Difference between revisions of "Template:Announcements"
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// [[User:John d|John d]] 15:05, 15 June 2018 (PDT) |
// [[User:John d|John d]] 15:05, 15 June 2018 (PDT) |
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| − | ===== RIE#5: SiCl4 |
+ | ===== RIE#5: SiCl4 Issue ===== |
| + | We have a flow rate problem on the SiCl4 gas line. You can only flow the SiCl4 for 5 minutes and then you have to wait 5 minutes before you flow it again. So in order to to do a 10 minute Etch you will have to do it in three steps flow 5 mi, wait 5mi, then flow 5min. |
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| − | SiCl4 gas is available again on RIE #5. The maximum flow rate is 10 sccm. |
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| − | // [[User:John d|John d]] |
+ | // [[User:John d|John d]] 17:22, 15 June 2018 (PDT) |
===== AFM Down ===== |
===== AFM Down ===== |
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Revision as of 17:22, 15 June 2018
UCSB NanoFab Announcements
Stepper #2 Up
The service and repair of the Autostep is complete. Please let us know immediately if you have any issues.The system is up and ready for your use. // John d 15:05, 15 June 2018 (PDT)
RIE#5: SiCl4 Issue
We have a flow rate problem on the SiCl4 gas line. You can only flow the SiCl4 for 5 minutes and then you have to wait 5 minutes before you flow it again. So in order to to do a 10 minute Etch you will have to do it in three steps flow 5 mi, wait 5mi, then flow 5min. // John d 17:22, 15 June 2018 (PDT)
AFM Down
The laser/laser focus is struggling on the AFM. We have taken the AFM head to Bruker for a tune-up/repair. The system will be down until some time this week. // John d 16:17, 12 June 2018 (PDT)
Solvent Bench Bay 7 - Heated Bath
We have disabled the auto refill due to a high water level. Please use the manual fill and a manual drain button at the center top of the head case. Users of the bath might need to fill or drain as you insert/remove your beakers. Please be careful with other user's beakers. // John d 17:18, 6 June 2018 (PDT)