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- 10:48, 30 August 2022 diff hist +24 Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)
- 10:47, 30 August 2022 diff hist +25 Oxford ICP Etcher (PlasmaPro 100 Cobra)
- 10:46, 30 August 2022 diff hist +23 ICP-Etch (Unaxis VLR)
- 10:45, 30 August 2022 diff hist +23 ICP Etch 2 (Panasonic E626I)
- 10:45, 30 August 2022 diff hist +23 ICP Etch 1 (Panasonic E646V)
- 10:44, 30 August 2022 diff hist +24 RIE 5 (PlasmaTherm)
- 10:42, 30 August 2022 diff hist +24 RIE 3 (MRC) current
- 10:41, 30 August 2022 diff hist +24 RIE 2 (MRC)
- 10:39, 30 August 2022 diff hist +24 SEM Sample Coater (Hummer)
- 10:38, 30 August 2022 diff hist +27 Ion Beam Deposition (Veeco NEXUS)
- 10:37, 30 August 2022 diff hist +21 Sputter 5 (AJA ATC 2200-V)
- 10:37, 30 August 2022 diff hist +21 Sputter 4 (AJA ATC 2200-V) current
- 10:36, 30 August 2022 diff hist +21 Sputter 3 (AJA ATC 2000-F) current
- 10:36, 30 August 2022 diff hist +21 Atomic Layer Deposition (Oxford FlexAL)
- 10:34, 30 August 2022 diff hist +24 Molecular Vapor Deposition current
- 10:31, 30 August 2022 diff hist +23 ICP-PECVD (Unaxis VLR)
- 10:30, 30 August 2022 diff hist +27 PECVD 2 (Advanced Vacuum) current
- 10:30, 30 August 2022 diff hist +27 PECVD 1 (PlasmaTherm 790) current
- 10:29, 30 August 2022 diff hist +27 Thermal Evap 2 (Solder) current
- 10:28, 30 August 2022 diff hist +27 Thermal Evap 1 current