Difference between revisions of "Template:Announcements"

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(deleted EB2 upgrade)
(Added RIE3 and Sputter4 Issues)
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We have a flow rate problem on the SiCl4 gas line. You can only flow the SiCl4 for 5 minutes and then you have to wait 5 minutes before you flow it again. So in order to to do a 10 minute Etch you will have to do it in three steps flow 5 mi, wait 5mi, then flow 5min.
 
We have a flow rate problem on the SiCl4 gas line. You can only flow the SiCl4 for 5 minutes and then you have to wait 5 minutes before you flow it again. So in order to to do a 10 minute Etch you will have to do it in three steps flow 5 mi, wait 5mi, then flow 5min.
 
// [[User:John d|John d]] 17:22, 15 June 2018 (PDT)
 
// [[User:John d|John d]] 17:22, 15 June 2018 (PDT)
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  +
===== RIE#3: RF Issue =====
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RF issues on RIE3 power supply. System is being investigated.
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// [[User:Thibeault|Thibeault]] 08:31, 18 September 2018 (PDT)
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===== Sputter#4: TiW gun shorted =====
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Gun will be looked at during next opening this Friday 9/21.
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// [[User:Thibeault|Thibeault]] 08:31, 18 September 2018 (PDT)
   
 
<!---------- end of announcements ------------>
 
<!---------- end of announcements ------------>

Revision as of 08:31, 18 September 2018

UCSB NanoFab Announcements

Gasonics Down

Still troubleshooting, awaiting spare parts. // John d 11:26, 17 September 2018 (PDT)

RIE#5: Software Upgrades

RIE#5 Will be down next week from approximately Monday Sept. 17th to Thursday Sept. 20th, for a software upgrade to the same software running on the other PlasmaTherm tools. All users will need to be retrained after the upgrade is complete. // John d 15:16, 11 September 2018 (PDT)

PECVD#1: Software Upgrade

Plasmatherm will be upgrading the system software on September 17th. The upgrade will take 3-5 days. After the upgrade is complete, everyone must be re-certified to use the tool. Please document any custom recipes that you may have, in case they can't be copied over. // John d 06:38, 15 August 2018 (PDT)

RIE#5: SiCl4 Issue

We have a flow rate problem on the SiCl4 gas line. You can only flow the SiCl4 for 5 minutes and then you have to wait 5 minutes before you flow it again. So in order to to do a 10 minute Etch you will have to do it in three steps flow 5 mi, wait 5mi, then flow 5min. // John d 17:22, 15 June 2018 (PDT)

RIE#3: RF Issue

RF issues on RIE3 power supply. System is being investigated. // Thibeault 08:31, 18 September 2018 (PDT)

Sputter#4: TiW gun shorted

Gun will be looked at during next opening this Friday 9/21. // Thibeault 08:31, 18 September 2018 (PDT)