Difference between revisions of "Stepper 3 (ASML DUV)"

From UCSB Nanofab Wiki
Jump to: navigation, search
(Created page with "{{tool|{{PAGENAME}} |picture=ASML.jpg |type = Vacuum Deposition |super= Adam Abrahamsen |phone=(805)839-3918x213 |location=Bay 3 |email=abrahamsen@ece.ucsb.edu |description = ASM…")
 
Line 1: Line 1:
 
{{tool|{{PAGENAME}}
 
{{tool|{{PAGENAME}}
 
|picture=ASML.jpg
 
|picture=ASML.jpg
|type = Vacuum Deposition
+
|type = Lithography
 
|super= Adam Abrahamsen
 
|super= Adam Abrahamsen
 
|phone=(805)839-3918x213
 
|phone=(805)839-3918x213

Revision as of 16:52, 27 June 2012

Stepper 3 (ASML DUV)
ASML.jpg
Tool Type Lithography
Location Bay 3
Description ASML PAS S500/300 DUV Stepper
Manufacturer ASML



About

The ASML DUV stepper is a 248nm line stepper for imaging dense features down to below 200nm and isolated line structures down to below 150nm. The system is a variable NA system and has a field image size of 21 x 21mm for 0.63 NA and a field size of 22mm x 27mm for 0.4 to 0.57NA. Overlay accuracy is better than 30nm. The system is configured for 4” wafers and pieces down to 14mm in size can be exposed using a 4” wafer as a carrier.

See Also