Wafer Bonder (Logitech WBS7)

From UCSB Nanofab Wiki

Revision as of 15:17, 22 August 2018 by John d (talk | contribs) (initial page, copied source from existing page)

(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)

Jump to navigation Jump to search

Wafer Bonder (Logitech WBS7)

Tool Type	Thermal Processing
Location	Bay 5
Supervisor	Don Freeborn
Supervisor Phone	(805) 893-7975
Supervisor E-Mail	dfreeborn@ece.ucsb.edu

Description	Wafer Bonder WSB7
Manufacturer	Logitech

About

Detailed Specifications

Operation Procedures

Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Wafer_Bonder_(Logitech_WBS7)&oldid=155412"