Difference between revisions of "Process Group - Process Control Data"

From UCSB Nanofab Wiki
Jump to navigation Jump to search
(New Litho section + Stepper3 ASML section with links to process control data)
m (Litho to Top of page, link to ASML recipes page)
Line 1: Line 1:
 
These are the same links found on individual tool pages, in the '''''Recipes > <<tool page>> > Process Control''''' section.
 
These are the same links found on individual tool pages, in the '''''Recipes > <<tool page>> > Process Control''''' section.
   
 
= Lithography (Process Control Data) =
 
''Process Control Data for Nanofab Lithography/patterning tools.''
  +
  +
== [[Stepper_Recipes#Stepper_3_.28ASML_DUV.29|Stepper #3 (ASML DUV)]] ==
  +
 
*''The Process Group regularly measures data on lithography Critical Dimension ("CD") and Wafer-stage Particulate Contamination for this tool, using a sensitive lithography process that will reveal small changes in Dose repeatability and wafer flatness.''
 
*[https://docs.google.com/spreadsheets/d/1xW1TFH_QjPMWl9T1jiKzwmYe4B2wg7KY-nqOKUoXttI/edit#gid=1804752281 '''Plots of CD Repeatability''']
 
*[https://docs.google.com/spreadsheets/d/1xW1TFH_QjPMWl9T1jiKzwmYe4B2wg7KY-nqOKUoXttI/edit#gid=0 '''Data for CD Uniformity and Particulate Contamination''']
  +
  +
 
<hr style="height:5px">
 
<hr style="height:5px">
 
=Deposition (Process Control Data)=
 
=Deposition (Process Control Data)=
 
''Process Control data for various deposition tools in the lab.''
 
''Process Control data for various deposition tools in the lab.''
Line 87: Line 99:
   
 
*[[Oxford ICP Etcher - Process Control Data|InP Ridge Etch with Cl2/CH4/H2 @ 60°C]] - ''No data prior to 2023-01-20''
 
*[[Oxford ICP Etcher - Process Control Data|InP Ridge Etch with Cl2/CH4/H2 @ 60°C]] - ''No data prior to 2023-01-20''
 
= Lithography (Process Control Data) =
 
''Process Control Data for Nanofab Lithography/patterning tools.''
 
 
 
<hr style="height:5px">
 
<hr style="height:5px">
 
== Stepper #3 - ASML DUV ==
 
 
*''The Process Group regularly measures data on lithography Critical Dimension ("CD") and Wafer-stage Particulate Contamination for this tool, using a sensitive lithography process that will reveal small changes in Dose repeatability and wafer flatness.''
 
*[https://docs.google.com/spreadsheets/d/1xW1TFH_QjPMWl9T1jiKzwmYe4B2wg7KY-nqOKUoXttI/edit#gid=1804752281 '''Plots of CD Repeatability''']
 
*[https://docs.google.com/spreadsheets/d/1xW1TFH_QjPMWl9T1jiKzwmYe4B2wg7KY-nqOKUoXttI/edit#gid=0 '''Data for CD Uniformity and Particulate Contamination''']
 

Revision as of 14:07, 10 March 2023

These are the same links found on individual tool pages, in the Recipes > <<tool page>> > Process Control section.

Lithography (Process Control Data)

Process Control Data for Nanofab Lithography/patterning tools.

Stepper #3 (ASML DUV)




Deposition (Process Control Data)

Process Control data for various deposition tools in the lab.

PECVD #1 (PlasmaTherm 790)

PECVD #2 (Advanced Vacuum)

ICP-PECVD (Unaxis VLR Dep)

Ion Beam Sputter Deposition (Veeco Nexus)

Old Data (Pre 2022)

Old data in a different format can be found below:




Etching (Process Control Data)

Process Control data for various dry etching tools in the lab.

PlasmaTherm SLR Fluorine Etcher

OLD Process Control Data

Panasonic ICP #1

Old Process Control Data

Panasonic ICP#2

Old Process Control Data

Unaxis VLR Etch

Oxford PlasmaPro Cobra Etcher

Calibration / Process testing data taken using the "InP Ridge Etch" process: Cl2/CH4/H2 @ 60°C, 1cm piece with ~50% SiO2 hardmask.

Old Process Control Data