Difference between revisions of "Thermal Evap 2 (Solder)"

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Line 389: Line 389:
 
|
 
|
 
|-
 
|-
|Tangsten
+
|Tungsten
 
|W
 
|W
 
|19.3
 
|19.3
Line 396: Line 396:
 
|
 
|
 
|-
 
|-
|Tangsten carbide
+
|Tungsten carbide
 
|WC
 
|WC
 
|15.6
 
|15.6
Line 408: Line 408:
 
|0.514
 
|0.514
 
|
 
|
|Used often; Density should be 7.14
+
|Used often
 
|-
 
|-
 
|Zinc Oxide
 
|Zinc Oxide
Line 417: Line 417:
 
|
 
|
 
|-
 
|-
|Zinc Sulphide
+
|Zinc Sulfide
 
|ZnS
 
|ZnS
 
|4.09
 
|4.09
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|0.60
 
|0.60
 
|
 
|
|Should be 6.40
+
|Should be 6.49
 
|-
 
|-
 
|Zirconium Oxide
 
|Zirconium Oxide
 
|ZrO<sub>2</sub>
 
|ZrO<sub>2</sub>
 
|5.6
 
|5.6
 +
|1.001
 
|
 
|
 
|
 
|
|Should be 5.49
 
 
|-
 
|-

Revision as of 15:40, 29 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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