Difference between revisions of "Template:Announcements"

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(PECVD software upgrade)
(EBeam #2 heater repair)
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<!------------- Announcements ---------------->
 
<!------------- Announcements ---------------->
 
===== Ebeam#2: heater repair scheduled =====
  +
We will be performing heater repair on Monday Aug. 18th. System should be ready for use Tuesday.
 
// [[User:John d|John d]] 11:28, 18 August 2018 (PDT)
  +
 
===== PECVD#1: Software Upgrade =====
 
===== PECVD#1: Software Upgrade =====
 
Plasmatherm will be upgrading the system software on September 17th. The upgrade will take 3-5 days. After the upgrade is complete, everyone must be re-certified to use the tool. Please document any custom recipes that you may have, in case they can't be copied over.
 
Plasmatherm will be upgrading the system software on September 17th. The upgrade will take 3-5 days. After the upgrade is complete, everyone must be re-certified to use the tool. Please document any custom recipes that you may have, in case they can't be copied over.
 
// [[User:John d|John d]] 06:38, 15 August 2018 (PDT)
 
// [[User:John d|John d]] 06:38, 15 August 2018 (PDT)
 
===== Ebeam#2: heater inoperable =====
 
The heater is damaged beyond our ability to repair it. We have contacted
 
the vendor and asked for an "expedited" repair if possible.
 
// [[User:John d|John d]] 13:51, 25 July 2018 (PDT)
 
   
 
===== RIE#5: SiCl4 Issue =====
 
===== RIE#5: SiCl4 Issue =====

Revision as of 11:28, 18 August 2018

UCSB NanoFab Announcements

Ebeam#2: heater repair scheduled

We will be performing heater repair on Monday Aug. 18th. System should be ready for use Tuesday. // John d 11:28, 18 August 2018 (PDT)

PECVD#1: Software Upgrade

Plasmatherm will be upgrading the system software on September 17th. The upgrade will take 3-5 days. After the upgrade is complete, everyone must be re-certified to use the tool. Please document any custom recipes that you may have, in case they can't be copied over. // John d 06:38, 15 August 2018 (PDT)

RIE#5: SiCl4 Issue

We have a flow rate problem on the SiCl4 gas line. You can only flow the SiCl4 for 5 minutes and then you have to wait 5 minutes before you flow it again. So in order to to do a 10 minute Etch you will have to do it in three steps flow 5 mi, wait 5mi, then flow 5min. // John d 17:22, 15 June 2018 (PDT)