Difference between revisions of "Thermal Evap 2 (Solder)"

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Line 50: Line 50:
 
|1.85
 
|1.85
 
|0.543
 
|0.543
 +
|
 +
|
 +
|-
 +
|Boron
 +
|B
 +
|2.54
 +
|0.389
 +
|
 +
|
 +
|-
 +
|Cadmium
 +
|Cd
 +
|8.64
 +
|0.682
 +
|
 +
|
 +
|-
 +
|Cadmium sulfide
 +
|CdS
 +
|4.83
 +
|1.02
 +
|
 +
|
 +
|-
 +
|Cadmium telluride
 +
|CdTe
 +
|5.85
 +
|0.980
 
|
 
|
 
|
 
|
 
|-
 
|-

Revision as of 16:20, 28 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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