790 For Oxides And Nitrides
  3 KB (388 words) - 10:30, 30 August 2022
• PECVD Recipes
  {{recipes|Vacuum Deposition}} ==SiO₂ deposition (PECVD #1)==
  14 KB (2,130 words) - 10:28, 20 December 2023
• Sputter 4 (AJA ATC 2200-V)
  |type = Vacuum Deposition ...ith very narrow source shutter gaps. Uniformity better than 2% is achieved for various sample heights.
  3 KB (507 words) - 10:37, 30 August 2022
• Ion Beam Deposition (Veeco NEXUS)
  |type = Vacuum Deposition |description = Ion Beam Deposition Tool
  4 KB (522 words) - 11:04, 11 January 2024
• Old Deposition Data - NastaziaM 2021-11-22
  <big>Back to [[Vacuum Deposition Recipes]]</big> ==SiO₂ deposition (PECVD #1)==
  36 KB (5,386 words) - 09:31, 14 December 2021
• Sputter 5 (AJA ATC 2200-V)
  |type = Vacuum Deposition ...variety of materials. The system is recipe driven and computer controlled for reproducible results.
  3 KB (413 words) - 15:50, 16 September 2022
• Deposition Data - temporary 2021-12-15
  <big>Back to [[Vacuum Deposition Recipes]]</big> ==SiO₂ deposition (PECVD #1)==
  17 KB (2,624 words) - 00:07, 16 December 2021
• Atomic Layer Deposition Recipes
  {{recipes|Vacuum Deposition}} =[[Atomic Layer Deposition (Oxford FlexAL)]]=
  7 KB (1,104 words) - 10:27, 15 June 2023
• Old Deposition Data - 2021-12-15
  From [[PECVD Recipes]] page: {{recipes|Vacuum Deposition}}
  31 KB (4,516 words) - 00:18, 16 December 2021
• Sputter 3 (AJA ATC 2000-F)
  |type = Vacuum Deposition ...rces. The sources are contained in tiltable sputter gun modules that allow for maintaining uniformity control at various sample heights. Cross contaminati
  3 KB (479 words) - 10:36, 30 August 2022

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