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- |description = Vapor HF Etcher ...Si carrier wafer) up to an 8<sup>"</sup> wafer. There are 5 standard etch recipes installed in the tool with the SiO<sub>2</sub> undercut-etch-rate from low1 KB (240 words) - 10:53, 30 August 2022
- |description = Vapor HF Etcher ...Si carrier wafer) up to an 8<sup>"</sup> wafer. There are 5 standard etch recipes installed in the tool with the SiO<sub>2</sub> etch rate from low to high.1 KB (221 words) - 15:51, 31 January 2014
- {{recipes|Dry Etching}} =[[Vapor HF Etch (uETCH)]]=1 KB (178 words) - 08:17, 9 December 2022
- ===<u>[[Process Group - Process Control Data#Etching .28Process Control Data.29|Process Control Data]]</u>=== <small>''See [[Process Group - Process Control Data#Etching .28Process Control Data.29|linked page]] for [https://en.wikipedia.org/wiki14 KB (1,875 words) - 15:31, 7 February 2024
- {{recipes|Vacuum Deposition}} =Vapor Pressure Chart and Materials Deposition Table=8 KB (959 words) - 11:59, 25 October 2022
- #**''Starting recipes (spin, bake, exposure, develop etc.) for all photolith. tools.'' #**[[Contact Alignment Recipes|<u>Contact Aligner Recipes</u>]]23 KB (3,169 words) - 21:43, 16 February 2023