Difference between revisions of "Wafer Coating Process Traveler"
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There are three standard recipes : STD SiO2, STD Nitride2, and STD LS Nitride2 at 300C. Instructions bellow explain how to run each of the recipes ( seasoning, deposition, cleaning) |
There are three standard recipes : STD SiO2, STD Nitride2, and STD LS Nitride2 at 300C. Instructions bellow explain how to run each of the recipes ( seasoning, deposition, cleaning) |
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− | === |
+ | === Standard Oxide Deposition === |
− | ==== |
+ | ==== STD SiO2 ==== |
#Log in to Advanced PECVD #2 |
#Log in to Advanced PECVD #2 |
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#Seasoning |
#Seasoning |
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#*Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving. |
#*Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving. |
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#*Pump down. |
#*Pump down. |
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− | #*Load the deposition recipe ( |
+ | #*Load the deposition recipe (STD SiO2), and run it. Deposition time is variable. Get the rate from [https://wiki.nanotech.ucsb.edu/wiki/PECVD_Recipes#PECVD_2_.28Advanced_Vacuum.29 historical data]. |
#*Unload the wafer. |
#*Unload the wafer. |
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#Cleaning |
#Cleaning |
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#*Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning. |
#*Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning. |
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#*Log out |
#*Log out |
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− | === |
+ | === Standard Nitride Deposition === |
− | ==== |
+ | ==== STD Nitride2 ==== |
+ | #Log in to Advanced PECVD #2 |
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+ | #Seasoning |
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+ | #*Load the seasoning recipe (STD Nitride2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition. |
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+ | #Deposition |
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+ | #*Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving. |
||
+ | #*Pump down. |
||
+ | #*Load the deposition recipe (STD Nitride2), and run it. Deposition time is variable. Get the rate from [https://wiki.nanotech.ucsb.edu/wiki/PECVD_Recipes#PECVD_2_.28Advanced_Vacuum.29 historical data]. |
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+ | #*Unload the wafer. |
||
+ | #Cleaning |
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+ | #*Wipe sidewall first with DI water, followed by IPA. |
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+ | #*Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning. |
||
+ | #*Log out |
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− | === |
+ | === Standard Low Stress Deposition === |
+ | |||
+ | ==== STD LS Nitride2 ==== |
||
+ | #Log in to Advanced PECVD #2 |
||
+ | #Seasoning |
||
+ | #*Load the seasoning recipe (STD LS Nitride2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition. |
||
+ | #Deposition |
||
+ | #*Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving. |
||
+ | #*Pump down. |
||
+ | #*Load the deposition recipe (STD LS Nitride2), and run it. Deposition time is variable. Get the rate from [https://wiki.nanotech.ucsb.edu/wiki/PECVD_Recipes#PECVD_2_.28Advanced_Vacuum.29 historical data]. |
||
+ | #*Unload the wafer. |
||
+ | #Cleaning |
||
+ | #*Wipe sidewall first with DI water, followed by IPA. |
||
+ | #*Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning. |
||
+ | #*Log out |
||
+ | # |
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− | ==== Standard low stress nitride deposition ==== |
Latest revision as of 16:54, 22 April 2020
There are three standard recipes : STD SiO2, STD Nitride2, and STD LS Nitride2 at 300C. Instructions bellow explain how to run each of the recipes ( seasoning, deposition, cleaning)
Standard Oxide Deposition
STD SiO2
- Log in to Advanced PECVD #2
- Seasoning
- Load the seasoning recipe (STD SiO2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
- Deposition
- Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
- Pump down.
- Load the deposition recipe (STD SiO2), and run it. Deposition time is variable. Get the rate from historical data.
- Unload the wafer.
- Cleaning
- Wipe sidewall first with DI water, followed by IPA.
- Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
- Log out
Standard Nitride Deposition
STD Nitride2
- Log in to Advanced PECVD #2
- Seasoning
- Load the seasoning recipe (STD Nitride2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
- Deposition
- Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
- Pump down.
- Load the deposition recipe (STD Nitride2), and run it. Deposition time is variable. Get the rate from historical data.
- Unload the wafer.
- Cleaning
- Wipe sidewall first with DI water, followed by IPA.
- Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
- Log out
Standard Low Stress Deposition
STD LS Nitride2
- Log in to Advanced PECVD #2
- Seasoning
- Load the seasoning recipe (STD LS Nitride2), and run it. The goal of this step is to coat oxide on chamber walls and prepare it for deposition.
- Deposition
- Vent the chamber and load the substrate (place it in the center of platen). You can place small pieces around the wafer to protect it from moving.
- Pump down.
- Load the deposition recipe (STD LS Nitride2), and run it. Deposition time is variable. Get the rate from historical data.
- Unload the wafer.
- Cleaning
- Wipe sidewall first with DI water, followed by IPA.
- Load the cleaning recipe (CH4/O2 clean). Edit the recipe and enter required time for cleaning.
- Log out