Difference between revisions of "Chemical-Mechanical Polisher (Logitech)"
Jump to navigation
Jump to search
(link to Logitech Bonder) |
|||
| (4 intermediate revisions by one other user not shown) | |||
| Line 1: | Line 1: | ||
| − | {{ |
+ | {{tool2|{{PAGENAME}} |
|picture=CMP.jpg |
|picture=CMP.jpg |
||
|type = Dry Etch |
|type = Dry Etch |
||
|super= Bill Millerski |
|super= Bill Millerski |
||
| + | |super2= Don Freeborn |
||
|phone=(805)839-3918x216 |
|phone=(805)839-3918x216 |
||
|location=Bay 5 |
|location=Bay 5 |
||
| Line 17: | Line 18: | ||
Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications. |
Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications. |
||
| + | |||
| + | =[[Instructions]]= |
||
| + | https://wiki.nanotech.ucsb.edu/w/images/c/c0/CMP.pdf |
||
Latest revision as of 11:03, 30 August 2022
| ||||||||||||||||||||||||||||||
About
The Logitech Orbis system is used in the facility for fine-scale polishing and planarization of a variety of materials including glass, silicon, GaAs, InP, GaN, etc. Wafers up to 6” diameter can be polished on the system.
Several slurries and pads are available to provide a range of polishing options depending on the material being processed. Pieces can also be handled on the system by wax-mounting with the Logitech Bonder.
Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications.