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- 11:50, 30 August 2022 diff hist +29 Optical Film Thickness & Wafer-Mapping (Filmetrics F50)
- 11:49, 30 August 2022 diff hist +3 Digital Microscope (Olympus DSX1000) current
- 11:49, 30 August 2022 diff hist +3 Filmetrics F40-UV Microscope-Mounted
- 11:48, 30 August 2022 diff hist +26 Filmetrics F40-UV Microscope-Mounted
- 11:37, 30 August 2022 diff hist +21 Digital Microscope (Olympus DSX1000)
- 11:33, 30 August 2022 diff hist +21 Deep UV Optical Microscope (Olympus)
- 11:22, 30 August 2022 diff hist +25 Flip-Chip Bonder (Finetech) current
- 11:21, 30 August 2022 diff hist +28 Vacuum Sealer current
- 11:16, 30 August 2022 diff hist +24 Dicing Saw (ADT)
- 11:15, 30 August 2022 diff hist +23 Wafer Bonder (Logitech WBS7)
- 11:13, 30 August 2022 diff hist +24 Tube Furnace AlGaAs Oxidation (Lindberg) current
- 11:11, 30 August 2022 diff hist +21 Tube Furnace Wafer Bonding (Thermco)
- 11:10, 30 August 2022 diff hist +21 Rapid Thermal Processor (AET RX6)
- 11:03, 30 August 2022 diff hist +23 Chemical-Mechanical Polisher (Logitech) current
- 11:02, 30 August 2022 diff hist +27 Spin Rinse Dryer (SemiTool) current
- 11:01, 30 August 2022 diff hist +24 Critical Point Dryer
- 11:00, 30 August 2022 diff hist +24 Wet Benches →Plating Bench
- 10:59, 30 August 2022 diff hist +24 Wet Benches →HF/TMAH Processing Bench
- 10:59, 30 August 2022 diff hist +25 Wet Benches →Toxic Corrosive Benches
- 10:58, 30 August 2022 diff hist +24 Wet Benches →Develop Benches