Difference between revisions of "Surface Analysis (KLA/Tencor Surfscan)"
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Revision as of 23:37, 5 June 2023
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About
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches.
Documentation
- Standard Operating Procedure
- Operations Manual
- For detailed measurement info, it is highly recommended that you read the manual.
- Wafer scanning process traveler
- Glossary
- Errors
Examples
Gain 4: Small Particles
(0.160µm – 1.60µm) |
Gain 2: Large Particles
(1.60µm – 28.0µm) |
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Gain 4: Small Particles
(0.160µm – 1.60µm) |
Gain 2: Large Particles
(1.60µm – 28.0µm) |
---|---|