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! bgcolor="#D0E7FF" align="center" colspan="2" | '''[[Contact Alignment Recipes|Contact Aligners]]''' ! bgcolor="#D0E7FF" align="center" colspan="3" | '''[[Stepper Recipes|Steppers]]'''

...a is holding trainings on tools: GCA 6300 Stepper#1, Autostep 200 Stepper#2, MLA Heidelberg and Surfscan 6200. Biljana is available for help and suppor *[[Stepper_1_(GCA_6300)|Stepper 1 (GCA 6300)]]

*[[ProcessGroup: ASML Stepper 3: Dicing Alignment Guides|ASML Stepper #3: Dicing Alignment Guides]] *[[ProcessGroup: ICP|ICP#1/2: SiO2 Etch Verification Procedure]]

* [[Stepper 1 (GCA 6300)]] * [[Stepper 2 (AutoStep 200)]]

|description = GCA 200 I-Line Wafer Stepper |manufacturer = GCA

...SiO2]] hardmask, patterned on [[Stepper 1 (GCA 6300)|Stepper #2 (AutoStep 200)]] & [[ICP Etch 1 (Panasonic E626I)|Panasonic ICP #1]] ...ch''': 200°C, 1.4mT, 800W/125W, Cl₂=6.3, H₂=12.7, Ar=2.0 sccm, time=1min30sec (90sec)

...SiO2]] hardmask, patterned on [[Stepper 1 (GCA 6300)|Stepper #2 (AutoStep 200)]] & [[ICP Etch 1 (Panasonic E626I)|Panasonic ICP #1]] ...wafer “dummy” pieces, surrounding 1x1cm patterned sample, ~30-40% SiO₂ masking (NingC's pattern). Silicon carrier, no adhesive.

Below is a listing of stepper lithography recipes. ...Stepper 2 are i-line systems with good piece handling capabilities.  Stepper 3 is a DUV (248nm) system primarily used for full 100mm wafers.  DUV r

*[[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]] *[[Stepper 2 (AutoStep 200)|Stepper 2 (AutoStep 200, i-line)]]

#**[[Stepper Recipes|<u>Stepper Recipes</u>]] #***[[Stepper Recipes#Stepper 1 .28GCA 6300.29|Stepper #1: GCA 6300]] (I-Line)