Difference between revisions of "Template:Announcements"

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(SLR down failed turbo)
(Lab closed, deleted non-urgent announcements)
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<!------------- Announcements ---------------->
 
<!------------- Announcements ---------------->
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===== LAB CLOSED =====
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Due to the fire in the hills above Goleta and brownouts from it, we are closing the nanofab for the night. We will be in tomorrow morning to evaluate the safety of restarting all the tools. Please check email for updates.
 
// [[User:John d|John d]] 22:26, 6 July 2018 (PDT)
   
 
===== PlasmaTherm SLR: Down =====
 
===== PlasmaTherm SLR: Down =====
 
The SLR fluorine etcher is down, the turbo has failed. Will work on it on Monday.
 
The SLR fluorine etcher is down, the turbo has failed. Will work on it on Monday.
 
// [[User:John d|John d]] 22:04, 6 July 2018 (PDT)
 
// [[User:John d|John d]] 22:04, 6 July 2018 (PDT)
 
===== MA-6 Aligner: up =====
 
System up.
 
// [[User:John d|John d]] 22:03, 6 July 2018 (PDT)
 
   
 
===== PECVD#1: Software Upgrade =====
 
===== PECVD#1: Software Upgrade =====
 
We are going to upgrade the computer and software on PECVD#1 in 2–3 weeks. The tool will be down for three to five days. Once the upgrade is complete, everyone will need to be retrained on the new software. You should start planning accordingly, if you use this tool. We will send out an email when we know the exact dates.
 
We are going to upgrade the computer and software on PECVD#1 in 2–3 weeks. The tool will be down for three to five days. Once the upgrade is complete, everyone will need to be retrained on the new software. You should start planning accordingly, if you use this tool. We will send out an email when we know the exact dates.
 
// [[User:John d|John d]] 15:05, 20 June 2018 (PDT)
 
// [[User:John d|John d]] 15:05, 20 June 2018 (PDT)
 
===== AFM: Up =====
 
AFM head has been returned from service, system is up for use. Please notify NanoFab@ece.ucsb.edu if you experience any problems with it.
 
// [[User:John d|John d]] 17:24, 15 June 2018 (PDT)
 
   
 
===== RIE#5: SiCl4 Issue =====
 
===== RIE#5: SiCl4 Issue =====
 
We have a flow rate problem on the SiCl4 gas line. You can only flow the SiCl4 for 5 minutes and then you have to wait 5 minutes before you flow it again. So in order to to do a 10 minute Etch you will have to do it in three steps flow 5 mi, wait 5mi, then flow 5min.
 
We have a flow rate problem on the SiCl4 gas line. You can only flow the SiCl4 for 5 minutes and then you have to wait 5 minutes before you flow it again. So in order to to do a 10 minute Etch you will have to do it in three steps flow 5 mi, wait 5mi, then flow 5min.
 
// [[User:John d|John d]] 17:22, 15 June 2018 (PDT)
 
// [[User:John d|John d]] 17:22, 15 June 2018 (PDT)
 
===== Solvent Bench Bay 7 - Heated Bath =====
 
We have disabled the auto refill due to a high water level. Please use the manual fill and a manual drain button at the center top of the head case. Users of the bath might need to fill or drain as you insert/remove your beakers. Please be careful with other user's beakers.
 
// [[User:John d|John d]] 17:18, 6 June 2018 (PDT)
 
   
 
<!---------- end of announcements ------------>
 
<!---------- end of announcements ------------>

Revision as of 22:26, 6 July 2018

UCSB NanoFab Announcements

LAB CLOSED

Due to the fire in the hills above Goleta and brownouts from it, we are closing the nanofab for the night. We will be in tomorrow morning to evaluate the safety of restarting all the tools. Please check email for updates. // John d 22:26, 6 July 2018 (PDT)

PlasmaTherm SLR: Down

The SLR fluorine etcher is down, the turbo has failed. Will work on it on Monday. // John d 22:04, 6 July 2018 (PDT)

PECVD#1: Software Upgrade

We are going to upgrade the computer and software on PECVD#1 in 2–3 weeks. The tool will be down for three to five days. Once the upgrade is complete, everyone will need to be retrained on the new software. You should start planning accordingly, if you use this tool. We will send out an email when we know the exact dates. // John d 15:05, 20 June 2018 (PDT)

RIE#5: SiCl4 Issue

We have a flow rate problem on the SiCl4 gas line. You can only flow the SiCl4 for 5 minutes and then you have to wait 5 minutes before you flow it again. So in order to to do a 10 minute Etch you will have to do it in three steps flow 5 mi, wait 5mi, then flow 5min. // John d 17:22, 15 June 2018 (PDT)