Template:Announcements

Flip-Chip Bonder, (Finetech) - Update

Finetech will be on-site Monday late morning or early afternoon to work on our system. //Vraj Mehalana 10:35, 3 May 2023 (PDT)

Plasma Activation (EVG 810)

We have received almost all the replacement parts for the tool except the new chuck. The original delivery date of mid June has now been pushed out to early September and they have stated that this is the best that their supplier can do. I will not be installing any new parts on the tool until we have everything.

Runs will still require Staff supervision until then. //Vraj Mehalana 18:01, 2 May 2023 (PDT)

E-Beam #4 (CHA) - EB4 is down

We need to replace a part on the source shutter. We should have it on Monday. I'll update when the tool is available. //Vraj Mehalana 15:26, 28 April 2023 (PDT)

Wafer Coater (S Cubed Flexi) - S3 field service

S3 will be on-site looking into our hand 2 issues on Wednesday May 3rd and 4th. They will be confirming Monday so there is a chance those days get shifted. Please plan your processing accordingly as the system will not be available while they are here looking into the problem. //Vraj Mehalana 13:54, 28 April 2023 (PDT)

FEI SEM#1 Replacement Project

The FEI SEM #1 will be removed and replaced starting Friday March 17th. Both SEMs will be shut down and the SEM room will be off limits beginning at 8 am Friday and return to normal operations Tuesday morning the 21st. //Vraj Mehalana 10:55, 16 March 2023 (PDT)

Unaxis Etch: Down

We had to take the VAT controller off of this module to get the ICP-PECVD running. I have no immediate ETA for this system coming back online. Until we get this system running again you will need to use the Oxford Cobra system. -- Tony // John d 09:35, 13 February 2023 (PST)

Au Plating: UP

only the full 100mm wafer fixture is available at the moment. You can plate smaller pieces on it with no issues. // Vraj Mehalana 12:35, 15 March 2023 (PDT)