Difference between revisions of "Plasma Activation (EVG 810)"

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Revision as of 05:40, 11 July 2012

Plasma Activation (EVG 810)
EVG.jpg
Tool Type Dry Etch
Location Bay 7
Supervisor Aidan Hopkins
Supervisor Phone (805) 893-2343
Supervisor E-Mail hopkins@ece.ucsb.edu
Description Plasma Surface Activation
Manufacturer EVG Group
Dry Etch Recipes


About

This a capacitively coupled Oxygen plasma activation system used exclusively for the surface activation of clean surfaces prior to wafer bonding. This technique allows bonding temperatures to be lowered and is used as a companion tool to the Karl-Suss SB6 wafer bond tool.

Detailed Specifications

  • Gases used: O2 and N2
  • Sample size: pieces to 6” wafer