Difference between revisions of "Vacuum Deposition Recipes"

Revision as of 06:29, 17 August 2012

Vacuum Deposition Recipes
	E-Beam Evaporation				Sputtering					Thermal Evaporation		Plasma Enhanced Chemical Vapor Deposition (PECVD)			Atomic Layer Deposition	Ion Beam Deposition (IBD)	Molecular Vapor Deposition
Material	E-Beam 1 (Sharon)	E-Beam 2 (Custom)	E-Beam 3 (Temescal)	E-Beam 4 (CHA)	Sputter 1 (Custom)	Sputter 2 (SFI Endeavor)	Sputter 3 (ATC 2000-F)	Sputter 4 (ATC 2200-V)	Sputter 5 (Lesker AXXIS)	Thermal Evap 1	Thermal Evap 2 (Solder)	PECVD 1 (PlasmaTherm 790)	PECVD 2 (Advanced Vacuum)	Unaxis VLR ICP-PECVD	Atomic Layer Deposition (Tool)	Ion Beam Deposition (Tool)	Molecular Vapor Deposition (Tool)
Ag
Al
Al₂O₃
AlN
Au
B
Co
Cr
Cu
Fe
Ge
Hf
HfO₂
In
Ir
ITO
Mo
Nb
Ni
Pd
Pt
Ru
Si
SiN												Y	Y	Y
SiO₂												Y	Y	Y
SiO_xN_y
Sn
SrF₂
Ta
Ta₂O₅
Ti
TiN
TiO₂
V
W
Zn
ZnO₂
Zr
ZrO₂
Material	E-Beam 1 (Sharon)	E-Beam 2 (Custom)	E-Beam 3 (Temescal)	E-Beam 4 (CHA)	Sputter 1 (Custom)	Sputter 2 (SFI Endeavor)	Sputter 3 (ATC 2000-F)	Sputter 4 (ATC 2200-V)	Sputter 5 (Lesker AXXIS)	Thermal Evap 1	Thermal Evap 2 (Solder)	PECVD 1 (PlasmaTherm 790)	PECVD 2 (Advanced Vacuum)	Unaxis VLR ICP-PECVD	Atomic Layer Deposition (Tool)	Ion Beam Deposition (Tool)	Molecular Vapor Deposition (Tool)

@@ Line 482: / Line 482: @@
 | [[PECVD Recipes#SiN_deposition_.28PECVD_.231.29|Y]]
 | [[PECVD Recipes#SiN_deposition_.28PECVD_.232.29|Y]]
-| [[Unaxis VLR Recipes# SiN_deposition_.28Unaxis VLR_.233.29|Y]]
+| [[PECVD_Recipes#SiN_deposition_.28Unaxis_VLR.29|Y]]
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 |