Difference between revisions of "Mike Silva"

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|position  = Senior Development Engineer
 
|position  = Senior Development Engineer
 
|room = 1109B
 
|room = 1109B
|phone = (805) 839-3918x219
+
|phone = (805) 839-3096
|cell = (805) 245-9356
+
|cell = (805) 450-2263
 
|email = silva@ece.ucsb.edu
 
|email = silva@ece.ucsb.edu
 
}}
 
}}
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|-valign="top"
 
|-valign="top"
 
|
 
|
*[[DUV Flood Expose]]
 
 
*[[High Temp Oven (Blue M)]]
 
*[[High Temp Oven (Blue M)]]
*[[Sputter 5 (Lesker AXXIS)]]
+
*[[Sputter 5 (Lesker AXXIS)]]  
*[[PECVD 2 (Advanced Vacuum)]]
 
*[[Thermal Evap 1]]  
 
 
*[[Ion Beam Deposition (Veeco NEXUS)]]  
 
*[[Ion Beam Deposition (Veeco NEXUS)]]  
 
*[[ICP Etch 2 (Panasonic E640)]]  
 
*[[ICP Etch 2 (Panasonic E640)]]  
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*[[HF Vapor Etch]]
 
*[[HF Vapor Etch]]
 
* [[Tube Furnace Wafer Bonding (Thermco)]]
 
* [[Tube Furnace Wafer Bonding (Thermco)]]
* [[Step Profile (Dektak IIA)]]
 
 
* [[Step Profilometer (Dektak 6M)]]
 
* [[Step Profilometer (Dektak 6M)]]
* [[Ellipsometer (Rudolph)]]
 
 
* [[Film Stress (Tencor Flexus)]]
 
* [[Film Stress (Tencor Flexus)]]
 
* [[Optical Film Thickness (Nanometric)]]
 
* [[Optical Film Thickness (Nanometric)]]
 
|}
 
|}

Revision as of 09:43, 25 April 2019

Mike Silva
Position Senior Development Engineer
Room Number 1109B
Phone (805) 839-3096
Cell (805) 450-2263
E-Mail silva@ece.ucsb.edu


About

Information to come.

Current Work

Information to come.

Tools

Mike Silva is in charge of the following tools: